JP6964461B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6964461B2 JP6964461B2 JP2017151416A JP2017151416A JP6964461B2 JP 6964461 B2 JP6964461 B2 JP 6964461B2 JP 2017151416 A JP2017151416 A JP 2017151416A JP 2017151416 A JP2017151416 A JP 2017151416A JP 6964461 B2 JP6964461 B2 JP 6964461B2
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- 239000004065 semiconductor Substances 0.000 title claims description 69
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 152
- 229920005591 polysilicon Polymers 0.000 claims description 152
- 239000000758 substrate Substances 0.000 claims description 67
- 230000002457 bidirectional effect Effects 0.000 claims description 59
- 239000010410 layer Substances 0.000 description 154
- 239000011229 interlayer Substances 0.000 description 34
- 239000012535 impurity Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
- H01L29/42336—Gate electrodes for transistors with a floating gate with one gate at least partly formed in a trench
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7804—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4983—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET with a lateral structure, e.g. a Polysilicon gate with a lateral doping variation or with a lateral composition variation or characterised by the sidewalls being composed of conductive, resistive or dielectric material
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
B フィールド領域
10 高濃度半導体基板
11 半導体層
12 ベース領域
13 ソース領域
14 ベースコンタクト領域
15 エピタキシャル層
16 基板
17 ドレイン領域
20 トレンチ
21 ゲート絶縁膜
22 ゲート電極
23 231 232 233 P型ポリシリコン層
24 241 242 N型ポリシリコン層
25 双方向ダイオード
26 層間絶縁膜
30 コンタクトプラグ
31 ソース電極
32 ドレイン電極
33 ゲートパッド
901 縦型MOSFET
910 高濃度半導体基板
911 半導体層
912 ベース領域
913 ソース領域
914 ベースコンタクト領域
915 エピタキシャル層
916 基板
917 ドレイン領域
918 フィールド酸化膜
921 ゲート絶縁膜
922 ゲート電極
923 9231 9232 9233 P型ポリシリコン層
924 9241 9242 N型ポリシリコン層
925 双方向ダイオード
926 層間絶縁膜
931 ソース電極
932 ドレイン電極
933 ゲートパッド
Claims (5)
- 基板と、
前記基板内に設けられた第一導電型のドレイン領域及びソース領域と、
前記ドレイン領域と前記ソース領域との間に設けられた第二導電型のベース領域と、
前記ベース領域にチャネルが形成されるように、ゲート絶縁膜を介して前記ベース領域と接する第一導電型の第一のポリシリコン層からなるゲート電極と、
前記ゲート電極を含み、前記ゲート電極が一端となるように構成された双方向ダイオードと、
前記ソース領域、前記ベース領域、及び前記双方向ダイオードの他端と電気的に接続されたソース電極と、
前記基板の裏面上に前記ドレイン領域に接して設けられたドレイン電極とを備え、
前記双方向ダイオードは、前記ゲート電極上に設けられた第二導電型の第二のポリシリコン層と、前記第二のポリシリコン層上に設けられた第一導電型の第三のポリシリコン層とをさらに含み、
前記ゲート電極、前記第二のポリシリコン層、及び前記第三のポリシリコン層は、前記基板に垂直な方向に、この順に配置されており、
前記ドレイン領域は、前記基板の裏面から所定の厚さを有して前記基板に設けられ、
前記基板の表面から前記ドレイン領域の上面に達するトレンチをさらに備え、
前記ゲート絶縁膜は、前記トレンチの内側の底面及び側面を覆っており、
前記ゲート電極及び前記第二のポリシリコン層は、前記トレンチ内に埋め込まれていることを特徴とする半導体装置。 - 前記第三のポリシリコン層は、前記トレンチ内に埋め込まれていることを特徴とする請求項1に記載の半導体装置。
- 前記双方向ダイオードは、前記第三のポリシリコン層上に、第二導電型の第四のポリシリコン層と、第一導電型の第五のポリシリコン層とをさらに有し、
前記第四のポリシリコン層、及び前記第五のポリシリコン層は、前記基板に垂直な方向に、この順に配置されていることを特徴とする請求項2に記載の半導体装置。 - 前記第四のポリシリコン層は、前記トレンチ内に埋め込まれていることを特徴とする請求項3に記載の半導体装置。
- 前記第五のポリシリコン層は、前記トレンチ内に埋め込まれていることを特徴とする請求項4に記載の半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017151416A JP6964461B2 (ja) | 2017-08-04 | 2017-08-04 | 半導体装置 |
TW107125493A TW201911576A (zh) | 2017-08-04 | 2018-07-24 | 半導體裝置 |
US16/050,888 US10347620B2 (en) | 2017-08-04 | 2018-07-31 | Semiconductor device |
KR1020180090358A KR20190015141A (ko) | 2017-08-04 | 2018-08-02 | 반도체 장치 |
CN201810869571.7A CN109390333A (zh) | 2017-08-04 | 2018-08-02 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017151416A JP6964461B2 (ja) | 2017-08-04 | 2017-08-04 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019033109A JP2019033109A (ja) | 2019-02-28 |
JP6964461B2 true JP6964461B2 (ja) | 2021-11-10 |
Family
ID=65231725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017151416A Active JP6964461B2 (ja) | 2017-08-04 | 2017-08-04 | 半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10347620B2 (ja) |
JP (1) | JP6964461B2 (ja) |
KR (1) | KR20190015141A (ja) |
CN (1) | CN109390333A (ja) |
TW (1) | TW201911576A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7057044B2 (ja) * | 2018-02-22 | 2022-04-19 | ラピスセミコンダクタ株式会社 | 半導体装置および半導体装置の製造方法 |
CN112201687A (zh) * | 2020-10-30 | 2021-01-08 | 深圳市威兆半导体有限公司 | 一种npn三明治栅结构的沟槽mosfet器件 |
KR20220111994A (ko) | 2021-02-03 | 2022-08-10 | 최준 | 유전 알고리즘 기반 의류 도면 디자인 |
KR20220157013A (ko) | 2021-05-20 | 2022-11-29 | 김경효 | 메터버스 서버를 구비한 다품종 소량생산 시스템 |
CN116525663B (zh) * | 2023-07-05 | 2023-09-12 | 江苏应能微电子股份有限公司 | 具有闸源端夹止结构的沟槽式功率mosfet器件及其制备方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5849447B2 (ja) | 1977-01-19 | 1983-11-04 | 昭和電工株式会社 | 棒材位置決め装置 |
JPH04111363A (ja) * | 1990-08-30 | 1992-04-13 | Hitachi Ltd | 半導体装置 |
JP3298476B2 (ja) | 1997-10-31 | 2002-07-02 | 関西日本電気株式会社 | Mosトランジスタの製造方法 |
JP5391261B2 (ja) | 2000-03-06 | 2014-01-15 | ローム株式会社 | 半導体装置 |
JP4917709B2 (ja) * | 2000-03-06 | 2012-04-18 | ローム株式会社 | 半導体装置 |
JP2002314085A (ja) * | 2001-04-13 | 2002-10-25 | Sanyo Electric Co Ltd | Mosfetの保護装置 |
DE102011079747A1 (de) * | 2010-07-27 | 2012-02-02 | Denso Corporation | Halbleitervorrichtung mit Schaltelement und Freilaufdiode, sowie Steuerverfahren hierfür |
US8435853B2 (en) * | 2010-08-30 | 2013-05-07 | Infineon Technologies Ag | Method for forming a semiconductor device, and a semiconductor with an integrated poly-diode |
US8653535B2 (en) * | 2010-09-06 | 2014-02-18 | Panasonic Corporation | Silicon carbide semiconductor device having a contact region that includes a first region and a second region, and process for production thereof |
JP5990986B2 (ja) * | 2012-04-10 | 2016-09-14 | 三菱電機株式会社 | 保護ダイオード |
US10236370B2 (en) * | 2015-09-15 | 2019-03-19 | Hitachi, Ltd. | Semiconductor device and method of manufacturing the same, power converter, three-phase motor system, automobile and railway vehicle |
-
2017
- 2017-08-04 JP JP2017151416A patent/JP6964461B2/ja active Active
-
2018
- 2018-07-24 TW TW107125493A patent/TW201911576A/zh unknown
- 2018-07-31 US US16/050,888 patent/US10347620B2/en not_active Expired - Fee Related
- 2018-08-02 KR KR1020180090358A patent/KR20190015141A/ko unknown
- 2018-08-02 CN CN201810869571.7A patent/CN109390333A/zh not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US10347620B2 (en) | 2019-07-09 |
CN109390333A (zh) | 2019-02-26 |
JP2019033109A (ja) | 2019-02-28 |
KR20190015141A (ko) | 2019-02-13 |
TW201911576A (zh) | 2019-03-16 |
US20190043853A1 (en) | 2019-02-07 |
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