JP2017108049A - Efemにおけるウエハ搬送部及びロードポート部の制御方法 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Abstract
Description
処理室に搬送されるウエハが通過するウエハ搬送室を有するウエハ搬送部と、前記ウエハを収容する容器に形成された主開口を前記ウエハ搬送室に気密に接続するロードポート部と、を有するEFEMにおけるウエハ搬送部及びロードポート部の制御方法であって、
前記容器を、前記ロードポート部の載置台に固定する工程と、
前記主開口が閉じられた状態で、前記載置台に載置された前記容器の底面に形成された複数の底孔に、前記ロードポート部のボトムノズルを接続し、前記ボトムノズルを介して前記容器の内部に清浄化ガスの導入及び前記容器からの気体の排出を行う第1清浄化工程と、
前記ボトムノズルからの清浄化ガスの導入を停止し、前記主開口を開放して前記容器と前記ウエハ搬送室とを気密に接続する接続工程と、
前記容器から前記処理室まで、開放された前記主開口及び前記ウエハ搬送室を通過させて前記ウエハを搬送し、前記処理室から前記容器まで、前記ウエハ搬送室及び開放された前記主開口を通過させて前記ウエハを搬送するウエハ搬送工程と、を有する。
前記接続工程は、前記検出工程によって前記容器内が所定の状態を超えて清浄となっていることを検出した後に行われてもよい。
図1に示すように、本発明の一実施形態に係る制御方法に用いられるEFEM50は、半導体処理装置のフロントエンドモジュールであり、ロードポート部10と、ウエハ搬送部51とを有する。EFEM50のウエハ搬送室52は、ウエハ1を搬送する容器としてのフープ(FOUP)2と処理室(不図示)とを連結する空間であり、ウエハ搬送室52内に配置された搬送ロボット54は、フープ2内のウエハ1を、処理室に搬送する。したがって、処理室において所定の処理がなされるウエハ1は、フープ2内から、ウエハ搬送室52を通過して、処理室に搬送される。
2… フープ
2f… 底面
4… 蓋
5… 第1の底孔
6… 第2の底孔
10… ロードポート部
11… 壁部材
14… 載置台
17… フロントガス導入部
17a… 放出ノズル
18… 開閉部
18a… ドア
20… 気体排出部
21… 第1のボトムノズル
22… 第1配管部
24… 強制排出手段
30… ボトムガス導入部
31… 第2のボトムノズル
32… 第2配管部
55… 整流板
50、150… EFEM
51、151… ウエハ搬送部
52… ウエハ搬送室
57… 循環流路
59… 搬送室ファン
80… 下降気流
C… 底面中央
Claims (5)
- 処理室に搬送されるウエハが通過するウエハ搬送室を有するウエハ搬送部と、前記ウエハを収容する容器に形成された主開口を前記ウエハ搬送室に気密に接続するロードポート部と、を有するEFEMにおけるウエハ搬送部及びロードポート部の制御方法であって、
前記容器を、前記ロードポート部の載置台に固定する工程と、
前記主開口が閉じられた状態で、前記載置台に載置された前記容器の底面に形成された複数の底孔に、前記ロードポート部のボトムノズルを接続し、前記ボトムノズルを介して前記容器の内部に清浄化ガスの導入及び前記容器からの気体の排出を行う第1清浄化工程と、
前記ボトムノズルからの清浄化ガスの導入を停止し、前記主開口を開放して前記容器と前記ウエハ搬送室とを気密に接続する接続工程と、
前記容器から前記処理室まで、開放された前記主開口及び前記ウエハ搬送室を通過させて前記ウエハを搬送し、前記処理室から前記容器まで、前記ウエハ搬送室及び開放された前記主開口を通過させて前記ウエハを搬送するウエハ搬送工程と、を有する制御方法。 - 前記容器内の清浄度を検出する検出工程をさらに有し、
前記接続工程は、前記検出工程によって前記容器内が所定の状態を超えて清浄となっていることを検出した後に行われることを特徴とする請求項1に記載の制御方法。 - 開放された前記主開口を介して、前記ウエハ搬送室から前記容器の内部へ気体を導入する第2清浄化工程を、さらに有する制御方法。
- 前記第2清浄化工程では、前記ウエハ搬送室内の下降気流の一部を前記主開口へ導く整流板によって、前記ウエハ搬送室から前記容器の内部へ気体を導入することを特徴とする請求項3に記載の制御方法。
- 前記第2清浄化工程では、前記第1清浄化工程で前記底孔に接続された前記ボトムノズルのうち、前記容器の底面のうち底面中央に比べて前記主開口から離間する位置に形成された底孔に連通する少なくとも1つを介して、前記容器内の気体を排出することを特徴とする請求項3又は請求項4に記載の制御方法。
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JP2015242040A JP2017108049A (ja) | 2015-12-11 | 2015-12-11 | Efemにおけるウエハ搬送部及びロードポート部の制御方法 |
US15/373,210 US10566227B2 (en) | 2015-12-11 | 2016-12-08 | Controlling method for a wafer transportation part and a load port part on an EFEM |
CN201611127710.6A CN106876310B (zh) | 2015-12-11 | 2016-12-09 | Efem中的晶圆搬运部及装载端口部的控制方法 |
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JP2019153720A (ja) * | 2018-03-05 | 2019-09-12 | Tdk株式会社 | ウエハ搬送容器及びウエハ搬送容器の位置検出方法、ウエハ搬送容器の位置及び衝撃検出方法、ウエハ搬送容器の移動速度及び加速度制御方法、ウエハ搬送容器内清浄化方法。 |
JP2020031194A (ja) * | 2018-08-24 | 2020-02-27 | 東京エレクトロン株式会社 | 基板搬送モジュール及び基板搬送方法 |
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US10861723B2 (en) * | 2017-08-08 | 2020-12-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | EFEM robot auto teaching methodology |
JP6963179B2 (ja) * | 2018-03-15 | 2021-11-05 | シンフォニアテクノロジー株式会社 | Efem |
JP7037049B2 (ja) * | 2018-03-15 | 2022-03-16 | シンフォニアテクノロジー株式会社 | Efem |
JP7428959B2 (ja) * | 2019-10-07 | 2024-02-07 | Tdk株式会社 | ロードポート装置、ロードポート装置の駆動方法 |
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JP2020031194A (ja) * | 2018-08-24 | 2020-02-27 | 東京エレクトロン株式会社 | 基板搬送モジュール及び基板搬送方法 |
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US20170170044A1 (en) | 2017-06-15 |
CN106876310B (zh) | 2021-04-16 |
US10566227B2 (en) | 2020-02-18 |
CN106876310A (zh) | 2017-06-20 |
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