TWI800534B - 用於封裝有機電子元件之方法 - Google Patents

用於封裝有機電子元件之方法 Download PDF

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Publication number
TWI800534B
TWI800534B TW107134698A TW107134698A TWI800534B TW I800534 B TWI800534 B TW I800534B TW 107134698 A TW107134698 A TW 107134698A TW 107134698 A TW107134698 A TW 107134698A TW I800534 B TWI800534 B TW I800534B
Authority
TW
Taiwan
Prior art keywords
electronic element
organic electronic
encapsulating organic
encapsulating
organic
Prior art date
Application number
TW107134698A
Other languages
English (en)
Chinese (zh)
Other versions
TW201931636A (zh
Inventor
崔國鉉
金俊衡
禹儒真
俞美林
Original Assignee
南韓商Ｌｇ化學股份有限公司
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Publication date
Application filed by 南韓商Ｌｇ化學股份有限公司 filed Critical 南韓商Ｌｇ化學股份有限公司
Publication of TW201931636A publication Critical patent/TW201931636A/zh
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Publication of TWI800534B publication Critical patent/TWI800534B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Photovoltaic Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW107134698A 2017-09-29 2018-10-01 用於封裝有機電子元件之方法 TWI800534B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0127801 2017-09-29
KR20170127801 2017-09-29

Publications (2)

Publication Number Publication Date
TW201931636A TW201931636A (zh) 2019-08-01
TWI800534B true TWI800534B (zh) 2023-05-01

Family

ID=65901869

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107134698A TWI800534B (zh) 2017-09-29 2018-10-01 用於封裝有機電子元件之方法

Country Status (7)

Country Link
US (1) US12096648B2 (enExample)
EP (1) EP3683854B1 (enExample)
JP (2) JP7055282B2 (enExample)
KR (1) KR102126702B1 (enExample)
CN (1) CN111164779B (enExample)
TW (1) TWI800534B (enExample)
WO (1) WO2019066605A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3683854B1 (en) * 2017-09-29 2024-11-27 LG Chem, Ltd. Method for encapsulating organic electronic element
CN111162202A (zh) * 2018-11-08 2020-05-15 陕西坤同半导体科技有限公司 改善薄膜封装有机薄膜层平坦度的方法及装置
TWI884400B (zh) * 2021-12-01 2025-05-21 南韓商Ｌｇ化學股份有限公司 製造封裝膜之方法、包含封裝膜之有機電子元件、及製造有機電子裝置之方法

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JP2004064007A (ja) * 2002-07-31 2004-02-26 Tokyo Electron Ltd 基板処理装置及び基板処理方法
CN1550568A (zh) * 2003-04-25 2004-12-01 ��ʽ����뵼����Դ�о��� 制造装置和发光装置
JP2013140727A (ja) * 2012-01-05 2013-07-18 Konica Minolta Inc 有機エレクトロルミネッセンス素子の製造方法
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CN108602346B (zh) * 2015-12-07 2020-04-07 科迪华公司 用于以改进的均匀性和打印速度制造薄膜的技术
EP3683854B1 (en) * 2017-09-29 2024-11-27 LG Chem, Ltd. Method for encapsulating organic electronic element
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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017252A (ja) * 2001-06-29 2003-01-17 Toshiba Corp 有機エレクトロ・ルミネッセンス表示素子の製造方法
JP2003136711A (ja) * 2001-11-02 2003-05-14 Seiko Epson Corp インクジェットヘッド及びその製造方法並びにインクジェット記録装置及びその製造方法、カラーフィルタの製造装置及びその製造方法、並びに電界発光基板製造装置及びその製造方法
JP2003139934A (ja) * 2001-11-02 2003-05-14 Seiko Epson Corp 基板のパターン製造方法及び製造装置、カラーフィルタの製造方法及び製造装置、並びに電界発光装置の製造方法及び製造装置
JP2004064007A (ja) * 2002-07-31 2004-02-26 Tokyo Electron Ltd 基板処理装置及び基板処理方法
CN1550568A (zh) * 2003-04-25 2004-12-01 ��ʽ����뵼����Դ�о��� 制造装置和发光装置
JP2013140727A (ja) * 2012-01-05 2013-07-18 Konica Minolta Inc 有機エレクトロルミネッセンス素子の製造方法
KR20150123161A (ko) * 2014-04-23 2015-11-03 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치

Also Published As

Publication number Publication date
EP3683854B1 (en) 2024-11-27
CN111164779B (zh) 2022-12-02
TW201931636A (zh) 2019-08-01
WO2019066605A1 (ko) 2019-04-04
US20200280022A1 (en) 2020-09-03
EP3683854A1 (en) 2020-07-22
CN111164779A (zh) 2020-05-15
KR20190038455A (ko) 2019-04-08
JP7055282B2 (ja) 2022-04-18
US12096648B2 (en) 2024-09-17
JP2022048249A (ja) 2022-03-25
EP3683854A4 (en) 2020-10-28
KR102126702B1 (ko) 2020-06-25
JP2020535615A (ja) 2020-12-03

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