JP6952737B2 - 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法 - Google Patents

保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法 Download PDF

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Publication number
JP6952737B2
JP6952737B2 JP2019098125A JP2019098125A JP6952737B2 JP 6952737 B2 JP6952737 B2 JP 6952737B2 JP 2019098125 A JP2019098125 A JP 2019098125A JP 2019098125 A JP2019098125 A JP 2019098125A JP 6952737 B2 JP6952737 B2 JP 6952737B2
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English (en)
Japanese (ja)
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JP2020193830A (ja
Inventor
早織 礒野
早織 礒野
根鍋 昔
根鍋 昔
和志 宮田
和志 宮田
雄大 高森
雄大 高森
幹司 石橋
幹司 石橋
善夏 黄
善夏 黄
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Towa Corp
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Towa Corp
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Priority to JP2019098125A priority Critical patent/JP6952737B2/ja
Priority to CN202010271789.XA priority patent/CN111981976B/zh
Priority to TW109113118A priority patent/TWI737266B/zh
Priority to KR1020200047365A priority patent/KR20200135163A/ko
Priority to JP2020132999A priority patent/JP6968949B2/ja
Publication of JP2020193830A publication Critical patent/JP2020193830A/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Led Device Packages (AREA)
JP2019098125A 2019-05-24 2019-05-24 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法 Active JP6952737B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019098125A JP6952737B2 (ja) 2019-05-24 2019-05-24 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法
CN202010271789.XA CN111981976B (zh) 2019-05-24 2020-04-08 保持构件及制法、检查机构、切断装置、保持对象物制法
TW109113118A TWI737266B (zh) 2019-05-24 2020-04-20 保持構件、檢查機構、切斷裝置、保持對象物的製造方法及保持構件的製造方法
KR1020200047365A KR20200135163A (ko) 2019-05-24 2020-04-20 보유 지지 부재, 검사 기구, 절단 장치, 보유 지지 대상물의 제조 방법 및 보유 지지 부재의 제조 방법
JP2020132999A JP6968949B2 (ja) 2019-05-24 2020-08-05 保持部材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019098125A JP6952737B2 (ja) 2019-05-24 2019-05-24 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020132999A Division JP6968949B2 (ja) 2019-05-24 2020-08-05 保持部材の製造方法

Publications (2)

Publication Number Publication Date
JP2020193830A JP2020193830A (ja) 2020-12-03
JP6952737B2 true JP6952737B2 (ja) 2021-10-20

Family

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JP2019098125A Active JP6952737B2 (ja) 2019-05-24 2019-05-24 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法

Country Status (4)

Country Link
JP (1) JP6952737B2 (zh)
KR (1) KR20200135163A (zh)
CN (1) CN111981976B (zh)
TW (1) TWI737266B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112873391A (zh) * 2021-01-07 2021-06-01 苏州艾科瑞思智能装备股份有限公司 一种应用于电子器件的切割分选机
JP2023047750A (ja) * 2021-09-27 2023-04-06 Ｔｏｗａ株式会社 半導体装置およびその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697215A (ja) * 1992-09-11 1994-04-08 Hitachi Ltd 小物品群付貼着シートおよびそれが使用される小物品のピックアップ方法
JP3321503B2 (ja) 1994-12-28 2002-09-03 太陽誘電株式会社 電子部品の外観検査装置
DE69936041T2 (de) * 1998-10-13 2007-09-13 Seiko Epson Corp. Mikrogerät und verfahren zur herstellung eines mikrogeräts
JP3890777B2 (ja) * 1998-10-13 2007-03-07 セイコーエプソン株式会社 マイクロマシン及びマイクロマシンの製造方法及び空間光変調装置
US7314402B2 (en) * 2001-11-15 2008-01-01 Speedfam-Ipec Corporation Method and apparatus for controlling slurry distribution
JP2003340666A (ja) * 2002-05-27 2003-12-02 Dainippon Screen Mfg Co Ltd 吸着テーブルとこれを用いた処理装置
JP2004354157A (ja) * 2003-05-28 2004-12-16 Fuji Photo Film Co Ltd 光計測装置及び光計測方法
CN101021490B (zh) * 2007-03-12 2012-11-14 3i系统公司 平面基板自动检测系统及方法
JP5769572B2 (ja) * 2011-03-30 2015-08-26 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置および基板検査方法
CN107024487B (zh) * 2016-03-10 2023-08-29 上海帆声图像科技有限公司 Ito导电玻璃检测系统及其检测方法
JP6284996B1 (ja) * 2016-11-04 2018-02-28 Ｔｏｗａ株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法
JP6861602B2 (ja) * 2017-09-15 2021-04-21 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置

Also Published As

Publication number Publication date
JP2020193830A (ja) 2020-12-03
TW202113306A (zh) 2021-04-01
CN111981976A (zh) 2020-11-24
TWI737266B (zh) 2021-08-21
KR20200135163A (ko) 2020-12-02
CN111981976B (zh) 2022-08-02

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