JP7055282B2 - 有機電子素子の封止方法 - Google Patents

有機電子素子の封止方法 Download PDF

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Publication number
JP7055282B2
JP7055282B2 JP2020517975A JP2020517975A JP7055282B2 JP 7055282 B2 JP7055282 B2 JP 7055282B2 JP 2020517975 A JP2020517975 A JP 2020517975A JP 2020517975 A JP2020517975 A JP 2020517975A JP 7055282 B2 JP7055282 B2 JP 7055282B2
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ink composition
organic electronic
electronic device
sealing
weight
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Japanese (ja)
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JP2020535615A (ja
Inventor
クク・ヒョン・チェ
ジュン・ヒョン・キム
ユ・ジン・ウ
ミ・イム・ユ
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LG Chem Ltd
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LG Chem Ltd
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Priority to JP2022010977A priority Critical patent/JP2022048249A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Photovoltaic Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020517975A 2017-09-29 2018-10-01 有機電子素子の封止方法 Active JP7055282B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022010977A JP2022048249A (ja) 2017-09-29 2022-01-27 有機電子素子の封止方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0127801 2017-09-29
KR20170127801 2017-09-29
PCT/KR2018/011618 WO2019066605A1 (ko) 2017-09-29 2018-10-01 유기전자소자의 봉지 방법

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JP2022010977A Division JP2022048249A (ja) 2017-09-29 2022-01-27 有機電子素子の封止方法

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JP2020535615A JP2020535615A (ja) 2020-12-03
JP7055282B2 true JP7055282B2 (ja) 2022-04-18

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JP2022010977A Pending JP2022048249A (ja) 2017-09-29 2022-01-27 有機電子素子の封止方法

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US (1) US12096648B2 (enExample)
EP (1) EP3683854B1 (enExample)
JP (2) JP7055282B2 (enExample)
KR (1) KR102126702B1 (enExample)
CN (1) CN111164779B (enExample)
TW (1) TWI800534B (enExample)
WO (1) WO2019066605A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022048249A (ja) * 2017-09-29 2022-03-25 エルジー・ケム・リミテッド 有機電子素子の封止方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111162202A (zh) * 2018-11-08 2020-05-15 陕西坤同半导体科技有限公司 改善薄膜封装有机薄膜层平坦度的方法及装置
TWI884400B (zh) * 2021-12-01 2025-05-21 南韓商Ｌｇ化學股份有限公司 製造封裝膜之方法、包含封裝膜之有機電子元件、及製造有機電子裝置之方法

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JP2003260389A (ja) 2002-03-12 2003-09-16 Seiko Epson Corp 薄膜形成装置と薄膜形成方法、およびデバイス製造装置とデバイス製造方法並びにデバイス
JP2004064007A (ja) 2002-07-31 2004-02-26 Tokyo Electron Ltd 基板処理装置及び基板処理方法
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JP2004327272A (ja) 2003-04-25 2004-11-18 Semiconductor Energy Lab Co Ltd 製造装置および発光装置
JP2005131497A (ja) 2003-10-29 2005-05-26 Seiko Epson Corp 製膜方法、製膜装置、デバイス製造方法、デバイス製造装置及びデバイス並びに電子機器
JP2008059945A (ja) 2006-08-31 2008-03-13 Nagase Chemtex Corp 電子デバイスの製造方法
WO2011040211A1 (ja) 2009-09-30 2011-04-07 Jsr株式会社 有機ｅｌ素子、有機ｅｌ表示装置、有機ｅｌ照明装置及びシール剤用硬化性組成物
JP2013050672A (ja) 2011-08-31 2013-03-14 Fujifilm Corp 感光性樹脂組成物、硬化膜、硬化膜の形成方法、有機ｅｌ表示装置、及び、液晶表示装置
WO2014017524A1 (ja) 2012-07-26 2014-01-30 電気化学工業株式会社 樹脂組成物

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Publication number Priority date Publication date Assignee Title
JP2003139934A (ja) 2001-11-02 2003-05-14 Seiko Epson Corp 基板のパターン製造方法及び製造装置、カラーフィルタの製造方法及び製造装置、並びに電界発光装置の製造方法及び製造装置
JP2003260389A (ja) 2002-03-12 2003-09-16 Seiko Epson Corp 薄膜形成装置と薄膜形成方法、およびデバイス製造装置とデバイス製造方法並びにデバイス
JP2004064007A (ja) 2002-07-31 2004-02-26 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2004103496A (ja) 2002-09-12 2004-04-02 Seiko Epson Corp 成膜方法、成膜装置、光学素子、有機エレクトロルミネッセンス素子、半導体素子および電子機器
JP2004327272A (ja) 2003-04-25 2004-11-18 Semiconductor Energy Lab Co Ltd 製造装置および発光装置
JP2005131497A (ja) 2003-10-29 2005-05-26 Seiko Epson Corp 製膜方法、製膜装置、デバイス製造方法、デバイス製造装置及びデバイス並びに電子機器
JP2008059945A (ja) 2006-08-31 2008-03-13 Nagase Chemtex Corp 電子デバイスの製造方法
WO2011040211A1 (ja) 2009-09-30 2011-04-07 Jsr株式会社 有機ｅｌ素子、有機ｅｌ表示装置、有機ｅｌ照明装置及びシール剤用硬化性組成物
JP2013050672A (ja) 2011-08-31 2013-03-14 Fujifilm Corp 感光性樹脂組成物、硬化膜、硬化膜の形成方法、有機ｅｌ表示装置、及び、液晶表示装置
WO2014017524A1 (ja) 2012-07-26 2014-01-30 電気化学工業株式会社 樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022048249A (ja) * 2017-09-29 2022-03-25 エルジー・ケム・リミテッド 有機電子素子の封止方法

Also Published As

Publication number Publication date
EP3683854B1 (en) 2024-11-27
CN111164779B (zh) 2022-12-02
TW201931636A (zh) 2019-08-01
WO2019066605A1 (ko) 2019-04-04
US20200280022A1 (en) 2020-09-03
EP3683854A1 (en) 2020-07-22
CN111164779A (zh) 2020-05-15
KR20190038455A (ko) 2019-04-08
US12096648B2 (en) 2024-09-17
JP2022048249A (ja) 2022-03-25
EP3683854A4 (en) 2020-10-28
TWI800534B (zh) 2023-05-01
KR102126702B1 (ko) 2020-06-25
JP2020535615A (ja) 2020-12-03

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