JP6986933B2 - 基板処理方法および基板処理装置 - Google Patents

基板処理方法および基板処理装置 Download PDF

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Publication number
JP6986933B2
JP6986933B2 JP2017215295A JP2017215295A JP6986933B2 JP 6986933 B2 JP6986933 B2 JP 6986933B2 JP 2017215295 A JP2017215295 A JP 2017215295A JP 2017215295 A JP2017215295 A JP 2017215295A JP 6986933 B2 JP6986933 B2 JP 6986933B2
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Japan
Prior art keywords
flow path
treatment liquid
discharge valve
valve
discharge
Prior art date
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JP2017215295A
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English (en)
Japanese (ja)
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JP2019087652A (ja
Inventor
孝佳 田中
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017215295A priority Critical patent/JP6986933B2/ja
Priority to KR1020207015183A priority patent/KR102378913B1/ko
Priority to PCT/JP2018/040403 priority patent/WO2019093200A1/ja
Priority to CN201880072183.4A priority patent/CN111316402A/zh
Priority to TW107138390A priority patent/TWI704966B/zh
Publication of JP2019087652A publication Critical patent/JP2019087652A/ja
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Publication of JP6986933B2 publication Critical patent/JP6986933B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017215295A 2017-11-08 2017-11-08 基板処理方法および基板処理装置 Active JP6986933B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017215295A JP6986933B2 (ja) 2017-11-08 2017-11-08 基板処理方法および基板処理装置
KR1020207015183A KR102378913B1 (ko) 2017-11-08 2018-10-30 기판 처리 방법 및 기판 처리 장치
PCT/JP2018/040403 WO2019093200A1 (ja) 2017-11-08 2018-10-30 基板処理方法および基板処理装置
CN201880072183.4A CN111316402A (zh) 2017-11-08 2018-10-30 基板处理方法及基板处理装置
TW107138390A TWI704966B (zh) 2017-11-08 2018-10-30 基板處理方法及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017215295A JP6986933B2 (ja) 2017-11-08 2017-11-08 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
JP2019087652A JP2019087652A (ja) 2019-06-06
JP6986933B2 true JP6986933B2 (ja) 2021-12-22

Family

ID=66437746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017215295A Active JP6986933B2 (ja) 2017-11-08 2017-11-08 基板処理方法および基板処理装置

Country Status (5)

Country Link
JP (1) JP6986933B2 (zh)
KR (1) KR102378913B1 (zh)
CN (1) CN111316402A (zh)
TW (1) TWI704966B (zh)
WO (1) WO2019093200A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102346529B1 (ko) 2019-06-24 2021-12-31 세메스 주식회사 액 공급 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법
JP7384658B2 (ja) * 2019-12-24 2023-11-21 株式会社Ｓｃｒｅｅｎホールディングス 配管洗浄方法
KR20230009921A (ko) * 2020-05-14 2023-01-17 도쿄엘렉트론가부시키가이샤 액 공급 기구, 기판 처리 장치, 및 기판 처리 방법
TWI811028B (zh) * 2022-07-19 2023-08-01 凱爾迪科技股份有限公司 自吸回收系統

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471886B2 (ja) * 2010-06-25 2014-04-16 東京エレクトロン株式会社 高温、高圧処理方法及び高温、高圧処理装置並びに記憶媒体
JP5753352B2 (ja) 2010-07-20 2015-07-22 株式会社Ｓｃｒｅｅｎホールディングス ダイヤフラムバルブおよびこれを備えた基板処理装置
JP5891065B2 (ja) * 2012-02-22 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および処理液吸引方法
JP6320805B2 (ja) * 2014-03-17 2018-05-09 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置
JP6439964B2 (ja) * 2014-09-17 2018-12-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6512554B2 (ja) * 2014-09-29 2019-05-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2016127080A (ja) * 2014-12-26 2016-07-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6319117B2 (ja) * 2015-01-26 2018-05-09 東京エレクトロン株式会社 処理液供給装置、処理液供給方法及び記憶媒体
JP6624599B2 (ja) * 2015-08-05 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および処理液吐出方法
JP2017183568A (ja) 2016-03-31 2017-10-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
CN111316402A (zh) 2020-06-19
WO2019093200A1 (ja) 2019-05-16
TW201936272A (zh) 2019-09-16
KR102378913B1 (ko) 2022-03-24
TWI704966B (zh) 2020-09-21
JP2019087652A (ja) 2019-06-06
KR20200070388A (ko) 2020-06-17

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