JP6886928B2 - 真空対応式ｌｅｄ基板ヒータ - Google Patents

真空対応式ｌｅｄ基板ヒータ Download PDF

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JP6886928B2
JP6886928B2 JP2017567324A JP2017567324A JP6886928B2 JP 6886928 B2 JP6886928 B2 JP 6886928B2 JP 2017567324 A JP2017567324 A JP 2017567324A JP 2017567324 A JP2017567324 A JP 2017567324A JP 6886928 B2 JP6886928 B2 JP 6886928B2
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leds
recess
led
pattern
led substrate
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JP2018523305A5 (enExample
JP2018523305A (ja
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ブレント ヴォパット ロバート
ブレント ヴォパット ロバート
イー ワイカ ゲイリー
イー ワイカ ゲイリー
ブラーニック デイビッド
ブラーニック デイビッド
エム シャーラー ジェイソン
エム シャーラー ジェイソン
ティー ウィーバー ウィリアム
ティー ウィーバー ウィリアム
Original Assignee
ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド
ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Device Packages (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Chemical Vapour Deposition (AREA)
JP2017567324A 2015-06-29 2016-06-24 真空対応式ｌｅｄ基板ヒータ Active JP6886928B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/753,991 2015-06-29
US14/753,991 US20160379854A1 (en) 2015-06-29 2015-06-29 Vacuum Compatible LED Substrate Heater
PCT/US2016/039262 WO2017003866A1 (en) 2015-06-29 2016-06-24 Vacuum compatible led substrate heater

Publications (3)

Publication Number Publication Date
JP2018523305A JP2018523305A (ja) 2018-08-16
JP2018523305A5 JP2018523305A5 (enExample) 2019-07-25
JP6886928B2 true JP6886928B2 (ja) 2021-06-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017567324A Active JP6886928B2 (ja) 2015-06-29 2016-06-24 真空対応式ｌｅｄ基板ヒータ

Country Status (6)

Country Link
US (1) US20160379854A1 (enExample)
JP (1) JP6886928B2 (enExample)
KR (1) KR102553101B1 (enExample)
CN (1) CN107710395A (enExample)
TW (1) TW201701428A (enExample)
WO (1) WO2017003866A1 (enExample)

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US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
US11177128B2 (en) 2017-09-12 2021-11-16 Applied Materials, Inc. Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
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US10854483B2 (en) 2017-11-16 2020-12-01 Applied Materials, Inc. High pressure steam anneal processing apparatus
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US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
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KR101961864B1 (ko) 2018-08-17 2019-03-26 남윤종 폐엘이디 칩 분리 장치
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
JP7077989B2 (ja) 2019-02-20 2022-05-31 株式会社デンソー 車両用空調ユニット
JP7198434B2 (ja) * 2019-03-27 2023-01-04 ウシオ電機株式会社 加熱処理方法及び光加熱装置
JP7623305B2 (ja) * 2019-06-24 2025-01-28 ラム リサーチ コーポレーション 基板表面の蒸気洗浄
KR102747715B1 (ko) * 2019-10-15 2024-12-31 주식회사 케이씨텍 복사 열원을 이용한 기판 처리 장치
JP7398935B2 (ja) * 2019-11-25 2023-12-15 東京エレクトロン株式会社 載置台、及び、検査装置
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JP7717717B2 (ja) * 2020-04-01 2025-08-04 ラム リサーチ コーポレーション 熱エッチングのための急速かつ正確な温度制御
JP7677797B2 (ja) * 2021-01-07 2025-05-15 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法

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Also Published As

Publication number Publication date
KR102553101B1 (ko) 2023-07-07
JP2018523305A (ja) 2018-08-16
CN107710395A (zh) 2018-02-16
TW201701428A (zh) 2017-01-01
US20160379854A1 (en) 2016-12-29
KR20180014436A (ko) 2018-02-08
WO2017003866A1 (en) 2017-01-05

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