JP7018893B2 - 回転ビームのレーザスクライビングプロセスとプラズマエッチングプロセスとを使用する、ハイブリッドなウエハダイシングの手法 - Google Patents
回転ビームのレーザスクライビングプロセスとプラズマエッチングプロセスとを使用する、ハイブリッドなウエハダイシングの手法 Download PDFInfo
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Description
この出願は、JungraePark氏等による、「回転ビームのレーザスクライビングプロセスとプラズマエッチングプロセスとを使用する、ハイブリッドなウエハダイシングの手法(Hybrid Wafer Dicing Approach using a Rotating Beam Laser Scribing Process and Plasma Etch Process)」と題された、2016年3月25日出願の米国特許出願第15/081,296号に対する優先権を主張する。
半導体ウエハ処理においては、シリコン又はその他の半導体材料で構成されたウエハ(基板とも称される)上に、集積回路が形成される。通常、集積回路を形成するために、半導電性、導電性、又は絶縁性のいずれかである様々な材料の層が利用される。これらの材料は、様々な周知のプロセスを使用してドープされ、堆積され、エッチングされて、集積回路を形成する。各ウエハは処理されて、ダイとして知られる、集積回路を包含する多数の個別領域を形成する。
Claims (17)
- 複数の集積回路を備える半導体ウエハをダイシングする方法であって、
前記集積回路を覆いかつ保護する層を備えるマスクを、前記半導体ウエハ上に形成することと、
間隙を有するパターニングされたマスクを提供するために、回転レーザビームのレーザスクライビングプロセスを用いて前記マスクをパターニングし、前記半導体ウエハの前記集積回路間の領域を露出させることと、ここで前記回転レーザビームのレーザスクライビングプロセスは、レーザビームを該レーザビームの中心軸周りに、該レーザビームの進行方向に沿って回転させることを含み、
前記集積回路を個片化するために、前記パターニングされたマスクの前記間隙を通じて、前記半導体ウエハをプラズマエッチングすることとを含む、方法。 - 前記回転レーザビームのレーザスクライビングプロセスが、回転成形されたレーザビームのレーザスクライビングプロセスである、請求項1に記載の方法。
- 前記回転レーザビームのレーザスクライビングプロセスが円滑なガウスビームに基づく、請求項1に記載の方法。
- 前記回転レーザビームのレーザスクライビングプロセスが、平坦頂部を有する円滑な線形ビームに基づく、請求項1に記載の方法。
- 前記回転レーザビームのレーザスクライビングプロセスが、入力レーザビームの軸上でビームを回転させることを含む、請求項1に記載の方法。
- 前記回転レーザビームのレーザスクライビングプロセスを用いてスクライブすることが、フェムト秒ベースの回転レーザビームを用いてスクライブすることを含む、請求項1に記載の方法。
- 前記レーザスクライビングプロセスを用いて前記マスクをパターニングすることが、前記半導体ウエハの前記集積回路間の前記領域内にトレンチを形成することを含み、前記半導体ウエハをプラズマエッチングすることが、前記トレンチを延伸させて、対応するトレンチ延伸部を形成することを含む、請求項1に記載の方法。
- 複数の集積回路を備える半導体ウエハをダイシングする方法であって、
前記複数の集積回路を個片化するために、回転レーザビームのレーザスクライビングプロセスを用いて前記半導体ウエハをレーザスクライブすることを含み、前記回転レーザビームのレーザスクライビングプロセスは、レーザビームを該レーザビームの中心軸周りに、該レーザビームの進行方向に沿って回転させることを含む、方法。 - 前記回転レーザビームのレーザスクライビングプロセスが、回転成形されたレーザビームのレーザスクライビングプロセスである、請求項8に記載の方法。
- 前記回転レーザビームのレーザスクライビングプロセスが円滑なガウスビームに基づく、請求項8に記載の方法。
- 前記回転レーザビームのレーザスクライビングプロセスが、平坦頂部を有する円滑な線形ビームに基づく、請求項8に記載の方法。
- 前記回転レーザビームのレーザスクライビングプロセスが、入力レーザビームの軸上でビームを回転させることを含む、請求項8に記載の方法。
- 複数の集積回路を備える半導体ウエハをダイシングするためのシステムであって、
ファクトリインターフェースと、
前記ファクトリインターフェースに連結されており、かつ、回転レーザビームを提供するよう構成されたレーザアセンブリを備える、レーザスクライビング装置であって、レーザビームを該レーザビームの中心軸周りに、該レーザビームの進行方向に沿って回転させるように構成されたレーザスクライビング装置と、
前記ファクトリインターフェースに連結されたプラズマエッチングチャンバとを備える、システム。 - 前記レーザアセンブリは、前記回転レーザビームを回転成形されたレーザビームとして提供するよう構成され、前記レーザアセンブリは、回折光学素子、一又は複数のスリット開孔、及びアキシコンからなる群から選択される、ビーム成形光学素子を含む、請求項13に記載のシステム。
- 前記レーザアセンブリが、入力レーザビームの軸上でレーザビームを回転させるよう構成される、請求項13に記載のシステム。
- 前記レーザアセンブリは、コアを伴うロータを有するモータを備え、前記回転レーザビームが、前記ロータの前記コア内に収納された管状光パイプから出力される、請求項13に記載のシステム。
- 前記レーザアセンブリは、コアを伴うロータを有するモータを備え、前記回転レーザビームが、前記ロータの前記コア内に収納された円柱状光パイプから出力される、請求項13に記載のシステム。
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US9852997B2 (en) | 2017-12-26 |
CN108780778B (zh) | 2023-07-28 |
KR102377901B1 (ko) | 2022-03-23 |
SG11201807152VA (en) | 2018-10-30 |
US20170278801A1 (en) | 2017-09-28 |
TW201801156A (zh) | 2018-01-01 |
TWI717486B (zh) | 2021-02-01 |
KR20180120281A (ko) | 2018-11-05 |
WO2017165706A1 (en) | 2017-09-28 |
CN108780778A (zh) | 2018-11-09 |
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