JP6930224B2 - Efem及びefemへの置換ガスの導入方法 - Google Patents
Efem及びefemへの置換ガスの導入方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 17
- 238000004891 communication Methods 0.000 claims description 44
- 238000007599 discharging Methods 0.000 claims description 17
- 238000009751 slip forming Methods 0.000 claims description 7
- 239000007789 gas Substances 0.000 description 131
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 81
- 229910001873 dinitrogen Inorganic materials 0.000 description 55
- 235000012431 wafers Nutrition 0.000 description 20
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 15
- 239000001301 oxygen Substances 0.000 description 15
- 229910052760 oxygen Inorganic materials 0.000 description 15
- 229910052757 nitrogen Inorganic materials 0.000 description 13
- 238000012545 processing Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Description
置換ガスを導入可能な第1室と、
フィルタが設けられており循環気流の形成時に前記第1室から前記置換ガスが流入する第1連通部と、前記循環気流の形成時に前記第1室へ前記置換ガスが流出する第2連通部と、を介して、前記第1室の下方に接続する第2室と、
前記第1室と前記第2室との間で前記循環気流を形成する気流形成部と、
前記第1室または前記第2室から気体を排出する気体排出部と、
前記第1室に配置されており、少なくとも水平方向である第1の方向に沿って断続的又は連続的に形成される第1開口を有しており、置換ガス供給源から供給された前記置換ガスを前記第1開口から前記第1室に放出する第1ノズルと、
前記第1の方向に平行な方向に沿って断続的又は連続的に形成される第2開口を有しており、前記置換ガス供給源から供給された前記置換ガスを前記第2開口から放出する第2ノズルと、を有する。
前記第1室に配置されている前記第1ノズルと、前記第2室に配置されている前記第2ノズルとは、前記気流形成部及び前記フィルタを上下方向から挟むように配置されていてもよい。
第1室に配置されており、少なくとも水平方向である第1の方向に沿って断続的又は連続的に形成される第1開口を有する第1ノズルを用いて、置換ガス供給源から供給された置換ガスを前記第1開口から前記第1室に放出する第1放出ステップと、
前記第1の方向に平行な方向に沿って断続的又は連続的に形成される第2開口を有する第2ノズルを用いて、前記置換ガス供給源から供給された前記置換ガスを前記第2開口から放出する第2放出ステップと、
フィルタが設けられており循環気流の形成時に前記第1室から前記置換ガスが流入する第1連通部と、前記循環気流の形成時に前記第1室へ前記置換ガスが流出する第2連通部と、を介して、前記第1室の下方に接続する第2室、または前記第1室から気体を排出する排出ステップと、
前記第1室と前記第2室との間で前記循環気流を形成する気流形成部の駆動を調整する気流調整ステップと、を有する。
図1は、本発明の第1実施形態に係るEFEM50の概略図であり、EFEM50(イーフェム、Equipment Front End Module)は、半導体工場において、ウエハを搬送するウエハ搬送容器であるフープ(不図示)と、ウエハに対して処理を行う処理室(不図示)との間で、ウエハを受け渡すために用いられる装置である。
54…第1室
54a…第1進行領域
54b…第1戻り領域
58…第1連通部
60…気流形成部
61…送風ファン
62…フィルタ
64…第2室
64a…第2進行領域
64b…第2戻り領域
65…第2連通部
66…酸素濃度計
67…下部連通部
68…気体排出部
69…中間壁
71、271…第1ノズル
71a、271a…第1開口
72、272、472…第2ノズル
72a、272a、472a…第2開口
73…第3ノズル
73a…第3開口
74…第4ノズル
74a…第4開口
75、175、275、375、475…配管
78…置換ガス供給源
90…矢印
L1、L2、L3、L4…長さ
L5、L6…間隔
Claims (4)
- 置換ガスを導入可能な第1室と、
フィルタが設けられており循環気流の形成時に前記第1室から前記置換ガスが流入する第1連通部と、前記循環気流の形成時に前記第1室へ前記置換ガスが流出する第2連通部と、を介して、前記第1室の下方に接続する第2室と、
前記第1室と前記第2室との間で前記循環気流を形成する気流形成部と、
前記第1室または前記第2室から気体を排出する気体排出部と、
前記第1室に配置されており、少なくとも水平方向である第1の方向に沿って断続的又は連続的に形成される第1開口を有しており、置換ガス供給源から供給された前記置換ガスを前記第1開口から前記第1室に放出する第1ノズルと、
前記第1の方向に平行な方向に沿って断続的又は連続的に形成される第2開口を有しており、前記置換ガス供給源から供給された前記置換ガスを前記第2開口から放出する第2ノズルと、を有し、
前記第2ノズルは前記第2室に配置されており、前記置換ガスを前記第2室に放出することを特徴とするEFEM。 - 前記気流形成部は、前記第1連通部に前記フィルタと並んで設けられており、
前記第1室に配置されている前記第1ノズルと、前記第2室に配置されている前記第2ノズルとは、前記気流形成部及び前記フィルタを上下方向から挟むように配置されていることを特徴とする請求項1に記載のEFEM。 - 第1室に配置されており、少なくとも水平方向である第1の方向に沿って断続的又は連続的に形成される第1開口を有する第1ノズルを用いて、置換ガス供給源から供給された置換ガスを前記第1開口から前記第1室に放出する第1放出ステップと、
前記第1の方向に平行な方向に沿って断続的又は連続的に形成される第2開口を有する第2ノズルを用いて、前記置換ガス供給源から供給された前記置換ガスを前記第2開口から放出する第2放出ステップと、
フィルタが設けられており循環気流の形成時に前記第1室から前記置換ガスが流入する第1連通部と、前記循環気流の形成時に前記第1室へ前記置換ガスが流出する第2連通部と、を介して、前記第1室の下方に接続する第2室、または前記第1室から気体を排出する排出ステップと、
前記第1室と前記第2室との間で前記循環気流を形成する気流形成部の駆動を調整する気流調整ステップと、
を有し、
前記第1放出ステップと、前記第2放出ステップとは、前記気流調整ステップにおいて前記気流形成部の駆動を停止した状態で行われるEFEMへの置換ガスの導入方法。 - 第1室に配置されており、少なくとも水平方向である第1の方向に沿って断続的又は連続的に形成される第1開口を有する第1ノズルを用いて、置換ガス供給源から供給された置換ガスを前記第1開口から前記第1室に放出する第1放出ステップと、
前記第1の方向に平行な方向に沿って断続的又は連続的に形成される第2開口を有する第2ノズルを用いて、前記置換ガス供給源から供給された前記置換ガスを前記第2開口から放出する第2放出ステップと、
フィルタが設けられており循環気流の形成時に前記第1室から前記置換ガスが流入する第1連通部と、前記循環気流の形成時に前記第1室へ前記置換ガスが流出する第2連通部と、を介して、前記第1室の下方に接続する第2室、または前記第1室から気体を排出する排出ステップと、
前記第1室と前記第2室との間で前記循環気流を形成する気流形成部の駆動を調整する気流調整ステップと、
を有し、
前記第2ノズルは前記第2室に配置されており、前記第2放出ステップは、前記置換ガスを前記第2室に放出することを特徴とするEFEMへの置換ガスの導入方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2017108662A JP6930224B2 (ja) | 2017-05-31 | 2017-05-31 | Efem及びefemへの置換ガスの導入方法 |
US15/991,960 US11145529B2 (en) | 2017-05-31 | 2018-05-29 | EFEM and method of introducing replacement gas thereinto |
TW107118477A TWI673765B (zh) | 2017-05-31 | 2018-05-30 | 設備前端模組及向設備前端模組導入置換氣體的方法 |
CN201810550223.3A CN108987319B (zh) | 2017-05-31 | 2018-05-31 | Efem及向efem导入置换气体的方法 |
KR1020180062355A KR102164687B1 (ko) | 2017-05-31 | 2018-05-31 | Efem 및 efem으로의 치환 가스 도입 방법 |
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KR102171905B1 (ko) * | 2019-04-10 | 2020-10-30 | 이창은 | 오염 방지 기능이 향상된 efem |
KR102159270B1 (ko) * | 2019-04-10 | 2020-09-23 | 이창은 | 오염 방지 기능이 향상된 efem |
CN111524776B (zh) * | 2020-04-30 | 2023-10-13 | 北京北方华创微电子装备有限公司 | 前端模块及其控制方法、半导体加工设备 |
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JP3402713B2 (ja) * | 1993-12-10 | 2003-05-06 | 東京エレクトロン株式会社 | 熱処理装置 |
JPH08335572A (ja) * | 1995-06-07 | 1996-12-17 | Hitachi Ltd | 半導体製造装置 |
JP3406887B2 (ja) * | 2000-03-24 | 2003-05-19 | 三菱電機ビルテクノサービス株式会社 | フィルタの洗浄装置 |
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CN204880077U (zh) * | 2015-05-20 | 2015-12-16 | 谢祚祥 | 混合式排汽回收装置 |
KR101785330B1 (ko) * | 2015-05-29 | 2017-10-18 | 국제엘렉트릭코리아 주식회사 | 퍼니스형 기판 처리 장치, 기판 처리용 클러스터 설비 및 기판 처리 방법 |
JP6048770B2 (ja) * | 2015-06-26 | 2016-12-21 | Tdk株式会社 | パージノズル |
TW202429615A (zh) * | 2015-08-04 | 2024-07-16 | 日商昕芙旎雅股份有限公司 | 門開閉系統及具備門開閉系統之載入埠 |
US10515834B2 (en) * | 2015-10-12 | 2019-12-24 | Lam Research Corporation | Multi-station tool with wafer transfer microclimate systems |
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