JP6829859B2 - マスクの形成方法、これを利用したプリント配線基板の製造方法、電鋳部品の製造方法およびスクリーン印刷製版の製造方法 - Google Patents
マスクの形成方法、これを利用したプリント配線基板の製造方法、電鋳部品の製造方法およびスクリーン印刷製版の製造方法 Download PDFInfo
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- 239000011572 manganese Substances 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015087166 | 2015-04-21 | ||
| JP2015087166 | 2015-04-21 |
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| JP2016206670A JP2016206670A (ja) | 2016-12-08 |
| JP2016206670A5 JP2016206670A5 (enrdf_load_stackoverflow) | 2019-04-25 |
| JP6829859B2 true JP6829859B2 (ja) | 2021-02-17 |
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| CN (1) | CN107533298B (enrdf_load_stackoverflow) |
| TW (1) | TWI693485B (enrdf_load_stackoverflow) |
| WO (1) | WO2016171074A1 (enrdf_load_stackoverflow) |
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| CN110100047B (zh) * | 2016-12-23 | 2022-04-01 | 3M创新有限公司 | 电铸微结构制品的方法 |
| TWI651994B (zh) * | 2018-03-06 | 2019-02-21 | 易華電子股份有限公司 | 提升乾膜與基材結合穩固性之系統 |
| TWI669404B (zh) * | 2018-06-06 | 2019-08-21 | 張東暉 | 金屬蒸鍍遮罩結構 |
| KR102716551B1 (ko) | 2019-04-26 | 2024-10-15 | 메르크 파텐트 게엠베하 | 경화막의 제조방법 및 이의 용도 |
| DE102020209767A1 (de) | 2020-08-03 | 2022-02-03 | Gebr. Schmid Gmbh | Verfahren zur Leiterplattenherstellung |
| JP7478262B2 (ja) * | 2020-12-24 | 2024-05-02 | 京セラ株式会社 | スクリーン印刷製版およびスクリーン印刷装置 |
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| JP3541360B2 (ja) * | 2002-05-17 | 2004-07-07 | 独立行政法人 科学技術振興機構 | 多層回路構造の形成方法及び多層回路構造を有する基体 |
| JP2004058640A (ja) * | 2002-07-29 | 2004-02-26 | Needs:Kk | スクリーン印刷用印刷版 |
| JP2005039097A (ja) * | 2003-07-16 | 2005-02-10 | Matsushita Electric Ind Co Ltd | 銅箔の配線形成方法と配線転写基材及び配線基板 |
| JP2005136223A (ja) * | 2003-10-30 | 2005-05-26 | Fuji Photo Film Co Ltd | プリント配線板の製造方法 |
| JP2006156605A (ja) * | 2004-11-29 | 2006-06-15 | Matsushita Electric Works Ltd | 多層回路基板の製造方法 |
| JP4715234B2 (ja) * | 2005-02-28 | 2011-07-06 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法並びに光硬化物の除去方法 |
| JP2007334058A (ja) * | 2006-06-15 | 2007-12-27 | Murata Mfg Co Ltd | スクリーン印刷用版およびその製造方法 |
| JP5232487B2 (ja) * | 2007-02-22 | 2013-07-10 | 富士フイルム株式会社 | 平版印刷版原版および平版印刷方法 |
| JP4620174B2 (ja) * | 2009-04-20 | 2011-01-26 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂積層体 |
| JP5422696B2 (ja) * | 2011-04-28 | 2014-02-19 | 株式会社北陸濾化 | 表面改質処理剤および表面改質方法 |
| JP2014051575A (ja) * | 2012-09-06 | 2014-03-20 | Tosoh Corp | 洗浄組成物 |
| JP6068123B2 (ja) * | 2012-12-14 | 2017-01-25 | 上村工業株式会社 | プリント配線基板の製造方法およびその方法により製造されたプリント配線基板 |
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- 2016-04-15 CN CN201680023007.2A patent/CN107533298B/zh active Active
- 2016-04-15 WO PCT/JP2016/062057 patent/WO2016171074A1/ja active Application Filing
- 2016-04-19 TW TW105112155A patent/TWI693485B/zh active
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| Publication number | Publication date |
|---|---|
| TW201702766A (zh) | 2017-01-16 |
| CN107533298A (zh) | 2018-01-02 |
| TWI693485B (zh) | 2020-05-11 |
| WO2016171074A1 (ja) | 2016-10-27 |
| JP2016206670A (ja) | 2016-12-08 |
| CN107533298B (zh) | 2021-06-22 |
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