KR102126702B1 - 유기전자소자의 봉지 방법 - Google Patents

유기전자소자의 봉지 방법 Download PDF

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Publication number
KR102126702B1
KR102126702B1 KR1020180116781A KR20180116781A KR102126702B1 KR 102126702 B1 KR102126702 B1 KR 102126702B1 KR 1020180116781 A KR1020180116781 A KR 1020180116781A KR 20180116781 A KR20180116781 A KR 20180116781A KR 102126702 B1 KR102126702 B1 KR 102126702B1
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South Korea
Prior art keywords
ink composition
electronic device
organic electronic
present application
applying
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KR1020180116781A
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English (en)
Korean (ko)
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KR20190038455A (ko
Inventor
최국현
김준형
우유진
유미림
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주식회사 엘지화학
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Publication of KR20190038455A publication Critical patent/KR20190038455A/ko
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    • H01L51/5237—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H01L51/0005—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Photovoltaic Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020180116781A 2017-09-29 2018-10-01 유기전자소자의 봉지 방법 Active KR102126702B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170127801 2017-09-29
KR20170127801 2017-09-29

Publications (2)

Publication Number Publication Date
KR20190038455A KR20190038455A (ko) 2019-04-08
KR102126702B1 true KR102126702B1 (ko) 2020-06-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180116781A Active KR102126702B1 (ko) 2017-09-29 2018-10-01 유기전자소자의 봉지 방법

Country Status (7)

Country Link
US (1) US12096648B2 (enExample)
EP (1) EP3683854B1 (enExample)
JP (2) JP7055282B2 (enExample)
KR (1) KR102126702B1 (enExample)
CN (1) CN111164779B (enExample)
TW (1) TWI800534B (enExample)
WO (1) WO2019066605A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023101482A1 (ko) * 2021-12-01 2023-06-08 주식회사 엘지화학 봉지 필름의 제조 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3683854B1 (en) * 2017-09-29 2024-11-27 LG Chem, Ltd. Method for encapsulating organic electronic element
CN111162202A (zh) * 2018-11-08 2020-05-15 陕西坤同半导体科技有限公司 改善薄膜封装有机薄膜层平坦度的方法及装置

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JP2003139934A (ja) * 2001-11-02 2003-05-14 Seiko Epson Corp 基板のパターン製造方法及び製造装置、カラーフィルタの製造方法及び製造装置、並びに電界発光装置の製造方法及び製造装置
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JP3650985B2 (ja) * 1997-05-22 2005-05-25 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物およびパターン製造法
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JP4665298B2 (ja) * 2000-08-25 2011-04-06 東レ株式会社 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置
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JP2003017252A (ja) * 2001-06-29 2003-01-17 Toshiba Corp 有機エレクトロ・ルミネッセンス表示素子の製造方法
JP2003260389A (ja) 2002-03-12 2003-09-16 Seiko Epson Corp 薄膜形成装置と薄膜形成方法、およびデバイス製造装置とデバイス製造方法並びにデバイス
JP2003342505A (ja) * 2002-05-28 2003-12-03 Konica Minolta Holdings Inc 画像形成方法、印刷物及び記録装置
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JP2003139934A (ja) * 2001-11-02 2003-05-14 Seiko Epson Corp 基板のパターン製造方法及び製造装置、カラーフィルタの製造方法及び製造装置、並びに電界発光装置の製造方法及び製造装置
JP2013140727A (ja) * 2012-01-05 2013-07-18 Konica Minolta Inc 有機エレクトロルミネッセンス素子の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023101482A1 (ko) * 2021-12-01 2023-06-08 주식회사 엘지화학 봉지 필름의 제조 방법

Also Published As

Publication number Publication date
EP3683854B1 (en) 2024-11-27
CN111164779B (zh) 2022-12-02
TW201931636A (zh) 2019-08-01
WO2019066605A1 (ko) 2019-04-04
US20200280022A1 (en) 2020-09-03
EP3683854A1 (en) 2020-07-22
CN111164779A (zh) 2020-05-15
KR20190038455A (ko) 2019-04-08
JP7055282B2 (ja) 2022-04-18
US12096648B2 (en) 2024-09-17
JP2022048249A (ja) 2022-03-25
EP3683854A4 (en) 2020-10-28
TWI800534B (zh) 2023-05-01
JP2020535615A (ja) 2020-12-03

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