JP6867539B1 - 非晶質シリカ粉末及び樹脂組成物 - Google Patents

非晶質シリカ粉末及び樹脂組成物 Download PDF

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Publication number
JP6867539B1
JP6867539B1 JP2020141931A JP2020141931A JP6867539B1 JP 6867539 B1 JP6867539 B1 JP 6867539B1 JP 2020141931 A JP2020141931 A JP 2020141931A JP 2020141931 A JP2020141931 A JP 2020141931A JP 6867539 B1 JP6867539 B1 JP 6867539B1
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Prior art keywords
amorphous silica
silica powder
particle size
resin composition
less
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Active
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JP2020141931A
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English (en)
Japanese (ja)
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JP2022037680A (ja
Inventor
靖明 畑山
靖明 畑山
福田　貴史
貴史 福田
敦也 杉本
敦也 杉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=75638936&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP6867539(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Priority to JP2020141931A priority Critical patent/JP6867539B1/ja
Priority to JP2021065900A priority patent/JP2022037873A/ja
Application granted granted Critical
Publication of JP6867539B1 publication Critical patent/JP6867539B1/ja
Priority to US18/022,569 priority patent/US20230312356A1/en
Priority to EP21861305.7A priority patent/EP4206131A4/en
Priority to PCT/JP2021/029999 priority patent/WO2022044877A1/ja
Priority to KR1020237009647A priority patent/KR20230054855A/ko
Priority to CN202180051557.6A priority patent/CN115968354B/zh
Priority to TW110130575A priority patent/TW202212448A/zh
Publication of JP2022037680A publication Critical patent/JP2022037680A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00—Energy generation of nuclear origin
    • Y02E30/30—Nuclear fission reactors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Epoxy Resins (AREA)
JP2020141931A 2020-08-25 2020-08-25 非晶質シリカ粉末及び樹脂組成物 Active JP6867539B1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2020141931A JP6867539B1 (ja) 2020-08-25 2020-08-25 非晶質シリカ粉末及び樹脂組成物
JP2021065900A JP2022037873A (ja) 2020-08-25 2021-04-08 非晶質シリカ粉末及び樹脂組成物
CN202180051557.6A CN115968354B (zh) 2020-08-25 2021-08-17 非晶质二氧化硅粉末和树脂组合物
KR1020237009647A KR20230054855A (ko) 2020-08-25 2021-08-17 비정질 실리카 분말 및 수지 조성물
US18/022,569 US20230312356A1 (en) 2020-08-25 2021-08-17 Amorphous silica powder and resin composition
EP21861305.7A EP4206131A4 (en) 2020-08-25 2021-08-17 AMORPHOUS SILICON DIOXIDE POWDER AND RESIN COMPOSITION
PCT/JP2021/029999 WO2022044877A1 (ja) 2020-08-25 2021-08-17 非晶質シリカ粉末及び樹脂組成物
TW110130575A TW202212448A (zh) 2020-08-25 2021-08-19 非晶質氧化矽粉末及樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020141931A JP6867539B1 (ja) 2020-08-25 2020-08-25 非晶質シリカ粉末及び樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021065900A Division JP2022037873A (ja) 2020-08-25 2021-04-08 非晶質シリカ粉末及び樹脂組成物

Publications (2)

Publication Number Publication Date
JP6867539B1 true JP6867539B1 (ja) 2021-04-28
JP2022037680A JP2022037680A (ja) 2022-03-09

Family

ID=75638936

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020141931A Active JP6867539B1 (ja) 2020-08-25 2020-08-25 非晶質シリカ粉末及び樹脂組成物
JP2021065900A Pending JP2022037873A (ja) 2020-08-25 2021-04-08 非晶質シリカ粉末及び樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021065900A Pending JP2022037873A (ja) 2020-08-25 2021-04-08 非晶質シリカ粉末及び樹脂組成物

Country Status (7)

Country Link
US (1) US20230312356A1 (https=)
EP (1) EP4206131A4 (https=)
JP (2) JP6867539B1 (https=)
KR (1) KR20230054855A (https=)
CN (1) CN115968354B (https=)
TW (1) TW202212448A (https=)
WO (1) WO2022044877A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7407537B2 (ja) * 2019-08-09 2024-01-04 日東電工株式会社 インダクタの製造方法
JP6867540B1 (ja) * 2020-08-25 2021-04-28 デンカ株式会社 非晶質シリカ粉末及びそれを含有する樹脂組成物
CN116814070B (zh) * 2023-06-30 2025-10-14 南亚新材料科技股份有限公司 一种低介电热固性树脂组合物及其制备方法和应用
CN120988431A (zh) * 2025-10-23 2025-11-21 武汉市三选科技有限公司 一种消除流痕的液态模塑料及其方法和应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63182212A (ja) * 1987-01-20 1988-07-27 Mizusawa Ind Chem Ltd 非晶質シリカ乃至シリカアルミナ球状粒子及びその製法
JPH085658B2 (ja) * 1992-01-24 1996-01-24 水澤化学工業株式会社 粒状非晶質シリカの製造方法及び非晶質シリカ球状粒子
JP3695521B2 (ja) 2000-08-01 2005-09-14 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
JP4912609B2 (ja) * 2005-04-22 2012-04-11 電気化学工業株式会社 光拡散板樹脂組成物及び光拡散板
JP5256185B2 (ja) 2009-12-22 2013-08-07 パナソニック株式会社 エポキシ樹脂組成物及び半導体装置
JP2015086120A (ja) * 2013-10-31 2015-05-07 株式会社トクヤマ 球状シリカ微粉末とその製造方法
CN104556076B (zh) * 2015-02-03 2016-09-07 苏州纳迪微电子有限公司 一种超高纯非晶态球形硅微粉的制备方法
JP2019172911A (ja) * 2018-03-29 2019-10-10 京セラ株式会社 樹脂組成物及び半導体装置
JP6612919B2 (ja) * 2018-04-13 2019-11-27 デンカ株式会社 非晶質シリカ粉末、樹脂組成物、及び半導体封止材
CN110950345A (zh) * 2019-12-24 2020-04-03 苏州纳迪微电子有限公司 低放射性非晶态球形硅微粉的制备方法

Also Published As

Publication number Publication date
CN115968354A (zh) 2023-04-14
JP2022037680A (ja) 2022-03-09
WO2022044877A1 (ja) 2022-03-03
EP4206131A4 (en) 2024-05-08
EP4206131A1 (en) 2023-07-05
CN115968354B (zh) 2025-02-28
JP2022037873A (ja) 2022-03-09
KR20230054855A (ko) 2023-04-25
US20230312356A1 (en) 2023-10-05
TW202212448A (zh) 2022-04-01

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