JP6906128B2 - ウエハー試験装置 - Google Patents

ウエハー試験装置 Download PDF

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Publication number
JP6906128B2
JP6906128B2 JP2020093761A JP2020093761A JP6906128B2 JP 6906128 B2 JP6906128 B2 JP 6906128B2 JP 2020093761 A JP2020093761 A JP 2020093761A JP 2020093761 A JP2020093761 A JP 2020093761A JP 6906128 B2 JP6906128 B2 JP 6906128B2
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Japan
Prior art keywords
wafer
slide
unit
tray
drive mechanism
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JP2020093761A
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Japanese (ja)
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JP2021005700A5 (https=
JP2021005700A (ja
Inventor
末晴 宮川
末晴 宮川
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Publication of JP2021005700A5 publication Critical patent/JP2021005700A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2020093761A 2019-06-26 2020-04-24 ウエハー試験装置 Active JP6906128B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019130610 2019-06-26
JP2019130610 2019-06-26

Publications (3)

Publication Number Publication Date
JP2021005700A JP2021005700A (ja) 2021-01-14
JP2021005700A5 JP2021005700A5 (https=) 2021-02-25
JP6906128B2 true JP6906128B2 (ja) 2021-07-21

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ID=74060838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020093761A Active JP6906128B2 (ja) 2019-06-26 2020-04-24 ウエハー試験装置

Country Status (2)

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JP (1) JP6906128B2 (https=)
WO (1) WO2020261949A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114054385B (zh) * 2021-11-11 2024-02-09 四川和恩泰半导体有限公司 全自动双头晶片测试机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6267928B2 (ja) * 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
JP6515007B2 (ja) * 2015-09-30 2019-05-15 東京エレクトロン株式会社 ウエハ検査方法及びウエハ検査装置
WO2018235411A1 (ja) * 2017-06-21 2018-12-27 東京エレクトロン株式会社 検査システム
JP6956030B2 (ja) * 2018-02-28 2021-10-27 東京エレクトロン株式会社 検査システム

Also Published As

Publication number Publication date
WO2020261949A1 (ja) 2020-12-30
JP2021005700A (ja) 2021-01-14

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