CN107710395A - 真空兼容的发光二极管基板加热器 - Google Patents

真空兼容的发光二极管基板加热器 Download PDF

Info

Publication number
CN107710395A
CN107710395A CN201680038070.3A CN201680038070A CN107710395A CN 107710395 A CN107710395 A CN 107710395A CN 201680038070 A CN201680038070 A CN 201680038070A CN 107710395 A CN107710395 A CN 107710395A
Authority
CN
China
Prior art keywords
light emitting
emitting diode
base plate
depressed part
plate heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680038070.3A
Other languages
English (en)
Chinese (zh)
Inventor
罗伯特·布然特·宝佩特
盖瑞·E·维卡
大卫·伯拉尼克
杰森·M·夏勒
威廉·T·维弗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Publication of CN107710395A publication Critical patent/CN107710395A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Device Packages (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
CN201680038070.3A 2015-06-29 2016-06-24 真空兼容的发光二极管基板加热器 Pending CN107710395A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/753,991 2015-06-29
US14/753,991 US20160379854A1 (en) 2015-06-29 2015-06-29 Vacuum Compatible LED Substrate Heater
PCT/US2016/039262 WO2017003866A1 (en) 2015-06-29 2016-06-24 Vacuum compatible led substrate heater

Publications (1)

Publication Number Publication Date
CN107710395A true CN107710395A (zh) 2018-02-16

Family

ID=57602729

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680038070.3A Pending CN107710395A (zh) 2015-06-29 2016-06-24 真空兼容的发光二极管基板加热器

Country Status (6)

Country Link
US (1) US20160379854A1 (enExample)
JP (1) JP6886928B2 (enExample)
KR (1) KR102553101B1 (enExample)
CN (1) CN107710395A (enExample)
TW (1) TW201701428A (enExample)
WO (1) WO2017003866A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112838041A (zh) * 2019-11-25 2021-05-25 东京毅力科创株式会社 载置台和检查装置
CN114026674A (zh) * 2019-06-24 2022-02-08 朗姆研究公司 衬底表面的蒸气清洁
CN114743895A (zh) * 2021-01-07 2022-07-12 株式会社斯库林集团 热处理装置及热处理方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
KR102405723B1 (ko) 2017-08-18 2022-06-07 어플라이드 머티어리얼스, 인코포레이티드 고압 및 고온 어닐링 챔버
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
US11177128B2 (en) 2017-09-12 2021-11-16 Applied Materials, Inc. Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
CN117936417A (zh) 2017-11-11 2024-04-26 微材料有限责任公司 用于高压处理腔室的气体输送系统
US10854483B2 (en) 2017-11-16 2020-12-01 Applied Materials, Inc. High pressure steam anneal processing apparatus
KR20200075892A (ko) 2017-11-17 2020-06-26 어플라이드 머티어리얼스, 인코포레이티드 고압 처리 시스템을 위한 컨덴서 시스템
FR3076431A1 (fr) * 2017-12-28 2019-07-05 Aeroform France Dispositif de chauffage sans contact
JP7239598B2 (ja) 2018-03-09 2023-03-14 アプライド マテリアルズ インコーポレイテッド 金属含有材料の高圧アニーリングプロセス
KR102078157B1 (ko) * 2018-04-16 2020-02-17 세메스 주식회사 기판 가열 유닛 및 이를 갖는 기판 처리 장치
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
KR101961864B1 (ko) 2018-08-17 2019-03-26 남윤종 폐엘이디 칩 분리 장치
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
JP7077989B2 (ja) 2019-02-20 2022-05-31 株式会社デンソー 車両用空調ユニット
JP7198434B2 (ja) * 2019-03-27 2023-01-04 ウシオ電機株式会社 加熱処理方法及び光加熱装置
KR102747715B1 (ko) * 2019-10-15 2024-12-31 주식회사 케이씨텍 복사 열원을 이용한 기판 처리 장치
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
JP7717717B2 (ja) * 2020-04-01 2025-08-04 ラム リサーチ コーポレーション 熱エッチングのための急速かつ正確な温度制御

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080277685A1 (en) * 2007-04-24 2008-11-13 Kyung Tae Kim Light emitting diode package
US20090046456A1 (en) * 2005-12-22 2009-02-19 Matsushita Electric Works., Ltd. Lighting Apparatus With Leds
US20100314377A1 (en) * 2007-09-27 2010-12-16 Tokyo Electron Limited Annealing device
US20110002674A1 (en) * 2003-09-24 2011-01-06 Tokyo Electron Limited Thermal processing apparatus
JP2011082492A (ja) * 2009-10-09 2011-04-21 Alti-Semiconductor Co Ltd パックライトユニット及びその製造方法｛ｂａｃｋｌｉｇｈｔｕｎｉｔａｎｄｍｅｔｈｏｄｆｏｒｍａｎｕｆａｃｔｒｉｎｇｔｈｅｒｅｏｆ｝
CN102214766A (zh) * 2010-04-02 2011-10-12 游森溢 发光二极管封装结构

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5937142A (en) * 1996-07-11 1999-08-10 Cvc Products, Inc. Multi-zone illuminator for rapid thermal processing
US6067931A (en) * 1996-11-04 2000-05-30 General Electric Company Thermal processor for semiconductor wafers
US6818864B2 (en) * 2002-08-09 2004-11-16 Asm America, Inc. LED heat lamp arrays for CVD heating
JP3776092B2 (ja) * 2003-03-25 2006-05-17 株式会社ルネサステクノロジ エッチング装置、エッチング方法および半導体装置の製造方法
US20070013057A1 (en) * 2003-05-05 2007-01-18 Joseph Mazzochette Multicolor LED assembly with improved color mixing
KR101073423B1 (ko) * 2005-04-19 2011-10-17 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판, ｌｅｄ, 및 ｌｅｄ 광원 유닛
JP5055756B2 (ja) * 2005-09-21 2012-10-24 東京エレクトロン株式会社 熱処理装置及び記憶媒体
WO2009012301A2 (en) * 2007-07-16 2009-01-22 Lumination Llc Red line emitting complex fluoride phosphors activated with mn4+
JP5084420B2 (ja) * 2007-09-21 2012-11-28 東京エレクトロン株式会社 ロードロック装置および真空処理システム
JP2010129861A (ja) * 2008-11-28 2010-06-10 Tokyo Electron Ltd 熱処理装置
US20110217848A1 (en) * 2010-03-03 2011-09-08 Bergman Eric J Photoresist removing processor and methods
JP5526876B2 (ja) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 加熱装置及びアニール装置
JP2012023330A (ja) * 2010-06-14 2012-02-02 Tokyo Electron Ltd 加熱源装置及びアニール装置
US10211380B2 (en) * 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US9842753B2 (en) * 2013-04-26 2017-12-12 Applied Materials, Inc. Absorbing lamphead face
US20150085466A1 (en) * 2013-09-24 2015-03-26 Intematix Corporation Low profile led-based lighting arrangements
CN107546157A (zh) * 2013-11-22 2018-01-05 应用材料公司 易取灯头
KR101458963B1 (ko) * 2014-02-18 2014-11-12 민정은 급속 열처리장치용 히터장치
US9728430B2 (en) * 2015-06-29 2017-08-08 Varian Semiconductor Equipment Associates, Inc. Electrostatic chuck with LED heating

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110002674A1 (en) * 2003-09-24 2011-01-06 Tokyo Electron Limited Thermal processing apparatus
US20090046456A1 (en) * 2005-12-22 2009-02-19 Matsushita Electric Works., Ltd. Lighting Apparatus With Leds
US20080277685A1 (en) * 2007-04-24 2008-11-13 Kyung Tae Kim Light emitting diode package
US20100314377A1 (en) * 2007-09-27 2010-12-16 Tokyo Electron Limited Annealing device
JP2011082492A (ja) * 2009-10-09 2011-04-21 Alti-Semiconductor Co Ltd パックライトユニット及びその製造方法｛ｂａｃｋｌｉｇｈｔｕｎｉｔａｎｄｍｅｔｈｏｄｆｏｒｍａｎｕｆａｃｔｒｉｎｇｔｈｅｒｅｏｆ｝
CN102214766A (zh) * 2010-04-02 2011-10-12 游森溢 发光二极管封装结构

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114026674A (zh) * 2019-06-24 2022-02-08 朗姆研究公司 衬底表面的蒸气清洁
US12467147B2 (en) 2019-06-24 2025-11-11 Lam Research Corporation Vapor cleaning of substrate surfaces
CN112838041A (zh) * 2019-11-25 2021-05-25 东京毅力科创株式会社 载置台和检查装置
CN114743895A (zh) * 2021-01-07 2022-07-12 株式会社斯库林集团 热处理装置及热处理方法

Also Published As

Publication number Publication date
KR102553101B1 (ko) 2023-07-07
JP2018523305A (ja) 2018-08-16
TW201701428A (zh) 2017-01-01
US20160379854A1 (en) 2016-12-29
JP6886928B2 (ja) 2021-06-16
KR20180014436A (ko) 2018-02-08
WO2017003866A1 (en) 2017-01-05

Similar Documents

Publication Publication Date Title
CN107710395A (zh) 真空兼容的发光二极管基板加热器
US9728430B2 (en) Electrostatic chuck with LED heating
TWI529341B (zh) 照明總成及系統
US8579476B2 (en) Thermal management of led-based illumination devices with synthetic jet ejectors
US8847481B2 (en) Lighting device comprising photoluminescent plate
EP2542826B1 (en) Electric lamp having reflector for transferring heat from light source
KR101388876B1 (ko) 조명기구
US10295167B2 (en) Cooling mechanism for LED light using 3-D phase change heat transfer
US20140270731A1 (en) Thermal management apparatus for solid state light source arrays
JP2014207226A5 (enExample)
US20100327750A1 (en) Led illuminating apparatus
US20140192537A1 (en) Heat sink and lighting apparatus having same
JP6200654B2 (ja) 発光モジュール、発光装置および照明装置
KR102121406B1 (ko) 웨이퍼 가열장치
CN105736972A (zh) 具有通过相变循环所冷却的led芯片的灯
KR101457601B1 (ko) 조립방식의 엘이디 조명장치용 방열기구
CN110985900A (zh) 一种采用多层荧光板的高功率密度发光装置
KR20160100712A (ko) 직접 냉각식 발광다이오드 조명기기
JP2013187311A (ja) 発光装置の製造方法
TW201341716A (zh) 照明裝置及其散熱裝置
JP2014013679A (ja) 照明装置、及び、放熱器
CN105276398A (zh) 全周光led节能灯具

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180216

WD01 Invention patent application deemed withdrawn after publication