TW201701428A - 真空相容的發光二極體基板加熱器 - Google Patents

真空相容的發光二極體基板加熱器 Download PDF

Info

Publication number
TW201701428A
TW201701428A TW105117295A TW105117295A TW201701428A TW 201701428 A TW201701428 A TW 201701428A TW 105117295 A TW105117295 A TW 105117295A TW 105117295 A TW105117295 A TW 105117295A TW 201701428 A TW201701428 A TW 201701428A
Authority
TW
Taiwan
Prior art keywords
light emitting
recess
emitting diodes
disposed
light
Prior art date
Application number
TW105117295A
Other languages
English (en)
Chinese (zh)
Inventor
羅伯特 布然特 寶佩特
蓋瑞 E‧ 維卡
大衛 伯拉尼克
傑森 M‧ 夏勒
威廉 T‧ 維弗
Original Assignee
瓦里安半導體設備公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瓦里安半導體設備公司 filed Critical 瓦里安半導體設備公司
Publication of TW201701428A publication Critical patent/TW201701428A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67115Apparatus for thermal treatment mainly by radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/0033Heating devices using lamps
    • H05B3/0038Heating devices using lamps for industrial applications
    • H05B3/0047Heating devices using lamps for industrial applications for semiconductor manufacture
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Device Packages (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Chemical Vapour Deposition (AREA)
TW105117295A 2015-06-29 2016-06-02 真空相容的發光二極體基板加熱器 TW201701428A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/753,991 US20160379854A1 (en) 2015-06-29 2015-06-29 Vacuum Compatible LED Substrate Heater

Publications (1)

Publication Number Publication Date
TW201701428A true TW201701428A (zh) 2017-01-01

Family

ID=57602729

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105117295A TW201701428A (zh) 2015-06-29 2016-06-02 真空相容的發光二極體基板加熱器

Country Status (6)

Country Link
US (1) US20160379854A1 (enExample)
JP (1) JP6886928B2 (enExample)
KR (1) KR102553101B1 (enExample)
CN (1) CN107710395A (enExample)
TW (1) TW201701428A (enExample)
WO (1) WO2017003866A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI868169B (zh) * 2019-06-24 2025-01-01 美商蘭姆研究公司 基板表面的蒸氣清潔

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
KR102405723B1 (ko) 2017-08-18 2022-06-07 어플라이드 머티어리얼스, 인코포레이티드 고압 및 고온 어닐링 챔버
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
US11177128B2 (en) 2017-09-12 2021-11-16 Applied Materials, Inc. Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
CN117936417A (zh) 2017-11-11 2024-04-26 微材料有限责任公司 用于高压处理腔室的气体输送系统
US10854483B2 (en) 2017-11-16 2020-12-01 Applied Materials, Inc. High pressure steam anneal processing apparatus
KR20200075892A (ko) 2017-11-17 2020-06-26 어플라이드 머티어리얼스, 인코포레이티드 고압 처리 시스템을 위한 컨덴서 시스템
FR3076431A1 (fr) * 2017-12-28 2019-07-05 Aeroform France Dispositif de chauffage sans contact
JP7239598B2 (ja) 2018-03-09 2023-03-14 アプライド マテリアルズ インコーポレイテッド 金属含有材料の高圧アニーリングプロセス
KR102078157B1 (ko) * 2018-04-16 2020-02-17 세메스 주식회사 기판 가열 유닛 및 이를 갖는 기판 처리 장치
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
KR101961864B1 (ko) 2018-08-17 2019-03-26 남윤종 폐엘이디 칩 분리 장치
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
JP7077989B2 (ja) 2019-02-20 2022-05-31 株式会社デンソー 車両用空調ユニット
JP7198434B2 (ja) * 2019-03-27 2023-01-04 ウシオ電機株式会社 加熱処理方法及び光加熱装置
KR102747715B1 (ko) * 2019-10-15 2024-12-31 주식회사 케이씨텍 복사 열원을 이용한 기판 처리 장치
JP7398935B2 (ja) * 2019-11-25 2023-12-15 東京エレクトロン株式会社 載置台、及び、検査装置
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
JP7717717B2 (ja) * 2020-04-01 2025-08-04 ラム リサーチ コーポレーション 熱エッチングのための急速かつ正確な温度制御
JP7677797B2 (ja) * 2021-01-07 2025-05-15 株式会社Screenホールディングス 熱処理装置および熱処理方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5937142A (en) * 1996-07-11 1999-08-10 Cvc Products, Inc. Multi-zone illuminator for rapid thermal processing
US6067931A (en) * 1996-11-04 2000-05-30 General Electric Company Thermal processor for semiconductor wafers
US6818864B2 (en) * 2002-08-09 2004-11-16 Asm America, Inc. LED heat lamp arrays for CVD heating
JP3776092B2 (ja) * 2003-03-25 2006-05-17 株式会社ルネサステクノロジ エッチング装置、エッチング方法および半導体装置の製造方法
US20070013057A1 (en) * 2003-05-05 2007-01-18 Joseph Mazzochette Multicolor LED assembly with improved color mixing
JP4442171B2 (ja) * 2003-09-24 2010-03-31 東京エレクトロン株式会社 熱処理装置
KR101073423B1 (ko) * 2005-04-19 2011-10-17 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판, led, 및 led 광원 유닛
JP5055756B2 (ja) * 2005-09-21 2012-10-24 東京エレクトロン株式会社 熱処理装置及び記憶媒体
CN101846247B (zh) * 2005-12-22 2013-04-17 松下电器产业株式会社 具有led的照明器具
KR100855065B1 (ko) * 2007-04-24 2008-08-29 삼성전기주식회사 발광 다이오드 패키지
WO2009012301A2 (en) * 2007-07-16 2009-01-22 Lumination Llc Red line emitting complex fluoride phosphors activated with mn4+
JP5084420B2 (ja) * 2007-09-21 2012-11-28 東京エレクトロン株式会社 ロードロック装置および真空処理システム
JP2009099925A (ja) * 2007-09-27 2009-05-07 Tokyo Electron Ltd アニール装置
JP2010129861A (ja) * 2008-11-28 2010-06-10 Tokyo Electron Ltd 熱処理装置
KR20110039080A (ko) * 2009-10-09 2011-04-15 알티반도체 주식회사 백라이트 유닛 및 그 제조 방법
US20110217848A1 (en) * 2010-03-03 2011-09-08 Bergman Eric J Photoresist removing processor and methods
JP5526876B2 (ja) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 加熱装置及びアニール装置
CN102214766A (zh) * 2010-04-02 2011-10-12 游森溢 发光二极管封装结构
JP2012023330A (ja) * 2010-06-14 2012-02-02 Tokyo Electron Ltd 加熱源装置及びアニール装置
US10211380B2 (en) * 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US9842753B2 (en) * 2013-04-26 2017-12-12 Applied Materials, Inc. Absorbing lamphead face
US20150085466A1 (en) * 2013-09-24 2015-03-26 Intematix Corporation Low profile led-based lighting arrangements
CN107546157A (zh) * 2013-11-22 2018-01-05 应用材料公司 易取灯头
KR101458963B1 (ko) * 2014-02-18 2014-11-12 민정은 급속 열처리장치용 히터장치
US9728430B2 (en) * 2015-06-29 2017-08-08 Varian Semiconductor Equipment Associates, Inc. Electrostatic chuck with LED heating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI868169B (zh) * 2019-06-24 2025-01-01 美商蘭姆研究公司 基板表面的蒸氣清潔
US12467147B2 (en) 2019-06-24 2025-11-11 Lam Research Corporation Vapor cleaning of substrate surfaces

Also Published As

Publication number Publication date
KR102553101B1 (ko) 2023-07-07
JP2018523305A (ja) 2018-08-16
CN107710395A (zh) 2018-02-16
US20160379854A1 (en) 2016-12-29
JP6886928B2 (ja) 2021-06-16
KR20180014436A (ko) 2018-02-08
WO2017003866A1 (en) 2017-01-05

Similar Documents

Publication Publication Date Title
TW201701428A (zh) 真空相容的發光二極體基板加熱器
CN107810547B (zh) 设备及利用发光二极管加热的静电夹具
KR102246201B1 (ko) 고체 상태 광 소스 어레이들을 위한 열 관리 장치
KR100977886B1 (ko) 열처리 장치 및 기억 매체
US8579476B2 (en) Thermal management of led-based illumination devices with synthetic jet ejectors
JP5526876B2 (ja) 加熱装置及びアニール装置
CN101925981B (zh) 退火装置
US10295167B2 (en) Cooling mechanism for LED light using 3-D phase change heat transfer
US8901518B2 (en) Chambers with improved cooling devices
US9151483B2 (en) Heat pipe for cooling optical sources
CN105736972A (zh) 具有通过相变循环所冷却的led芯片的灯
KR102121406B1 (ko) 웨이퍼 가열장치
CN1674721A (zh) 加热平台
TWM366013U (en) LED lamp module
JP2013187311A (ja) 発光装置の製造方法
TWI572739B (zh) 加熱裝置
CN104241163A (zh) 半导体制程装置