CN115968354B - 非晶质二氧化硅粉末和树脂组合物 - Google Patents

非晶质二氧化硅粉末和树脂组合物 Download PDF

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Publication number
CN115968354B
CN115968354B CN202180051557.6A CN202180051557A CN115968354B CN 115968354 B CN115968354 B CN 115968354B CN 202180051557 A CN202180051557 A CN 202180051557A CN 115968354 B CN115968354 B CN 115968354B
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amorphous silica
silica powder
particle diameter
less
resin composition
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Chinese (zh)
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CN115968354A (zh
Inventor
畑山靖明
福田贵史
杉本敦也
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Denka Co Ltd
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Denka Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00—Energy generation of nuclear origin
    • Y02E30/30—Nuclear fission reactors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Epoxy Resins (AREA)
CN202180051557.6A 2020-08-25 2021-08-17 非晶质二氧化硅粉末和树脂组合物 Active CN115968354B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020141931A JP6867539B1 (ja) 2020-08-25 2020-08-25 非晶質シリカ粉末及び樹脂組成物
JP2020-141931 2020-08-25
PCT/JP2021/029999 WO2022044877A1 (ja) 2020-08-25 2021-08-17 非晶質シリカ粉末及び樹脂組成物

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CN115968354A CN115968354A (zh) 2023-04-14
CN115968354B true CN115968354B (zh) 2025-02-28

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US (1) US20230312356A1 (https=)
EP (1) EP4206131A4 (https=)
JP (2) JP6867539B1 (https=)
KR (1) KR20230054855A (https=)
CN (1) CN115968354B (https=)
TW (1) TW202212448A (https=)
WO (1) WO2022044877A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7407537B2 (ja) * 2019-08-09 2024-01-04 日東電工株式会社 インダクタの製造方法
JP6867540B1 (ja) * 2020-08-25 2021-04-28 デンカ株式会社 非晶質シリカ粉末及びそれを含有する樹脂組成物
CN116814070B (zh) * 2023-06-30 2025-10-14 南亚新材料科技股份有限公司 一种低介电热固性树脂组合物及其制备方法和应用
CN120988431A (zh) * 2025-10-23 2025-11-21 武汉市三选科技有限公司 一种消除流痕的液态模塑料及其方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104556076A (zh) * 2015-02-03 2015-04-29 苏州纳迪微电子有限公司 一种超高纯非晶态球形硅微粉的制备方法
CN110950345A (zh) * 2019-12-24 2020-04-03 苏州纳迪微电子有限公司 低放射性非晶态球形硅微粉的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63182212A (ja) * 1987-01-20 1988-07-27 Mizusawa Ind Chem Ltd 非晶質シリカ乃至シリカアルミナ球状粒子及びその製法
JPH085658B2 (ja) * 1992-01-24 1996-01-24 水澤化学工業株式会社 粒状非晶質シリカの製造方法及び非晶質シリカ球状粒子
JP3695521B2 (ja) 2000-08-01 2005-09-14 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
JP4912609B2 (ja) * 2005-04-22 2012-04-11 電気化学工業株式会社 光拡散板樹脂組成物及び光拡散板
JP5256185B2 (ja) 2009-12-22 2013-08-07 パナソニック株式会社 エポキシ樹脂組成物及び半導体装置
JP2015086120A (ja) * 2013-10-31 2015-05-07 株式会社トクヤマ 球状シリカ微粉末とその製造方法
JP2019172911A (ja) * 2018-03-29 2019-10-10 京セラ株式会社 樹脂組成物及び半導体装置
JP6612919B2 (ja) * 2018-04-13 2019-11-27 デンカ株式会社 非晶質シリカ粉末、樹脂組成物、及び半導体封止材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104556076A (zh) * 2015-02-03 2015-04-29 苏州纳迪微电子有限公司 一种超高纯非晶态球形硅微粉的制备方法
CN110950345A (zh) * 2019-12-24 2020-04-03 苏州纳迪微电子有限公司 低放射性非晶态球形硅微粉的制备方法

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Publication number Publication date
CN115968354A (zh) 2023-04-14
JP2022037680A (ja) 2022-03-09
WO2022044877A1 (ja) 2022-03-03
EP4206131A4 (en) 2024-05-08
EP4206131A1 (en) 2023-07-05
JP2022037873A (ja) 2022-03-09
KR20230054855A (ko) 2023-04-25
US20230312356A1 (en) 2023-10-05
JP6867539B1 (ja) 2021-04-28
TW202212448A (zh) 2022-04-01

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