JP7030606B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP7030606B2
JP7030606B2 JP2018086017A JP2018086017A JP7030606B2 JP 7030606 B2 JP7030606 B2 JP 7030606B2 JP 2018086017 A JP2018086017 A JP 2018086017A JP 2018086017 A JP2018086017 A JP 2018086017A JP 7030606 B2 JP7030606 B2 JP 7030606B2
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JP
Japan
Prior art keywords
cutting
water
axis direction
chips
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018086017A
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English (en)
Japanese (ja)
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JP2019192846A (ja
Inventor
博光 植山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018086017A priority Critical patent/JP7030606B2/ja
Priority to KR1020190034251A priority patent/KR102658945B1/ko
Priority to CN201910307466.9A priority patent/CN110405961B/zh
Priority to TW108114280A priority patent/TWI823928B/zh
Publication of JP2019192846A publication Critical patent/JP2019192846A/ja
Application granted granted Critical
Publication of JP7030606B2 publication Critical patent/JP7030606B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B23Q11/0075—Devices for removing chips for removing chips or coolant from the workpiece after machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B23Q11/1076—Arrangements for cooling or lubricating tools or work with a cutting liquid nozzle specially adaptable to different kinds of machining operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Confectionery (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2018086017A 2018-04-27 2018-04-27 切削装置 Active JP7030606B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018086017A JP7030606B2 (ja) 2018-04-27 2018-04-27 切削装置
KR1020190034251A KR102658945B1 (ko) 2018-04-27 2019-03-26 절삭 장치
CN201910307466.9A CN110405961B (zh) 2018-04-27 2019-04-17 切削装置
TW108114280A TWI823928B (zh) 2018-04-27 2019-04-24 切割裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018086017A JP7030606B2 (ja) 2018-04-27 2018-04-27 切削装置

Publications (2)

Publication Number Publication Date
JP2019192846A JP2019192846A (ja) 2019-10-31
JP7030606B2 true JP7030606B2 (ja) 2022-03-07

Family

ID=68357630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018086017A Active JP7030606B2 (ja) 2018-04-27 2018-04-27 切削装置

Country Status (4)

Country Link
JP (1) JP7030606B2 (zh)
KR (1) KR102658945B1 (zh)
CN (1) CN110405961B (zh)
TW (1) TWI823928B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7491697B2 (ja) 2020-01-17 2024-05-28 株式会社ディスコ 加工装置
JP2021122932A (ja) * 2020-02-10 2021-08-30 Ｔｏｗａ株式会社 加工装置
WO2022065113A1 (ja) * 2020-09-25 2022-03-31 東京エレクトロン株式会社 研削装置、及び研削方法
CN113145938B (zh) * 2021-04-09 2024-04-09 马鞍山德友机械制造有限公司 一种机械零部件加工用切削设备及其工作方法
CN113894571B (zh) * 2021-12-06 2022-03-01 新乡职业技术学院 一种具有切屑引出功能的机械加工机床
CN114734544B (zh) * 2022-06-13 2023-01-20 苏州和研精密科技有限公司 一种切割机切割腔渣水分离收集系统及划片机

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305563A (ja) 2004-04-16 2005-11-04 Disco Abrasive Syst Ltd 切削装置
JP2006150494A (ja) 2004-11-29 2006-06-15 Disco Abrasive Syst Ltd 切削装置
US20090064834A1 (en) 2007-09-11 2009-03-12 Chi Wah Cheng Drainage apparatus for a singulation system
JP2010272849A (ja) 2009-04-24 2010-12-02 Tokyo Seimitsu Co Ltd ダイシング装置並びに排水排気機構付きダイシング装置及びその環境制御方法
JP2016178106A (ja) 2015-03-18 2016-10-06 株式会社ディスコ 切削装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10180585A (ja) * 1996-11-06 1998-07-07 Makino Milling Mach Co Ltd 自動切屑除去装置を備えた工作機械
IL134693A0 (en) * 2000-02-23 2001-04-30 Kulicke & Soffa Investments Attachment for a dicing saw
JP4408332B2 (ja) 2001-02-13 2010-02-03 株式会社ディスコ 切断機
JP2003262328A (ja) * 2002-03-05 2003-09-19 Kawasaki Heavy Ind Ltd スラグ除去装置
JP4235100B2 (ja) * 2003-12-25 2009-03-04 株式会社ミゾタ 除塵装置
DE102011053772B3 (de) * 2011-09-20 2013-02-21 Optotech Optikmaschinen Gmbh Verfahren und Vorrichtung zur Bearbeitung eines Kunststoffteils mit einer Drehmaschinenvorrichtung
JP6012945B2 (ja) * 2011-09-26 2016-10-25 キヤノンマシナリー株式会社 基板切断装置
JP2014079860A (ja) * 2012-10-17 2014-05-08 Disco Abrasive Syst Ltd 加工装置
JP6118653B2 (ja) * 2013-06-19 2017-04-19 株式会社ディスコ 切削装置
JP6367782B2 (ja) 2015-11-20 2018-08-01 ファナック株式会社 工作機械

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305563A (ja) 2004-04-16 2005-11-04 Disco Abrasive Syst Ltd 切削装置
JP2006150494A (ja) 2004-11-29 2006-06-15 Disco Abrasive Syst Ltd 切削装置
US20090064834A1 (en) 2007-09-11 2009-03-12 Chi Wah Cheng Drainage apparatus for a singulation system
JP2010272849A (ja) 2009-04-24 2010-12-02 Tokyo Seimitsu Co Ltd ダイシング装置並びに排水排気機構付きダイシング装置及びその環境制御方法
JP2016178106A (ja) 2015-03-18 2016-10-06 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
TWI823928B (zh) 2023-12-01
KR20190125165A (ko) 2019-11-06
CN110405961B (zh) 2022-08-30
KR102658945B1 (ko) 2024-04-18
CN110405961A (zh) 2019-11-05
JP2019192846A (ja) 2019-10-31
TW201946132A (zh) 2019-12-01

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