JP6843533B2 - 成膜装置及び成膜装置の制御方法 - Google Patents

成膜装置及び成膜装置の制御方法 Download PDF

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Publication number
JP6843533B2
JP6843533B2 JP2016131736A JP2016131736A JP6843533B2 JP 6843533 B2 JP6843533 B2 JP 6843533B2 JP 2016131736 A JP2016131736 A JP 2016131736A JP 2016131736 A JP2016131736 A JP 2016131736A JP 6843533 B2 JP6843533 B2 JP 6843533B2
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Japan
Prior art keywords
substrate
pressing portion
support
pressing
film
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Active
Application number
JP2016131736A
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English (en)
Japanese (ja)
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JP2018003096A (ja
Inventor
信朗 塩入
信朗 塩入
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
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Canon Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Priority to JP2016131736A priority Critical patent/JP6843533B2/ja
Priority to KR1020170075926A priority patent/KR102264459B1/ko
Priority to CN201710518669.3A priority patent/CN107557747B/zh
Publication of JP2018003096A publication Critical patent/JP2018003096A/ja
Priority to JP2021027154A priority patent/JP2021101471A/ja
Application granted granted Critical
Publication of JP6843533B2 publication Critical patent/JP6843533B2/ja
Priority to KR1020210073416A priority patent/KR102355444B1/ko
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2016131736A 2016-07-01 2016-07-01 成膜装置及び成膜装置の制御方法 Active JP6843533B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016131736A JP6843533B2 (ja) 2016-07-01 2016-07-01 成膜装置及び成膜装置の制御方法
KR1020170075926A KR102264459B1 (ko) 2016-07-01 2017-06-15 기판 협지 장치, 성막 장치 및 성막 방법
CN201710518669.3A CN107557747B (zh) 2016-07-01 2017-06-30 成膜装置及成膜装置的控制方法
JP2021027154A JP2021101471A (ja) 2016-07-01 2021-02-24 成膜装置
KR1020210073416A KR102355444B1 (ko) 2016-07-01 2021-06-07 기판 협지 장치, 성막 장치 및 성막 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016131736A JP6843533B2 (ja) 2016-07-01 2016-07-01 成膜装置及び成膜装置の制御方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021027154A Division JP2021101471A (ja) 2016-07-01 2021-02-24 成膜装置

Publications (2)

Publication Number Publication Date
JP2018003096A JP2018003096A (ja) 2018-01-11
JP6843533B2 true JP6843533B2 (ja) 2021-03-17

Family

ID=60944837

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016131736A Active JP6843533B2 (ja) 2016-07-01 2016-07-01 成膜装置及び成膜装置の制御方法
JP2021027154A Pending JP2021101471A (ja) 2016-07-01 2021-02-24 成膜装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021027154A Pending JP2021101471A (ja) 2016-07-01 2021-02-24 成膜装置

Country Status (3)

Country Link
JP (2) JP6843533B2 (ko)
KR (2) KR102264459B1 (ko)
CN (1) CN107557747B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117448757B (zh) * 2023-10-25 2024-05-17 安徽凤玻智能科技有限公司 一种low-e玻璃溅射镀膜生产线

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637039A (ja) * 1992-07-16 1994-02-10 Fujitsu Ltd スパッタ装置
JPH0936211A (ja) * 1995-07-24 1997-02-07 Yamaha Corp クランプリング
JP4553124B2 (ja) 2004-12-16 2010-09-29 株式会社日立ハイテクノロジーズ 真空蒸着方法及びｅｌディスプレイ用パネル
JP4773834B2 (ja) * 2006-02-03 2011-09-14 キヤノン株式会社 マスク成膜方法およびマスク成膜装置
JP2008007857A (ja) * 2006-06-02 2008-01-17 Sony Corp アライメント装置、アライメント方法および表示装置の製造方法
JP2010086809A (ja) * 2008-09-30 2010-04-15 Canon Anelva Corp 保持装置、マスクのアライメント方法、基板処理装置、電子放出素子ディスプレイの生産方法及び有機ｅｌディスプレイの生産方法
JP2011106017A (ja) * 2009-11-20 2011-06-02 Canon Inc 押圧装置およびそれを備えた成膜装置、および成膜方法
JP2011233510A (ja) * 2010-04-05 2011-11-17 Canon Inc 蒸着装置

Also Published As

Publication number Publication date
KR102264459B1 (ko) 2021-06-11
CN107557747B (zh) 2020-08-28
JP2018003096A (ja) 2018-01-11
CN107557747A (zh) 2018-01-09
KR20210071898A (ko) 2021-06-16
KR102355444B1 (ko) 2022-01-24
KR20180003994A (ko) 2018-01-10
JP2021101471A (ja) 2021-07-08

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