ATE512747T1 - Verfahren zum formen eines oder mehrerer getrennten ritze in einer oberfläche eines substrats - Google Patents

Verfahren zum formen eines oder mehrerer getrennten ritze in einer oberfläche eines substrats

Info

Publication number
ATE512747T1
ATE512747T1 AT05077493T AT05077493T ATE512747T1 AT E512747 T1 ATE512747 T1 AT E512747T1 AT 05077493 T AT05077493 T AT 05077493T AT 05077493 T AT05077493 T AT 05077493T AT E512747 T1 ATE512747 T1 AT E512747T1
Authority
AT
Austria
Prior art keywords
forming
substrate
scores
laser beam
primary
Prior art date
Application number
AT05077493T
Other languages
English (en)
Inventor
Borkulo Jeroen Van
Hans Peter Chall
Original Assignee
Advanced Laser Separation Internat Alsi B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Laser Separation Internat Alsi B V filed Critical Advanced Laser Separation Internat Alsi B V
Application granted granted Critical
Publication of ATE512747T1 publication Critical patent/ATE512747T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
AT05077493T 2005-10-31 2005-10-31 Verfahren zum formen eines oder mehrerer getrennten ritze in einer oberfläche eines substrats ATE512747T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05077493A EP1779961B1 (de) 2005-10-31 2005-10-31 Verfahren zum Formen eines oder mehrerer getrennten Ritze in einer Oberfläche eines Substrats

Publications (1)

Publication Number Publication Date
ATE512747T1 true ATE512747T1 (de) 2011-07-15

Family

ID=36061332

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05077493T ATE512747T1 (de) 2005-10-31 2005-10-31 Verfahren zum formen eines oder mehrerer getrennten ritze in einer oberfläche eines substrats

Country Status (4)

Country Link
US (1) US7947920B2 (de)
EP (2) EP1779961B1 (de)
JP (1) JP2007129225A (de)
AT (1) ATE512747T1 (de)

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GB0900036D0 (en) * 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
KR20100107253A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
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JP5056839B2 (ja) * 2009-12-25 2012-10-24 三星ダイヤモンド工業株式会社 被加工物の加工方法および被加工物の分割方法
US8450638B2 (en) 2010-01-28 2013-05-28 Seishin Trading Co., Ltd. Laser scribing method and apparatus
CN102139484B (zh) * 2010-01-29 2015-05-20 西进商事股份有限公司 激光划线方法以及装置
US8814430B2 (en) 2010-02-23 2014-08-26 Kraft Foods R&D, Inc. Food package having opening feature
KR20110114972A (ko) 2010-04-14 2011-10-20 삼성전자주식회사 레이저 빔을 이용한 기판의 가공 방법
US8951819B2 (en) * 2011-07-11 2015-02-10 Applied Materials, Inc. Wafer dicing using hybrid split-beam laser scribing process with plasma etch
JP5472278B2 (ja) * 2011-12-15 2014-04-16 三星ダイヤモンド工業株式会社 レーザー加工装置
JP5472277B2 (ja) * 2011-12-15 2014-04-16 三星ダイヤモンド工業株式会社 レーザー加工装置
KR20140036593A (ko) 2012-09-17 2014-03-26 삼성디스플레이 주식회사 레이저 가공 장치
TWI543833B (zh) 2013-01-28 2016-08-01 先進科技新加坡有限公司 將半導體基板輻射開槽之方法
JP6071641B2 (ja) * 2013-02-27 2017-02-01 三菱重工業株式会社 加工装置、加工方法
GB2512291B (en) * 2013-03-22 2015-02-11 M Solv Ltd Apparatus and methods for forming plural groups of laser beams
TWI561327B (en) 2013-10-16 2016-12-11 Asm Tech Singapore Pte Ltd Laser scribing apparatus comprising adjustable spatial filter and method for etching semiconductor substrate
JP2015170675A (ja) * 2014-03-06 2015-09-28 株式会社ディスコ 板状物の加工方法
TW201611933A (en) * 2014-09-19 2016-04-01 Youngtek Electronics Corp Laser beam splitting angle pick-up device
US10307867B2 (en) 2014-11-05 2019-06-04 Asm Technology Singapore Pte Ltd Laser fiber array for singulating semiconductor wafers
US9852997B2 (en) * 2016-03-25 2017-12-26 Applied Materials, Inc. Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
JP6877297B2 (ja) * 2016-11-16 2021-05-26 株式会社クボタ レーザ加工装置、シリンダブロックの製造方法、及び、シリンダブロック
US11177142B2 (en) * 2017-11-30 2021-11-16 Taiwan Semiconductor Manufacturing Company, Ltd. Method for dicing integrated fan-out packages without seal rings

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Also Published As

Publication number Publication date
EP1779961B1 (de) 2011-06-15
JP2007129225A (ja) 2007-05-24
EP2260967B1 (de) 2013-10-02
EP2260967A3 (de) 2012-03-07
EP1779961A1 (de) 2007-05-02
US20070099439A1 (en) 2007-05-03
EP2260967A2 (de) 2010-12-15
US7947920B2 (en) 2011-05-24

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