JP7003556B2 - 流体吐出ヘッドと流体吐出ヘッドの製造方法 - Google Patents
流体吐出ヘッドと流体吐出ヘッドの製造方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Further insulation means against electrical, physical or chemical damage, e.g. protective coatings
Description
12:基板
14:抵抗発熱体
16:装置表面
18:流体供給ビア
20:流体供給流路
22:流体室
24:厚膜層
26、64:ノズル孔
28、50:ノズルプレート層
30、44、56:マスク
32、46、58:透明な領域
34、48、60:不透明な領域
36、42、54:紫外線
38:ローララミネータ
40:フロー機能層
52:圧縮ローララミネータ
62:ノズル孔領域
Claims (8)
- 装置表面上の複数の流体吐出アクチュエータと、貫通した1つ以上の流体供給ビアを含む基板と、
前記基板の前記装置表面に積層された第1のフォトレジスト層と、
前記第1のフォトレジスト層に積層され第2のフォトレジスト層と、を含み、
前記第2のフォトレジスト層が、前記第1のフォトレジスト層に隣接して設けられた親水性フォトレジスト材料層と、前記親水性フォトレジスト材料層に隣接して設けられた疎水性フォトレジスト材料層とを含む第2のフォトレジスト層と、を含み、
前記第1のフォトレジスト層が前記基板上に反射防止コーティングを提供する、
流体吐出ヘッド。 - 前記親水性フォトレジスト材料層が60度~90度未満の範囲の水接触角を有する、
請求項1に記載の流体吐出ヘッド。 - 前記疎水性フォトレジスト材料層が91度~120度の範囲の水接触角を有する、
請求項1または請求項2に記載の流体吐出ヘッド。 - 装置表面上に複数の流体吐出アクチュエータを含む基板を提供する工程と、
前記基板に1つ以上の流体供給ビアを形成する工程と、
前記基板の前記装置表面に第1のフォトレジスト層を積層する工程と、
前記第1のフォトレジスト層の第1の紫外線露光領域を提供するため、第1のフォトマスクを介し前記第1のフォトレジスト層を第1の紫外線に露光する工程と、
前記第1のフォトレジスト層の前記第1の紫外線露光領域の材料を架橋するため、前記第1のフォトレジスト層を加熱する工程と、
前記第1のフォトレジスト層に第2のフォトレジスト層を積層する工程と、
ノズル孔のための第2の紫外線露光領域を提供するため、第2のフォトマスクを介し前記第2のフォトレジスト層を第2の紫外線に露光する工程と、
前記第2のフォトレジスト層を熱架橋する工程と、
前記第1のフォトレジスト層にフロー機能を形成するため、且つ、前記第2のフォトレジスト層にノズル孔を形成するため、前記第1のフォトレジスト層と前記第2のフォトレジスト層を現像する工程と、を含み、
前記第1のフォトレジスト層が前記基板上に反射防止コーティングを提供する、
流体吐出ヘッドの製造方法。 - 前記第1のフォトレジスト層がネガ型フォトレジスト材料を含む、
請求項4に記載の流体吐出ヘッドの製造方法。 - 前記第2のフォトレジスト層が、前記第1のフォトレジスト層に隣接して設けられた親水性フォトレジスト材料層と、前記親水性フォトレジスト材料層に隣接して設けられた疎水性フォトレジスト材料層を含む、
請求項4または請求項5に記載の流体吐出ヘッドの製造方法。 - 前記第1のフォトレジスト層と前記基板の前記装置表面との間の接合力を増強するため、前記基板の前記装置表面がプラズマ処理される、
請求項4~6のいずれか1項に記載の流体吐出ヘッドの製造方法。 - 装置表面上に複数の流体吐出アクチュエータを含む基板を提供する工程と、
前記基板に1つ以上の流体供給ビアを形成する工程と、
前記基板の前記装置表面に第1のフォトレジスト層を積層する工程と、
前記第1のフォトレジスト層の第1の紫外線露光領域を提供するため、第1のフォトマスクを介し前記第1のフォトレジスト層を第1の紫外線に露光する工程と、
前記第1のフォトレジスト層の前記第1の紫外線露光領域の材料を架橋するため、前記第1のフォトレジスト層を加熱する工程と、
前記第1のフォトレジスト層に第2のフォトレジスト層を積層する工程と、
ノズル孔のための第2の紫外線露光領域を提供するため、第2のフォトマスクを介し前記第2のフォトレジスト層を第2の紫外線に露光する工程と、
前記第2のフォトレジスト層を熱架橋する工程と、
前記第1のフォトレジスト層にフロー機能を形成するため、且つ、前記第2のフォトレジスト層にノズル孔を形成するため、前記第1のフォトレジスト層と前記第2のフォトレジスト層を現像する工程と、を含み、
前記第1のフォトレジスト層と前記第2のフォトレジスト層との間の接合力を増強するため、前記第1のフォトレジスト層が酸素とフォーミングガスでプラズマ処理される、
流体吐出ヘッドの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US15/295,335 US9855566B1 (en) | 2016-10-17 | 2016-10-17 | Fluid ejection head and process for making a fluid ejection head structure |
US15/295,335 | 2016-10-17 |
Publications (2)
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JP2018065381A JP2018065381A (ja) | 2018-04-26 |
JP7003556B2 true JP7003556B2 (ja) | 2022-01-20 |
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US (1) | US9855566B1 (ja) |
EP (1) | EP3312011B1 (ja) |
JP (1) | JP7003556B2 (ja) |
CN (1) | CN107953672B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US10599034B2 (en) | 2017-08-21 | 2020-03-24 | Funai Electric Co., Ltd. | Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film |
KR102589497B1 (ko) | 2019-07-30 | 2023-10-13 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 균일한 프린트 헤드면 코팅 |
US11666918B2 (en) * | 2020-03-06 | 2023-06-06 | Funai Electric Co., Ltd. | Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic component |
US11577513B2 (en) * | 2020-10-06 | 2023-02-14 | Funai Electric Co., Ltd. | Photoimageable nozzle member for reduced fluid cross-contamination and method therefor |
US11926157B2 (en) * | 2021-03-05 | 2024-03-12 | Funai Electric Co., Ltd. | Photoresist imaging and development for enhanced nozzle plate adhesion |
US11896971B2 (en) | 2021-03-18 | 2024-02-13 | Punai Electric Co., Ltd. | Fluid detection circuit for fluid ejection head |
US11958292B2 (en) * | 2021-03-19 | 2024-04-16 | Funai Electric Co., Ltd. | Solvent compatible nozzle plate |
JP2022156158A (ja) * | 2021-03-31 | 2022-10-14 | セイコーエプソン株式会社 | 液体噴射ノズル及び液体噴射装置 |
US11642886B2 (en) * | 2021-04-08 | 2023-05-09 | Funai Electric Co., Ltd. | Modified fluid jet plume characteristics |
US20220323973A1 (en) * | 2021-04-08 | 2022-10-13 | Funai Electric Co., Ltd. | Modified fluid jet plume characteristics |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003300323A (ja) | 2002-04-11 | 2003-10-21 | Canon Inc | インクジェットヘッド及びその製造方法 |
JP2005319797A (ja) | 2004-05-03 | 2005-11-17 | Samsung Electronics Co Ltd | インクジェットヘッド用ノズルプレートの製造方法,インクジェットヘッドの製造方法及びインクジェットヘッド |
JP2007245640A (ja) | 2006-03-17 | 2007-09-27 | Canon Inc | インクジェット記録ヘッド |
JP2009178906A (ja) | 2008-01-30 | 2009-08-13 | Canon Inc | インクジェット記録ヘッドの製造方法 |
JP2012126107A (ja) | 2010-12-17 | 2012-07-05 | Canon Inc | インクジェット記録ヘッドの製造方法 |
JP2013022940A (ja) | 2011-07-26 | 2013-02-04 | Canon Inc | 液体吐出ヘッドの製造方法 |
JP2016043515A (ja) | 2014-08-20 | 2016-04-04 | キヤノン株式会社 | インクジェット記録ヘッドおよびその製造方法 |
JP2016175312A (ja) | 2015-03-20 | 2016-10-06 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04185347A (ja) * | 1990-11-16 | 1992-07-02 | Ricoh Co Ltd | 液滴飛翔記録装置 |
JP2727988B2 (ja) * | 1994-12-15 | 1998-03-18 | 日本電気株式会社 | インクジェットプリントヘッドの製造方法 |
JPH08295018A (ja) * | 1995-04-26 | 1996-11-12 | Matsushita Electric Ind Co Ltd | インクジェットヘッド |
US6511156B1 (en) * | 1997-09-22 | 2003-01-28 | Citizen Watch Co., Ltd. | Ink-jet head nozzle plate, its manufacturing method and ink-jet head |
US6409312B1 (en) | 2001-03-27 | 2002-06-25 | Lexmark International, Inc. | Ink jet printer nozzle plate and process therefor |
US7198353B2 (en) * | 2004-06-30 | 2007-04-03 | Lexmark International, Inc. | Integrated black and colored ink printheads |
KR100765315B1 (ko) | 2004-07-23 | 2007-10-09 | 삼성전자주식회사 | 기판과 일체로 이루어진 필터링 부재를 구비하는 잉크젯헤드 및 그 제조방법. |
KR100641357B1 (ko) | 2004-08-26 | 2006-11-01 | 삼성전자주식회사 | 잉크젯 프린트 헤드 및 그 제조 방법 |
US7169538B2 (en) | 2004-09-10 | 2007-01-30 | Lexmark International, Inc. | Process for making a micro-fluid ejection head structure |
JP2006130766A (ja) * | 2004-11-05 | 2006-05-25 | Canon Inc | 液体吐出ヘッド用基板及びその製造方法 |
US7479203B2 (en) | 2005-08-22 | 2009-01-20 | Lexmark International, Inc. | Lamination of dry film to micro-fluid ejection head substrates |
US7470505B2 (en) * | 2005-09-23 | 2008-12-30 | Lexmark International, Inc. | Methods for making micro-fluid ejection head structures |
KR20080102903A (ko) * | 2007-05-22 | 2008-11-26 | 삼성전자주식회사 | 잉크젯 프린터 헤드의 제조 방법 및 상기 방법에 의하여제조된 잉크젯 프린터 헤드 |
KR101155989B1 (ko) * | 2007-06-21 | 2012-06-18 | 삼성전자주식회사 | 잉크젯 프린트헤드의 제조방법 |
KR100906804B1 (ko) * | 2007-09-27 | 2009-07-09 | 삼성전기주식회사 | 노즐 플레이트, 잉크젯 헤드 및 그들의 제조방법 |
JP5159336B2 (ja) * | 2008-01-25 | 2013-03-06 | キヤノン株式会社 | インクジェット記録ヘッドおよびその製造方法 |
US8173030B2 (en) | 2008-09-30 | 2012-05-08 | Eastman Kodak Company | Liquid drop ejector having self-aligned hole |
JP5538844B2 (ja) * | 2008-12-19 | 2014-07-02 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP2012030458A (ja) * | 2010-07-30 | 2012-02-16 | Brother Industries Ltd | インク吐出ヘッドの製造方法 |
US8820883B2 (en) * | 2011-06-28 | 2014-09-02 | Eastman Kodak Company | Microfluidic device having improved epoxy layer adhesion |
JP6039259B2 (ja) * | 2011-07-25 | 2016-12-07 | キヤノン株式会社 | 液体吐出ヘッド、およびその製造方法 |
US20130048601A1 (en) * | 2011-08-31 | 2013-02-28 | Paul Dryer | Use of Hydrogen-Oxygen Plasma for Forming Hydroxyl Functional Groups on a Polymer Surface |
JP6270363B2 (ja) * | 2012-09-11 | 2018-01-31 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP6112809B2 (ja) * | 2012-09-21 | 2017-04-12 | キヤノン株式会社 | 液滴吐出ヘッドの製造方法 |
JP2014136402A (ja) * | 2013-01-18 | 2014-07-28 | Canon Inc | 微細構造体の形成方法およびインクジェットヘッドの製造方法 |
JP6207212B2 (ja) * | 2013-04-23 | 2017-10-04 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP6395518B2 (ja) * | 2014-09-01 | 2018-09-26 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
-
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003300323A (ja) | 2002-04-11 | 2003-10-21 | Canon Inc | インクジェットヘッド及びその製造方法 |
JP2005319797A (ja) | 2004-05-03 | 2005-11-17 | Samsung Electronics Co Ltd | インクジェットヘッド用ノズルプレートの製造方法,インクジェットヘッドの製造方法及びインクジェットヘッド |
JP2007245640A (ja) | 2006-03-17 | 2007-09-27 | Canon Inc | インクジェット記録ヘッド |
JP2009178906A (ja) | 2008-01-30 | 2009-08-13 | Canon Inc | インクジェット記録ヘッドの製造方法 |
JP2012126107A (ja) | 2010-12-17 | 2012-07-05 | Canon Inc | インクジェット記録ヘッドの製造方法 |
JP2013022940A (ja) | 2011-07-26 | 2013-02-04 | Canon Inc | 液体吐出ヘッドの製造方法 |
JP2016043515A (ja) | 2014-08-20 | 2016-04-04 | キヤノン株式会社 | インクジェット記録ヘッドおよびその製造方法 |
JP2016175312A (ja) | 2015-03-20 | 2016-10-06 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
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US9855566B1 (en) | 2018-01-02 |
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JP2018065381A (ja) | 2018-04-26 |
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