JP6924324B2 - 基板を移動させる方法およびシステム - Google Patents
基板を移動させる方法およびシステム Download PDFInfo
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- JP6924324B2 JP6924324B2 JP2020505910A JP2020505910A JP6924324B2 JP 6924324 B2 JP6924324 B2 JP 6924324B2 JP 2020505910 A JP2020505910 A JP 2020505910A JP 2020505910 A JP2020505910 A JP 2020505910A JP 6924324 B2 JP6924324 B2 JP 6924324B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Description
本出願は、2017年8月3日に出願された米国特許出願第15/668,517号の利益を主張し、同出願の内容は参照によりその全体が本明細書に組み込まれる。
a.シャーシ201に取り付けられている振動分離システム202。振動分離システム202は、移送チャンバ107を支持する。このような構成により、基板フィーチャの高解像度画像に到達することが可能になり、プロセスチャンバ105内の処理の品質が改善する。
b.カバー203および側壁204を含む、評価チャンバのハウジング。
c.チャック205。チャック205は、静電チャックでも機械式チャックでもよい。チャック205は基板を支持することができる。
d.移動システム206。
e.封止板207などの中間要素。
f.移動システムベース208。
g.AB/DPモジュール400。AB/DPはエア軸受/差動排気を表す。
h.評価チャンバのハウジングおよび封止板207によって画定されている真空空間411。
i.移動システムのXY(X軸Y軸)ステージを使用すること。
j.チャックを開口に対して移動させながら、中間要素をチャンバハウジングに対して移動させること。
k.中間要素を任意の方向に、基板の半径の120パーセントを超えない最大距離までだけ移動させること。
Claims (3)
- クラスタツールにおいて基板を処理し評価する方法であって、
前記クラスタツールの外側移送ロボットを用いて前記基板をカセットからロードロックに移送するステップと、
前記クラスタツールの内側移送ロボットを用いて前記基板を前記ロードロックからプロセスチャンバに移送するステップと、
前記クラスタツールの前記プロセスチャンバにおいて前記基板上で製造プロセスを実行するステップと、
前記内側移送ロボットを用いて前記基板を前記プロセスチャンバから前記クラスタツールの評価チャンバに移送するステップであって、前記基板を前記ロードロックから前記プロセスチャンバに移送し、前記基板を前記プロセスチャンバから前記評価チャンバに移送する間に、前記基板が制御された圧力に維持される、ステップと、
チャンバハウジングを含む前記評価チャンバの中に配置されているチャックに前記基板を配置するステップであって、前記チャックが、回転ステージ及びXYステージを含む移動システムに機械的に結合されている、ステップと、
中間要素と前記チャンバハウジングの間に動的シールを少なくとも1つの封止要素によって形成することにより、前記評価チャンバを前記移動システムから封止するステップであって、前記中間要素が前記チャンバハウジングと前記移動システムの間に配置されており、前記移動システムが大気圧にある一方で前記評価チャンバの内側が前記制御された圧力に維持される、ステップと、
前記基板の複数の領域のうちから前記基板の領域ごとに、
(a)前記移動システムの前記回転ステージによって前記チャックを回転させて、前記基板の所与の領域を顕微鏡の視野の中に配置するステップ、
(b)その後、前記移動システムの前記XYステージによって前記チャックを開口に対して移動させて、前記基板の前記所与の領域の追加部分を前記顕微鏡の前記視野の中に配置するステップであって、前記チャックを前記開口に対して移動させる間に前記中間要素を前記チャンバハウジングに対して移動させることを含み、前記移動システムの前記XYステージが、前記チャックを任意の方向に、前記基板の半径の120パーセントを超えない距離までだけ移動させるように構成されている、ステップ、および
(c)前記顕微鏡を使用して、前記基板の前記所与の領域の前記追加部分に位置する疑わしい欠陥を評価するステップ
を繰り返すステップと、
前記評価チャンバにおける疑わしい欠陥の評価の結果に基づいて前記プロセスチャンバにおいて前記製造プロセスのパラメータを調節するステップとを含む、方法。 - 前記顕微鏡が走査型電子顕微鏡である、請求項1に記載の方法。
- 光学顕微鏡を使用して前記疑わしい欠陥を見つけるステップと、前記疑わしい欠陥を前記走査型電子顕微鏡によってスキャンするステップとをさらに含む、請求項2に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/668,517 US10049904B1 (en) | 2017-08-03 | 2017-08-03 | Method and system for moving a substrate |
US15/668,517 | 2017-08-03 | ||
PCT/US2018/045010 WO2019028254A1 (en) | 2017-08-03 | 2018-08-02 | METHOD AND SYSTEM FOR MOVING A SUBSTRATE |
Publications (2)
Publication Number | Publication Date |
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JP2020527295A JP2020527295A (ja) | 2020-09-03 |
JP6924324B2 true JP6924324B2 (ja) | 2021-08-25 |
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Application Number | Title | Priority Date | Filing Date |
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JP2020505910A Active JP6924324B2 (ja) | 2017-08-03 | 2018-08-02 | 基板を移動させる方法およびシステム |
Country Status (6)
Country | Link |
---|---|
US (1) | US10049904B1 (ja) |
JP (1) | JP6924324B2 (ja) |
KR (1) | KR102135238B1 (ja) |
CN (1) | CN111033712B (ja) |
TW (1) | TWI758523B (ja) |
WO (1) | WO2019028254A1 (ja) |
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RU191704U1 (ru) * | 2019-06-03 | 2019-08-19 | Открытое Акционерное Общество "Научно-Исследовательский Институт Полупроводникового Машиностроения (Оао "Ниипм") | Блок центрирования полупроводниковых пластин на вакуумном столике в кластерной линии фотолитографии перед проведением технологических операций |
CN118226177A (zh) * | 2019-06-19 | 2024-06-21 | 泰克元有限公司 | 测试腔室 |
TWI797461B (zh) * | 2019-07-26 | 2023-04-01 | 日商新川股份有限公司 | 封裝裝置 |
US11294164B2 (en) * | 2019-07-26 | 2022-04-05 | Applied Materials Israel Ltd. | Integrated system and method |
US11177048B2 (en) * | 2019-11-20 | 2021-11-16 | Applied Materials Israel Ltd. | Method and system for evaluating objects |
CN111952138A (zh) * | 2020-08-17 | 2020-11-17 | 浙江祺跃科技有限公司 | 一种原位原子层沉积扫描电子显微镜 |
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JPH0729958A (ja) * | 1993-07-14 | 1995-01-31 | Hitachi Ltd | 半導体製造装置 |
JP2000164658A (ja) * | 1998-11-26 | 2000-06-16 | Tokyo Seimitsu Co Ltd | 半導体ウェハのレビューステーション及び外観検査装置 |
US6358324B1 (en) * | 1999-04-27 | 2002-03-19 | Tokyo Electron Limited | Microwave plasma processing apparatus having a vacuum pump located under a susceptor |
JP4939235B2 (ja) * | 2000-07-27 | 2012-05-23 | 株式会社荏原製作所 | シートビーム式検査装置 |
US6764386B2 (en) * | 2002-01-11 | 2004-07-20 | Applied Materials, Inc. | Air bearing-sealed micro-processing chamber |
US6899765B2 (en) * | 2002-03-29 | 2005-05-31 | Applied Materials Israel, Ltd. | Chamber elements defining a movable internal chamber |
US7582186B2 (en) * | 2002-12-20 | 2009-09-01 | Tokyo Electron Limited | Method and apparatus for an improved focus ring in a plasma processing system |
JP2005203421A (ja) * | 2004-01-13 | 2005-07-28 | Hitachi High-Technologies Corp | 基板検査方法及び基板検査装置 |
JP2005286102A (ja) * | 2004-03-30 | 2005-10-13 | Hitachi High-Technologies Corp | 真空処理装置および真空処理方法 |
US7428850B2 (en) * | 2005-02-24 | 2008-09-30 | Applied Materials, Israel,Ltd. | Integrated in situ scanning electronic microscope review station in semiconductor wafers and photomasks optical inspection system |
JP4614863B2 (ja) * | 2005-10-24 | 2011-01-19 | ソニー株式会社 | 基板処理装置 |
US20090016853A1 (en) * | 2007-07-09 | 2009-01-15 | Woo Sik Yoo | In-line wafer robotic processing system |
WO2012099579A1 (en) * | 2011-01-18 | 2012-07-26 | Applied Materials Israel Ltd. | Chamber elements and a method for placing a chamber at a load position |
KR101328512B1 (ko) * | 2011-08-17 | 2013-11-13 | 주식회사 쎄크 | 웨이퍼 패턴 검사장치 및 검사방법 |
KR101914231B1 (ko) * | 2012-05-30 | 2018-11-02 | 삼성디스플레이 주식회사 | 주사 전자 현미경을 이용한 검사 시스템 |
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JP6908999B2 (ja) * | 2013-08-12 | 2021-07-28 | アプライド マテリアルズ イスラエル リミテッド | 密封されたチャンバを形成するためのシステムおよび方法 |
WO2015081072A1 (en) * | 2013-11-26 | 2015-06-04 | Applied Materials Israel, Ltd. | System and method for forming a sealed chamber |
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KR101758087B1 (ko) * | 2014-07-23 | 2017-07-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 튜닝가능한 온도 제어되는 기판 지지 어셈블리 |
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- 2018-08-02 KR KR1020207006274A patent/KR102135238B1/ko active IP Right Grant
- 2018-08-02 CN CN201880050681.9A patent/CN111033712B/zh active Active
- 2018-08-02 WO PCT/US2018/045010 patent/WO2019028254A1/en active Application Filing
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Publication number | Publication date |
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US10049904B1 (en) | 2018-08-14 |
WO2019028254A1 (en) | 2019-02-07 |
CN111033712A (zh) | 2020-04-17 |
JP2020527295A (ja) | 2020-09-03 |
KR20200027571A (ko) | 2020-03-12 |
TW201921566A (zh) | 2019-06-01 |
CN111033712B (zh) | 2021-04-02 |
TWI758523B (zh) | 2022-03-21 |
KR102135238B1 (ko) | 2020-07-20 |
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