JP7061012B2 - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
JP7061012B2
JP7061012B2 JP2018088291A JP2018088291A JP7061012B2 JP 7061012 B2 JP7061012 B2 JP 7061012B2 JP 2018088291 A JP2018088291 A JP 2018088291A JP 2018088291 A JP2018088291 A JP 2018088291A JP 7061012 B2 JP7061012 B2 JP 7061012B2
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JP
Japan
Prior art keywords
wafer
unit
cassette
frame
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018088291A
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English (en)
Japanese (ja)
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JP2019195015A (ja
Inventor
毅 北浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018088291A priority Critical patent/JP7061012B2/ja
Priority to CN201910342624.4A priority patent/CN110429043B/zh
Priority to KR1020190049823A priority patent/KR102633607B1/ko
Priority to TW108115072A priority patent/TWI785238B/zh
Publication of JP2019195015A publication Critical patent/JP2019195015A/ja
Application granted granted Critical
Publication of JP7061012B2 publication Critical patent/JP7061012B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2018088291A 2018-05-01 2018-05-01 加工装置 Active JP7061012B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018088291A JP7061012B2 (ja) 2018-05-01 2018-05-01 加工装置
CN201910342624.4A CN110429043B (zh) 2018-05-01 2019-04-26 加工装置
KR1020190049823A KR102633607B1 (ko) 2018-05-01 2019-04-29 가공 장치
TW108115072A TWI785238B (zh) 2018-05-01 2019-04-30 加工裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018088291A JP7061012B2 (ja) 2018-05-01 2018-05-01 加工装置

Publications (2)

Publication Number Publication Date
JP2019195015A JP2019195015A (ja) 2019-11-07
JP7061012B2 true JP7061012B2 (ja) 2022-04-27

Family

ID=68408413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018088291A Active JP7061012B2 (ja) 2018-05-01 2018-05-01 加工装置

Country Status (4)

Country Link
JP (1) JP7061012B2 (ko)
KR (1) KR102633607B1 (ko)
CN (1) CN110429043B (ko)
TW (1) TWI785238B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110224052B (zh) * 2019-05-28 2024-02-06 深圳新益昌科技股份有限公司 一种led固晶的双摆臂固晶装置及其固晶方法
JP7479244B2 (ja) 2020-08-18 2024-05-08 株式会社ディスコ 加工装置
CN112509960B (zh) * 2020-11-09 2024-04-09 太极半导体（苏州）有限公司 一种3d晶圆环切后的定位方法
CN112658476B (zh) * 2021-01-11 2023-03-24 宿迁学院 一种板式激光切割机工作台自动化清理装置
CN115148651B (zh) * 2022-08-01 2023-05-02 弥费科技(上海)股份有限公司 晶圆盒交换传输设备及其驱动装置、存储库

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163253A (ja) 2001-11-28 2003-06-06 Disco Abrasive Syst Ltd 切削装置
JP2005045134A (ja) 2003-07-25 2005-02-17 Disco Abrasive Syst Ltd 半導体ウエーハの加工装置
JP2009105109A (ja) 2007-10-22 2009-05-14 Disco Abrasive Syst Ltd ワーク収納搬送装置及び該ワーク収納搬送装置を備えた切削装置
JP2014060224A (ja) 2012-09-14 2014-04-03 Disco Abrasive Syst Ltd 加工装置
JP2015119003A (ja) 2013-12-17 2015-06-25 株式会社ディスコ 加工装置
JP2015170719A (ja) 2014-03-06 2015-09-28 株式会社ディスコ 板状物の搬送装置および切削装置
JP2015228403A (ja) 2014-05-30 2015-12-17 株式会社ディスコ 加工装置
JP2016152394A (ja) 2015-02-19 2016-08-22 株式会社ディスコ 加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263518A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置
JP4303041B2 (ja) * 2003-06-18 2009-07-29 株式会社ディスコ 半導体ウエーハの加工装置
JPWO2006025386A1 (ja) * 2004-08-31 2008-05-08 株式会社ニコン 位置合わせ方法、処理システム、基板の投入再現性計測方法、位置計測方法、露光方法、基板処理装置、計測方法及び計測装置
JP4918537B2 (ja) * 2008-12-11 2012-04-18 日東電工株式会社 半導体ウエハの保護テープ剥離方法および保護テープ剥離装置
JP5582152B2 (ja) * 2012-02-03 2014-09-03 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
JP5959216B2 (ja) * 2012-02-06 2016-08-02 日東電工株式会社 基板搬送方法および基板搬送装置
JP6202962B2 (ja) * 2013-09-20 2017-09-27 株式会社ディスコ 切削装置
KR101682468B1 (ko) * 2015-11-13 2016-12-05 주식회사 이오테크닉스 웨이퍼 정렬방법 및 이를 이용한 정렬장비
JP6672053B2 (ja) * 2016-04-18 2020-03-25 株式会社ディスコ ウェーハの加工方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163253A (ja) 2001-11-28 2003-06-06 Disco Abrasive Syst Ltd 切削装置
JP2005045134A (ja) 2003-07-25 2005-02-17 Disco Abrasive Syst Ltd 半導体ウエーハの加工装置
JP2009105109A (ja) 2007-10-22 2009-05-14 Disco Abrasive Syst Ltd ワーク収納搬送装置及び該ワーク収納搬送装置を備えた切削装置
JP2014060224A (ja) 2012-09-14 2014-04-03 Disco Abrasive Syst Ltd 加工装置
JP2015119003A (ja) 2013-12-17 2015-06-25 株式会社ディスコ 加工装置
JP2015170719A (ja) 2014-03-06 2015-09-28 株式会社ディスコ 板状物の搬送装置および切削装置
JP2015228403A (ja) 2014-05-30 2015-12-17 株式会社ディスコ 加工装置
JP2016152394A (ja) 2015-02-19 2016-08-22 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
TWI785238B (zh) 2022-12-01
TW201946216A (zh) 2019-12-01
JP2019195015A (ja) 2019-11-07
KR20190126248A (ko) 2019-11-11
CN110429043A (zh) 2019-11-08
KR102633607B1 (ko) 2024-02-05
CN110429043B (zh) 2024-02-20

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