JP6985034B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP6985034B2
JP6985034B2 JP2017121271A JP2017121271A JP6985034B2 JP 6985034 B2 JP6985034 B2 JP 6985034B2 JP 2017121271 A JP2017121271 A JP 2017121271A JP 2017121271 A JP2017121271 A JP 2017121271A JP 6985034 B2 JP6985034 B2 JP 6985034B2
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JP
Japan
Prior art keywords
cutting
air
holding table
annular
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017121271A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019009175A (ja
Inventor
寧 丹野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017121271A priority Critical patent/JP6985034B2/ja
Priority to TW107115386A priority patent/TWI754746B/zh
Priority to KR1020180066666A priority patent/KR102504620B1/ko
Priority to CN201810634412.9A priority patent/CN109093863B/zh
Publication of JP2019009175A publication Critical patent/JP2019009175A/ja
Application granted granted Critical
Publication of JP6985034B2 publication Critical patent/JP6985034B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mining & Mineral Resources (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Milling Processes (AREA)
JP2017121271A 2017-06-21 2017-06-21 切削装置 Active JP6985034B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017121271A JP6985034B2 (ja) 2017-06-21 2017-06-21 切削装置
TW107115386A TWI754746B (zh) 2017-06-21 2018-05-07 切削裝置
KR1020180066666A KR102504620B1 (ko) 2017-06-21 2018-06-11 절삭 장치
CN201810634412.9A CN109093863B (zh) 2017-06-21 2018-06-20 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017121271A JP6985034B2 (ja) 2017-06-21 2017-06-21 切削装置

Publications (2)

Publication Number Publication Date
JP2019009175A JP2019009175A (ja) 2019-01-17
JP6985034B2 true JP6985034B2 (ja) 2021-12-22

Family

ID=64844834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017121271A Active JP6985034B2 (ja) 2017-06-21 2017-06-21 切削装置

Country Status (4)

Country Link
JP (1) JP6985034B2 (zh)
KR (1) KR102504620B1 (zh)
CN (1) CN109093863B (zh)
TW (1) TWI754746B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112223431B (zh) 2019-07-15 2022-09-13 株式会社牧田 自动刨床
CN110744729B (zh) * 2019-09-27 2021-09-07 湖南怀化永久轻建屋面科技开发有限公司 一种仿陶瓷复合板快速切割设备及方法
CN113523849A (zh) * 2021-07-07 2021-10-22 苏州屹源康机电科技有限公司 一种cnc数控机床精密工件加工方法
JP2023177773A (ja) 2022-06-03 2023-12-14 株式会社ディスコ 固定部材、流体噴射ノズル機構

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936845B2 (ja) 1979-04-10 1984-09-06 凸版印刷株式会社 立体模様を有する合成樹脂成形品の製造方法
JP2617001B2 (ja) 1989-10-12 1997-06-04 株式会社東京精密 ダイシングマシン
JP2005219129A (ja) * 2004-02-03 2005-08-18 Disco Abrasive Syst Ltd 切削装置
JP4664788B2 (ja) 2005-09-26 2011-04-06 株式会社ディスコ 切削装置
JP5060195B2 (ja) * 2007-08-01 2012-10-31 株式会社ディスコ 切削装置
JP5399662B2 (ja) * 2008-08-19 2014-01-29 株式会社ディスコ 切削装置
JP5523041B2 (ja) * 2009-09-29 2014-06-18 株式会社ディスコ 撮像装置
JP2012179642A (ja) * 2011-03-02 2012-09-20 Disco Corp レーザー加工装置
JP2012223855A (ja) * 2011-04-20 2012-11-15 Disco Corp 加工装置
JP5839887B2 (ja) * 2011-08-24 2016-01-06 株式会社ディスコ 加工装置
JP5769605B2 (ja) 2011-12-02 2015-08-26 株式会社ディスコ 切削装置
CN202747758U (zh) * 2012-07-20 2013-02-20 湖北凯乐光电有限公司 射频缆轧纹芯线涡流吹干装置
JP2015047621A (ja) * 2013-09-02 2015-03-16 三菱重工業株式会社 複合加工装置及び複合加工方法
JP2015205362A (ja) * 2014-04-18 2015-11-19 株式会社ディスコ レーザ変位計及び研削装置
CN204505011U (zh) * 2015-02-05 2015-07-29 浙江杰克机床有限公司 一种数字激光端面检测机构
JP2016215343A (ja) * 2015-05-22 2016-12-22 ファナック株式会社 清掃手段を備えた工作機械

Also Published As

Publication number Publication date
KR102504620B1 (ko) 2023-02-27
KR20180138527A (ko) 2018-12-31
TWI754746B (zh) 2022-02-11
TW201904705A (zh) 2019-02-01
JP2019009175A (ja) 2019-01-17
CN109093863B (zh) 2021-12-21
CN109093863A (zh) 2018-12-28

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