CN107533298B - 掩模的形成方法及利用了其的印刷配线基板的制造方法 - Google Patents
掩模的形成方法及利用了其的印刷配线基板的制造方法 Download PDFInfo
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- 150000002431 hydrogen Chemical class 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
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- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015087166 | 2015-04-21 | ||
| JP2015-087166 | 2015-04-21 | ||
| PCT/JP2016/062057 WO2016171074A1 (ja) | 2015-04-21 | 2016-04-15 | マスクの形成方法、これを利用したプリント配線基板の製造方法、電鋳部品の製造方法およびスクリーン印刷製版の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107533298A CN107533298A (zh) | 2018-01-02 |
| CN107533298B true CN107533298B (zh) | 2021-06-22 |
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Family Applications (1)
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| CN201680023007.2A Active CN107533298B (zh) | 2015-04-21 | 2016-04-15 | 掩模的形成方法及利用了其的印刷配线基板的制造方法 |
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| JP (1) | JP6829859B2 (enrdf_load_stackoverflow) |
| CN (1) | CN107533298B (enrdf_load_stackoverflow) |
| TW (1) | TWI693485B (enrdf_load_stackoverflow) |
| WO (1) | WO2016171074A1 (enrdf_load_stackoverflow) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110100047B (zh) * | 2016-12-23 | 2022-04-01 | 3M创新有限公司 | 电铸微结构制品的方法 |
| TWI651994B (zh) * | 2018-03-06 | 2019-02-21 | 易華電子股份有限公司 | 提升乾膜與基材結合穩固性之系統 |
| TWI669404B (zh) * | 2018-06-06 | 2019-08-21 | 張東暉 | 金屬蒸鍍遮罩結構 |
| KR102716551B1 (ko) | 2019-04-26 | 2024-10-15 | 메르크 파텐트 게엠베하 | 경화막의 제조방법 및 이의 용도 |
| DE102020209767A1 (de) | 2020-08-03 | 2022-02-03 | Gebr. Schmid Gmbh | Verfahren zur Leiterplattenherstellung |
| JP7478262B2 (ja) * | 2020-12-24 | 2024-05-02 | 京セラ株式会社 | スクリーン印刷製版およびスクリーン印刷装置 |
Citations (7)
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|---|---|---|---|---|
| JP2004058640A (ja) * | 2002-07-29 | 2004-02-26 | Needs:Kk | スクリーン印刷用印刷版 |
| CN1612048A (zh) * | 2003-10-30 | 2005-05-04 | 富士胶片株式会社 | 印刷电路板的制造方法 |
| CN1653873A (zh) * | 2002-05-17 | 2005-08-10 | 独立行政法人科学技术振兴机构 | 多层电路结构的形成方法和具有多层电路结构的基体 |
| JP2006235499A (ja) * | 2005-02-28 | 2006-09-07 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法並びに光硬化物の除去方法 |
| JP2007334058A (ja) * | 2006-06-15 | 2007-12-27 | Murata Mfg Co Ltd | スクリーン印刷用版およびその製造方法 |
| JP2012237064A (ja) * | 2011-04-28 | 2012-12-06 | Hokuriku Roka:Kk | 表面改質処理剤および表面改質方法 |
| TW201433231A (zh) * | 2012-12-14 | 2014-08-16 | Uyemura C & Co Ltd | 印刷電路板之製造方法及利用該方法製造的印刷電路板 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005039097A (ja) * | 2003-07-16 | 2005-02-10 | Matsushita Electric Ind Co Ltd | 銅箔の配線形成方法と配線転写基材及び配線基板 |
| JP2006156605A (ja) * | 2004-11-29 | 2006-06-15 | Matsushita Electric Works Ltd | 多層回路基板の製造方法 |
| JP5232487B2 (ja) * | 2007-02-22 | 2013-07-10 | 富士フイルム株式会社 | 平版印刷版原版および平版印刷方法 |
| JP4620174B2 (ja) * | 2009-04-20 | 2011-01-26 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂積層体 |
| JP2014051575A (ja) * | 2012-09-06 | 2014-03-20 | Tosoh Corp | 洗浄組成物 |
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2016
- 2016-04-15 JP JP2016082149A patent/JP6829859B2/ja active Active
- 2016-04-15 CN CN201680023007.2A patent/CN107533298B/zh active Active
- 2016-04-15 WO PCT/JP2016/062057 patent/WO2016171074A1/ja active Application Filing
- 2016-04-19 TW TW105112155A patent/TWI693485B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653873A (zh) * | 2002-05-17 | 2005-08-10 | 独立行政法人科学技术振兴机构 | 多层电路结构的形成方法和具有多层电路结构的基体 |
| JP2004058640A (ja) * | 2002-07-29 | 2004-02-26 | Needs:Kk | スクリーン印刷用印刷版 |
| CN1612048A (zh) * | 2003-10-30 | 2005-05-04 | 富士胶片株式会社 | 印刷电路板的制造方法 |
| JP2006235499A (ja) * | 2005-02-28 | 2006-09-07 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法並びに光硬化物の除去方法 |
| JP2007334058A (ja) * | 2006-06-15 | 2007-12-27 | Murata Mfg Co Ltd | スクリーン印刷用版およびその製造方法 |
| JP2012237064A (ja) * | 2011-04-28 | 2012-12-06 | Hokuriku Roka:Kk | 表面改質処理剤および表面改質方法 |
| TW201433231A (zh) * | 2012-12-14 | 2014-08-16 | Uyemura C & Co Ltd | 印刷電路板之製造方法及利用該方法製造的印刷電路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201702766A (zh) | 2017-01-16 |
| JP6829859B2 (ja) | 2021-02-17 |
| CN107533298A (zh) | 2018-01-02 |
| TWI693485B (zh) | 2020-05-11 |
| WO2016171074A1 (ja) | 2016-10-27 |
| JP2016206670A (ja) | 2016-12-08 |
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