JP6914245B2 - 複数のダイを含むパッケージオンパッケージ（ｐｏｐ）構造 - Google Patents

複数のダイを含むパッケージオンパッケージ（ｐｏｐ）構造 Download PDF

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JP6914245B2
JP6914245B2 JP2018503557A JP2018503557A JP6914245B2 JP 6914245 B2 JP6914245 B2 JP 6914245B2 JP 2018503557 A JP2018503557 A JP 2018503557A JP 2018503557 A JP2018503557 A JP 2018503557A JP 6914245 B2 JP6914245 B2 JP 6914245B2
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die
layer
conductive path
pid
conductive
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JP2018523919A (ja
JP2018523919A5 (enExample
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ホン・ボク・ウィ
ジェ・シク・イ
ドン・ウク・キム
シチュン・グ
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クアルコム，インコーポレイテッド
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Packaging Frangible Articles (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Die Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Geometry (AREA)
  • Medical Preparation Storing Or Oral Administration Devices (AREA)
  • Packages (AREA)
  • Hybrid Cells (AREA)
  • Optical Measuring Cells (AREA)
  • Measurement Of Radiation (AREA)
JP2018503557A 2015-07-29 2016-07-28 複数のダイを含むパッケージオンパッケージ（ｐｏｐ）構造 Active JP6914245B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/812,476 US9401350B1 (en) 2015-07-29 2015-07-29 Package-on-package (POP) structure including multiple dies
US14/812,476 2015-07-29
PCT/US2016/044487 WO2017019866A1 (en) 2015-07-29 2016-07-28 Package-on-package (pop) structure including multiple dies

Publications (3)

Publication Number Publication Date
JP2018523919A JP2018523919A (ja) 2018-08-23
JP2018523919A5 JP2018523919A5 (enExample) 2019-08-15
JP6914245B2 true JP6914245B2 (ja) 2021-08-04

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US (1) US9401350B1 (enExample)
EP (2) EP4439634A3 (enExample)
JP (1) JP6914245B2 (enExample)
KR (1) KR102546223B1 (enExample)
CN (1) CN107851588B (enExample)
BR (1) BR112018001783B8 (enExample)
CA (1) CA2990470A1 (enExample)
WO (1) WO2017019866A1 (enExample)

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US11574874B2 (en) * 2017-03-30 2023-02-07 Intel Corporation Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch
JP7203037B2 (ja) * 2017-03-31 2023-01-12 スリーエム イノベイティブ プロパティズ カンパニー 固体半導体ダイを含む電子機器
WO2020020825A1 (en) 2018-07-23 2020-01-30 Borealis Ag Multilayer polypropylene film
US10665572B2 (en) * 2018-08-15 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and manufacturing method thereof
US20200083154A1 (en) 2018-09-10 2020-03-12 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic Radiation
WO2020103147A1 (zh) * 2018-11-23 2020-05-28 北京比特大陆科技有限公司 芯片散热结构、芯片结构、电路板和超算设备
EP3723459A1 (en) 2019-04-10 2020-10-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with high passive intermodulation (pim) performance
EP3980473B1 (en) 2019-06-05 2024-08-07 Borealis AG Multilayer polyproplyene film
KR102764370B1 (ko) 2019-12-26 2025-02-07 삼성전자주식회사 반도체 패키지
CN112867243A (zh) * 2021-01-06 2021-05-28 英韧科技(上海)有限公司 多层电路板
US20240222142A1 (en) * 2022-12-28 2024-07-04 Applied Materials, Inc. Efficient autocatalytic metallization of polymeric surfaces

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EP4439634A3 (en) 2025-01-15
EP3329512A1 (en) 2018-06-06
KR102546223B1 (ko) 2023-06-20
CA2990470A1 (en) 2017-02-02
BR112018001783B8 (pt) 2023-02-14
WO2017019866A1 (en) 2017-02-02
BR112018001783B1 (pt) 2023-01-31
EP4439634A2 (en) 2024-10-02
CN107851588A (zh) 2018-03-27
US9401350B1 (en) 2016-07-26
BR112018001783A2 (pt) 2018-09-11

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