JP7027622B1 - 抵抗体、及び、めっき装置 - Google Patents

抵抗体、及び、めっき装置 Download PDF

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Publication number
JP7027622B1
JP7027622B1 JP2021559593A JP2021559593A JP7027622B1 JP 7027622 B1 JP7027622 B1 JP 7027622B1 JP 2021559593 A JP2021559593 A JP 2021559593A JP 2021559593 A JP2021559593 A JP 2021559593A JP 7027622 B1 JP7027622 B1 JP 7027622B1
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Japan
Prior art keywords
holes
resistor
plating
substrate
module
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JP2021559593A
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English (en)
Japanese (ja)
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JPWO2022264353A1 (zh
Inventor
良輔 樋渡
正 下山
泰之 増田
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Ebara Corp
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Ebara Corp
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Publication of JP7027622B1 publication Critical patent/JP7027622B1/ja
Publication of JPWO2022264353A1 publication Critical patent/JPWO2022264353A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
JP2021559593A 2021-06-17 2021-06-17 抵抗体、及び、めっき装置 Active JP7027622B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/023016 WO2022264353A1 (ja) 2021-06-17 2021-06-17 抵抗体、及び、めっき装置

Publications (2)

Publication Number Publication Date
JP7027622B1 true JP7027622B1 (ja) 2022-03-01
JPWO2022264353A1 JPWO2022264353A1 (zh) 2022-12-22

Family

ID=81183867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021559593A Active JP7027622B1 (ja) 2021-06-17 2021-06-17 抵抗体、及び、めっき装置

Country Status (5)

Country Link
US (1) US20240279837A1 (zh)
JP (1) JP7027622B1 (zh)
KR (1) KR102421505B1 (zh)
CN (1) CN114729467A (zh)
WO (1) WO2022264353A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7305075B1 (ja) * 2023-03-17 2023-07-07 株式会社荏原製作所 めっき装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11152600A (ja) * 1997-11-19 1999-06-08 Ebara Corp ウエハのメッキ装置
JP2002054000A (ja) * 2000-08-02 2002-02-19 Nitto Denko Corp 基板の電解めっき方法
WO2004009879A1 (ja) * 2002-07-18 2004-01-29 Ebara Corporation めっき装置
JP2016504500A (ja) * 2012-12-20 2016-02-12 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 基板上への電解金属の垂直堆積装置
JP6906729B1 (ja) * 2020-11-16 2021-07-21 株式会社荏原製作所 プレート、めっき装置、及びプレートの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002235188A (ja) * 2001-02-05 2002-08-23 Tokyo Electron Ltd 液処理装置、液処理方法
JP2004225129A (ja) 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置
JP2008019496A (ja) 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
TW200839038A (en) * 2007-03-26 2008-10-01 Semi Photonics Co Ltd Device and method with improved plating film thickness uniformity
JP5507649B2 (ja) * 2012-11-15 2014-05-28 株式会社荏原製作所 磁性体膜めっき装置及びめっき処理設備
JP6317299B2 (ja) * 2015-08-28 2018-04-25 株式会社荏原製作所 めっき装置、めっき方法、及び基板ホルダ
US20220396896A1 (en) * 2020-12-21 2022-12-15 Ebara Corporation Plating apparatus and plating solution agitating method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11152600A (ja) * 1997-11-19 1999-06-08 Ebara Corp ウエハのメッキ装置
JP2002054000A (ja) * 2000-08-02 2002-02-19 Nitto Denko Corp 基板の電解めっき方法
WO2004009879A1 (ja) * 2002-07-18 2004-01-29 Ebara Corporation めっき装置
JP2016504500A (ja) * 2012-12-20 2016-02-12 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 基板上への電解金属の垂直堆積装置
JP6906729B1 (ja) * 2020-11-16 2021-07-21 株式会社荏原製作所 プレート、めっき装置、及びプレートの製造方法

Also Published As

Publication number Publication date
CN114729467A (zh) 2022-07-08
US20240279837A1 (en) 2024-08-22
JPWO2022264353A1 (zh) 2022-12-22
WO2022264353A1 (ja) 2022-12-22
KR102421505B1 (ko) 2022-07-15

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