JP7075808B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
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- JP7075808B2 JP7075808B2 JP2018081632A JP2018081632A JP7075808B2 JP 7075808 B2 JP7075808 B2 JP 7075808B2 JP 2018081632 A JP2018081632 A JP 2018081632A JP 2018081632 A JP2018081632 A JP 2018081632A JP 7075808 B2 JP7075808 B2 JP 7075808B2
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- Prior art keywords
- cutting
- chips
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- plate
- Prior art date
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- 238000005520 cutting process Methods 0.000 title claims description 304
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 45
- 238000003754 machining Methods 0.000 claims description 26
- 239000002699 waste material Substances 0.000 claims description 26
- 238000011144 upstream manufacturing Methods 0.000 claims description 9
- 238000011084 recovery Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 41
- 239000000463 material Substances 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 10
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/0075—Devices for removing chips for removing chips or coolant from the workpiece after machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Confectionery (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
11 第1チャックテーブル(保持手段)
12 第2チャックテーブル(保持手段)
13 第1加工送り手段
14 第2加工送り手段
30 割り出し送り手段
40 切削手段
41 切削ブレード
43 噴射ノズル(切削水供給手段)
59 第1板状カバー
60 第2板状カバー
70 切削屑案内筐体
71 切削屑回収ボックス
73 第1の側壁
74 第2の側壁
75 底壁(切削屑案内板)
80 切削屑切断手段
81 回転軸
82 回転軸
83 切削屑用切削ブレード
84 切削屑用切削ブレード
P パッケージ基板(被加工物)
Claims (1)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切削ブレードが装着される切削手段と、該切削ブレードに切削水を供給する切削水供給手段と、該保持手段をX軸方向に加工送りする加工送り手段と、該切削手段を該X軸方向と直交するY軸方向に割り出し送りする割り出し送り手段と、を備え、該切削ブレードに供給された切削水が該切削ブレードの回転に伴って飛散する側を加工送り方向の下流側、その反対側を加工送り方向の上流側とする切削装置であって、
切削屑回収ボックスと、該保持手段に対して該加工送り方向下流側に配設され且つ切削後に該下流側に流れてくる切削水及び切削屑を受け入れ該切削屑回収ボックスへ案内する切削屑案内板と、を備え、
該切削屑回収ボックスは、該切削屑案内板から流入する切削水及び切削屑を受け入れ且つ少なくとも底部が切削水を流し切削屑をキャッチするように形成されて切削屑を回収し、
該切削屑案内板の上方で板状カバーから流れる切削屑が落下する位置に配設され、該切削屑を小片に切断する切削屑切断手段を備え、
該切削屑切断手段は、該加工送り方向と垂直方向に伸長し回転可能に配設された回転軸と、該回転軸に所定間隔で複数枚並んで固定された切削屑を切断可能な切削屑用切削ブレードと、から構成され、
回転する複数枚の該切削屑用切削ブレード間に切削屑が落下することで該所定間隔以下の小片に切断され、
該切削屑切断手段の該回転軸から該切削屑案内板までの距離は、切断したい切削屑の最大長さより小さいことを特徴とする切削装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018081632A JP7075808B2 (ja) | 2018-04-20 | 2018-04-20 | 切削装置 |
KR1020190034249A KR102658944B1 (ko) | 2018-04-20 | 2019-03-26 | 절삭 장치 |
CN201910270809.9A CN110385797B (zh) | 2018-04-20 | 2019-04-04 | 切削装置 |
TW108113333A TWI811338B (zh) | 2018-04-20 | 2019-04-17 | 切割裝置 |
US16/387,747 US11018031B2 (en) | 2018-04-20 | 2019-04-18 | Cutting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018081632A JP7075808B2 (ja) | 2018-04-20 | 2018-04-20 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019192713A JP2019192713A (ja) | 2019-10-31 |
JP7075808B2 true JP7075808B2 (ja) | 2022-05-26 |
Family
ID=68236645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018081632A Active JP7075808B2 (ja) | 2018-04-20 | 2018-04-20 | 切削装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11018031B2 (ja) |
JP (1) | JP7075808B2 (ja) |
KR (1) | KR102658944B1 (ja) |
CN (1) | CN110385797B (ja) |
TW (1) | TWI811338B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110756116A (zh) * | 2019-10-30 | 2020-02-07 | 牛月波 | 一种人造石英石环保回收装置 |
JP7412855B2 (ja) * | 2020-02-04 | 2024-01-15 | 株式会社ディスコ | 切削装置 |
CN112140361A (zh) * | 2020-09-27 | 2020-12-29 | 季文婷 | 一种全玻璃真空太阳能集热管高效断管装置 |
CN113001377B (zh) * | 2021-02-27 | 2022-11-01 | 江苏奥通半导体有限公司 | 一种视频监控器的保护罩加工机构 |
CN113084550B (zh) * | 2021-04-20 | 2022-11-25 | 重庆贻晨兴工业设计有限责任公司 | 一种铣床设备及其加工方法 |
CN113977786A (zh) * | 2021-11-08 | 2022-01-28 | 杭州格勒玛数控机床制造有限公司 | 一种半导体石英环切片机 |
CN114734544B (zh) * | 2022-06-13 | 2023-01-20 | 苏州和研精密科技有限公司 | 一种切割机切割腔渣水分离收集系统及划片机 |
JP2024072619A (ja) * | 2022-11-16 | 2024-05-28 | Towa株式会社 | 切断装置及び切断品の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002239888A (ja) | 2001-02-13 | 2002-08-28 | Disco Abrasive Syst Ltd | 切断機 |
JP2014079860A (ja) | 2012-10-17 | 2014-05-08 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015005544A (ja) | 2013-06-19 | 2015-01-08 | 株式会社ディスコ | 切削装置 |
JP2016030309A (ja) | 2014-07-28 | 2016-03-07 | 株式会社デンソー | 切削屑処理装置及びそれを備えた切削加工機 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2753908A (en) * | 1953-11-09 | 1956-07-10 | Robert B Anderson | Livestock feed grinder |
US5611495A (en) * | 1995-11-06 | 1997-03-18 | Williams; Robert M. | Rotary shredding apparatus with anti-jam means |
JPH11254026A (ja) * | 1998-03-16 | 1999-09-21 | Hitachi Cable Ltd | 連続押出機のバリ処理装置 |
KR100937094B1 (ko) * | 2008-07-28 | 2010-01-15 | 김산동 | 실리콘 파쇄기 |
WO2011105255A1 (ja) * | 2010-02-26 | 2011-09-01 | 株式会社Sumco | 半導体ウェーハの製造方法 |
CN203975882U (zh) * | 2014-07-23 | 2014-12-03 | 浙江方远建材科技有限公司 | 一种加气块切割机切割废料的输送装置 |
CN204773079U (zh) * | 2015-06-26 | 2015-11-18 | 福建南安市新东源石业有限公司 | 用于石材马赛克复合砖制作的切边边料回收装置 |
US10130953B1 (en) * | 2015-10-19 | 2018-11-20 | Bill H. Ranne | Submicron particle grinding mill |
-
2018
- 2018-04-20 JP JP2018081632A patent/JP7075808B2/ja active Active
-
2019
- 2019-03-26 KR KR1020190034249A patent/KR102658944B1/ko active IP Right Grant
- 2019-04-04 CN CN201910270809.9A patent/CN110385797B/zh active Active
- 2019-04-17 TW TW108113333A patent/TWI811338B/zh active
- 2019-04-18 US US16/387,747 patent/US11018031B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002239888A (ja) | 2001-02-13 | 2002-08-28 | Disco Abrasive Syst Ltd | 切断機 |
JP2014079860A (ja) | 2012-10-17 | 2014-05-08 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015005544A (ja) | 2013-06-19 | 2015-01-08 | 株式会社ディスコ | 切削装置 |
JP2016030309A (ja) | 2014-07-28 | 2016-03-07 | 株式会社デンソー | 切削屑処理装置及びそれを備えた切削加工機 |
Also Published As
Publication number | Publication date |
---|---|
US11018031B2 (en) | 2021-05-25 |
JP2019192713A (ja) | 2019-10-31 |
CN110385797A (zh) | 2019-10-29 |
CN110385797B (zh) | 2022-09-16 |
TW201944475A (zh) | 2019-11-16 |
TWI811338B (zh) | 2023-08-11 |
KR102658944B1 (ko) | 2024-04-18 |
US20190326136A1 (en) | 2019-10-24 |
KR20190122549A (ko) | 2019-10-30 |
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