TWI693485B - 遮罩之形成方法、利用其之印刷電路基板之製造方法、電鑄零件之製造方法及網版印刷製版之製造方法 - Google Patents

遮罩之形成方法、利用其之印刷電路基板之製造方法、電鑄零件之製造方法及網版印刷製版之製造方法 Download PDF

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TWI693485B
TWI693485B TW105112155A TW105112155A TWI693485B TW I693485 B TWI693485 B TW I693485B TW 105112155 A TW105112155 A TW 105112155A TW 105112155 A TW105112155 A TW 105112155A TW I693485 B TWI693485 B TW I693485B
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Taiwan
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layer
mask
weight
forming
base material
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TW105112155A
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English (en)
Chinese (zh)
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TW201702766A (zh
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森家英幸
森家圭一郎
森家洋晃
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日商北陸濾化股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW105112155A 2015-04-21 2016-04-19 遮罩之形成方法、利用其之印刷電路基板之製造方法、電鑄零件之製造方法及網版印刷製版之製造方法 TWI693485B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015087166 2015-04-21
JP2015-087166 2015-04-21

Publications (2)

Publication Number Publication Date
TW201702766A TW201702766A (zh) 2017-01-16
TWI693485B true TWI693485B (zh) 2020-05-11

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TW105112155A TWI693485B (zh) 2015-04-21 2016-04-19 遮罩之形成方法、利用其之印刷電路基板之製造方法、電鑄零件之製造方法及網版印刷製版之製造方法

Country Status (4)

Country Link
JP (1) JP6829859B2 (enrdf_load_stackoverflow)
CN (1) CN107533298B (enrdf_load_stackoverflow)
TW (1) TWI693485B (enrdf_load_stackoverflow)
WO (1) WO2016171074A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804130B (zh) * 2020-12-24 2023-06-01 日商京瓷股份有限公司 網版印刷製版及網版印刷裝置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110100047B (zh) * 2016-12-23 2022-04-01 3M创新有限公司 电铸微结构制品的方法
TWI651994B (zh) * 2018-03-06 2019-02-21 易華電子股份有限公司 提升乾膜與基材結合穩固性之系統
TWI669404B (zh) * 2018-06-06 2019-08-21 張東暉 金屬蒸鍍遮罩結構
KR102716551B1 (ko) 2019-04-26 2024-10-15 메르크 파텐트 게엠베하 경화막의 제조방법 및 이의 용도
DE102020209767A1 (de) 2020-08-03 2022-02-03 Gebr. Schmid Gmbh Verfahren zur Leiterplattenherstellung

Citations (2)

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TW201042398A (en) * 2009-04-20 2010-12-01 Asahi Kasei E Materials Corp Photosensitive resin laminate
JP2012237064A (ja) * 2011-04-28 2012-12-06 Hokuriku Roka:Kk 表面改質処理剤および表面改質方法

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JP3541360B2 (ja) * 2002-05-17 2004-07-07 独立行政法人 科学技術振興機構 多層回路構造の形成方法及び多層回路構造を有する基体
JP2004058640A (ja) * 2002-07-29 2004-02-26 Needs:Kk スクリーン印刷用印刷版
JP2005039097A (ja) * 2003-07-16 2005-02-10 Matsushita Electric Ind Co Ltd 銅箔の配線形成方法と配線転写基材及び配線基板
JP2005136223A (ja) * 2003-10-30 2005-05-26 Fuji Photo Film Co Ltd プリント配線板の製造方法
JP2006156605A (ja) * 2004-11-29 2006-06-15 Matsushita Electric Works Ltd 多層回路基板の製造方法
JP4715234B2 (ja) * 2005-02-28 2011-07-06 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法並びに光硬化物の除去方法
JP2007334058A (ja) * 2006-06-15 2007-12-27 Murata Mfg Co Ltd スクリーン印刷用版およびその製造方法
JP5232487B2 (ja) * 2007-02-22 2013-07-10 富士フイルム株式会社 平版印刷版原版および平版印刷方法
JP2014051575A (ja) * 2012-09-06 2014-03-20 Tosoh Corp 洗浄組成物
JP6068123B2 (ja) * 2012-12-14 2017-01-25 上村工業株式会社 プリント配線基板の製造方法およびその方法により製造されたプリント配線基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201042398A (en) * 2009-04-20 2010-12-01 Asahi Kasei E Materials Corp Photosensitive resin laminate
JP2012237064A (ja) * 2011-04-28 2012-12-06 Hokuriku Roka:Kk 表面改質処理剤および表面改質方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804130B (zh) * 2020-12-24 2023-06-01 日商京瓷股份有限公司 網版印刷製版及網版印刷裝置

Also Published As

Publication number Publication date
TW201702766A (zh) 2017-01-16
JP6829859B2 (ja) 2021-02-17
CN107533298A (zh) 2018-01-02
WO2016171074A1 (ja) 2016-10-27
JP2016206670A (ja) 2016-12-08
CN107533298B (zh) 2021-06-22

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