JP6929968B2 - バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス - Google Patents

バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス Download PDF

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Publication number
JP6929968B2
JP6929968B2 JP2019560218A JP2019560218A JP6929968B2 JP 6929968 B2 JP6929968 B2 JP 6929968B2 JP 2019560218 A JP2019560218 A JP 2019560218A JP 2019560218 A JP2019560218 A JP 2019560218A JP 6929968 B2 JP6929968 B2 JP 6929968B2
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Japan
Prior art keywords
gate
finger
jumper
gate finger
transistor
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JP2019560218A
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Japanese (ja)
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JP2020519025A (ja
Inventor
エム． ウッド、サイモン
エム． ウッド、サイモン
ミリガン、ジェイムズ
フラワーズ、ミッチェル
ファレル、ドナルド
フェイド、カーレッド
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Wolfspeed Inc
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Cree Inc
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Publication date
Priority claimed from US15/587,830 external-priority patent/US10128365B2/en
Priority claimed from US15/608,048 external-priority patent/US9947616B2/en
Application filed by Cree Inc filed Critical Cree Inc
Publication of JP2020519025A publication Critical patent/JP2020519025A/ja
Priority to JP2021131203A priority Critical patent/JP7242777B2/ja
Application granted granted Critical
Publication of JP6929968B2 publication Critical patent/JP6929968B2/ja
Priority to JP2023035192A priority patent/JP2023081974A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
    • H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Amplifiers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Microwave Amplifiers (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
JP2019560218A 2017-05-05 2018-05-03 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス Active JP6929968B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021131203A JP7242777B2 (ja) 2017-05-05 2021-08-11 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス
JP2023035192A JP2023081974A (ja) 2017-05-05 2023-03-08 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/587,830 US10128365B2 (en) 2016-03-17 2017-05-05 Bypassed gate transistors having improved stability
US15/587,830 2017-05-05
US15/608,048 2017-05-30
US15/608,048 US9947616B2 (en) 2016-03-17 2017-05-30 High power MMIC devices having bypassed gate transistors
PCT/US2018/030863 WO2018204622A1 (en) 2017-05-05 2018-05-03 High power mmic devices having bypassed gate transistors

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021131203A Division JP7242777B2 (ja) 2017-05-05 2021-08-11 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス

Publications (2)

Publication Number Publication Date
JP2020519025A JP2020519025A (ja) 2020-06-25
JP6929968B2 true JP6929968B2 (ja) 2021-09-01

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
JP2019560218A Active JP6929968B2 (ja) 2017-05-05 2018-05-03 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス
JP2021131203A Active JP7242777B2 (ja) 2017-05-05 2021-08-11 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス
JP2023035192A Pending JP2023081974A (ja) 2017-05-05 2023-03-08 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021131203A Active JP7242777B2 (ja) 2017-05-05 2021-08-11 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス
JP2023035192A Pending JP2023081974A (ja) 2017-05-05 2023-03-08 バイパス・ゲート式トランジスタを備える高出力ｍｍｉｃデバイス

Country Status (4)

Country Link
EP (1) EP3619738A4 (zh)
JP (3) JP6929968B2 (zh)
CN (2) CN116403982A (zh)
WO (1) WO2018204622A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111370474B (zh) * 2020-04-23 2023-10-24 上海华虹宏力半导体制造有限公司 沟槽栅器件的栅极串联电阻
CN116504791A (zh) * 2020-06-28 2023-07-28 京东方科技集团股份有限公司 一种薄膜晶体管、栅极行驱动电路及阵列基板
EP4393009A1 (en) * 2021-10-01 2024-07-03 MACOM Technology Solutions Holdings, Inc. Bypassed gate transistors having improved stability
WO2023136121A1 (ja) * 2022-01-13 2023-07-20 住友電気工業株式会社 半導体装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687505B2 (ja) * 1987-12-22 1994-11-02 日本電気株式会社 大電力用電界効果トランジスタ
JP2884577B2 (ja) * 1988-10-19 1999-04-19 日本電気株式会社 電界効果トランジスタ
US5500522A (en) * 1991-09-30 1996-03-19 Luminis Pty. Limited Gallium arsenide MESFET imager
US5592006A (en) * 1994-05-13 1997-01-07 International Rectifier Corporation Gate resistor for IGBT
JPH1145891A (ja) * 1997-07-25 1999-02-16 Toshiba Corp 高周波用集積回路素子
US6023086A (en) * 1997-09-02 2000-02-08 Motorola, Inc. Semiconductor transistor with stabilizing gate electrode
JP3515886B2 (ja) * 1997-09-29 2004-04-05 三菱電機株式会社 半導体装置およびその製造方法
JP3269475B2 (ja) * 1998-02-16 2002-03-25 日本電気株式会社 半導体装置
JP3373435B2 (ja) * 1998-06-25 2003-02-04 日本電信電話株式会社 抵抗帰還トランジスタ
JP3542116B2 (ja) * 2000-09-29 2004-07-14 ユーディナデバイス株式会社 高周波回路
JP3712111B2 (ja) * 2001-03-30 2005-11-02 ユーディナデバイス株式会社 電力増幅用半導体装置
JP4361313B2 (ja) * 2003-05-08 2009-11-11 三菱電機株式会社 高周波電力増幅器
US7492235B2 (en) * 2006-10-25 2009-02-17 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Transmission line transistor attenuator
JP5106041B2 (ja) 2007-10-26 2012-12-26 株式会社東芝 半導体装置
JP5238633B2 (ja) * 2009-07-27 2013-07-17 株式会社東芝 半導体装置
US8212321B2 (en) * 2009-10-30 2012-07-03 Freescale Semiconductor, Inc. Semiconductor device with feedback control
JP2012182438A (ja) * 2011-02-08 2012-09-20 Toshiba Corp 半導体装置
US20130313653A1 (en) 2012-05-25 2013-11-28 Infineon Technologies Austria Ag MOS Transistor with Multi-finger Gate Electrode
WO2015178050A1 (ja) * 2014-05-21 2015-11-26 シャープ株式会社 電界効果トランジスタ
JP6227154B2 (ja) 2014-09-17 2017-11-08 シャープ株式会社 化合物半導体電界効果トランジスタ

Also Published As

Publication number Publication date
JP2023081974A (ja) 2023-06-13
JP2020519025A (ja) 2020-06-25
JP2022002308A (ja) 2022-01-06
WO2018204622A1 (en) 2018-11-08
CN110582846A (zh) 2019-12-17
CN110582846B (zh) 2023-05-12
EP3619738A4 (en) 2021-01-13
EP3619738A1 (en) 2020-03-11
JP7242777B2 (ja) 2023-03-20
CN116403982A (zh) 2023-07-07

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