JP6829303B2 - 絶縁基体、半導体パッケージおよび半導体装置 - Google Patents

絶縁基体、半導体パッケージおよび半導体装置 Download PDF

Info

Publication number
JP6829303B2
JP6829303B2 JP2019501252A JP2019501252A JP6829303B2 JP 6829303 B2 JP6829303 B2 JP 6829303B2 JP 2019501252 A JP2019501252 A JP 2019501252A JP 2019501252 A JP2019501252 A JP 2019501252A JP 6829303 B2 JP6829303 B2 JP 6829303B2
Authority
JP
Japan
Prior art keywords
insulating substrate
metal layer
insulating
groove
bonding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019501252A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2018155282A1 (ja
Inventor
真実 重田
真実 重田
作本　大輔
大輔 作本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2018155282A1 publication Critical patent/JPWO2018155282A1/ja
Application granted granted Critical
Publication of JP6829303B2 publication Critical patent/JP6829303B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP2019501252A 2017-02-23 2018-02-14 絶縁基体、半導体パッケージおよび半導体装置 Active JP6829303B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017031899 2017-02-23
JP2017031899 2017-02-23
PCT/JP2018/005080 WO2018155282A1 (ja) 2017-02-23 2018-02-14 絶縁基体、半導体パッケージおよび半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021006525A Division JP7007502B2 (ja) 2017-02-23 2021-01-19 絶縁基体、半導体パッケージおよび半導体装置

Publications (2)

Publication Number Publication Date
JPWO2018155282A1 JPWO2018155282A1 (ja) 2019-12-12
JP6829303B2 true JP6829303B2 (ja) 2021-02-10

Family

ID=63252569

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2019501252A Active JP6829303B2 (ja) 2017-02-23 2018-02-14 絶縁基体、半導体パッケージおよび半導体装置
JP2021006525A Active JP7007502B2 (ja) 2017-02-23 2021-01-19 絶縁基体、半導体パッケージおよび半導体装置
JP2022000784A Active JP7350902B2 (ja) 2017-02-23 2022-01-06 絶縁基体、半導体パッケージおよび半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021006525A Active JP7007502B2 (ja) 2017-02-23 2021-01-19 絶縁基体、半導体パッケージおよび半導体装置
JP2022000784A Active JP7350902B2 (ja) 2017-02-23 2022-01-06 絶縁基体、半導体パッケージおよび半導体装置

Country Status (5)

Country Link
US (2) US11335613B2 (enExample)
EP (1) EP3588549A4 (enExample)
JP (3) JP6829303B2 (enExample)
CN (1) CN110337718B (enExample)
WO (1) WO2018155282A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116888727A (zh) * 2021-01-29 2023-10-13 京瓷株式会社 半导体封装体以及半导体电子装置
CN113937613A (zh) * 2021-09-22 2022-01-14 中国电子科技集团公司第十一研究所 一种星载泵浦ld强化组件及激光器
CN115172286A (zh) * 2022-07-04 2022-10-11 富芯微电子有限公司 一种自动化的可控硅芯片封装结构及其工艺

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294667A (ja) * 1999-04-09 2000-10-20 Matsushita Electronics Industry Corp 半導体パッケージおよびその製造方法
JP2002141596A (ja) * 2000-10-31 2002-05-17 Kyocera Corp 光半導体素子収納用パッケージ
JP2002289960A (ja) * 2001-03-27 2002-10-04 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP3619473B2 (ja) * 2001-06-25 2005-02-09 京セラ株式会社 半導体素子収納用パッケージ
JP2004228532A (ja) * 2003-01-27 2004-08-12 Kyocera Corp 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2004296577A (ja) * 2003-03-26 2004-10-21 Kyocera Corp 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP4594073B2 (ja) 2004-11-29 2010-12-08 京セラ株式会社 接続端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2009158511A (ja) * 2007-12-25 2009-07-16 Sumitomo Metal Electronics Devices Inc 入出力端子及び半導体素子収納用パッケージ
JP5241562B2 (ja) * 2009-02-25 2013-07-17 京セラ株式会社 接続装置、フレキシブル基板付き半導体素子収納用パッケージ、およびフレキシブル基板付き半導体装置
JP5678085B2 (ja) * 2010-10-27 2015-02-25 京セラ株式会社 配線基板、電子装置および多数個取り配線基板
JP5769474B2 (ja) * 2011-04-06 2015-08-26 京セラ株式会社 端子構造体、電子部品収納用パッケージおよび電子装置
CN103250240B (zh) * 2011-05-31 2016-01-06 京瓷株式会社 元件收纳用封装、半导体装置用部件以及半导体装置
WO2013015073A1 (ja) * 2011-07-22 2013-01-31 京セラ株式会社 配線基板および電子装置
JP5537736B2 (ja) * 2011-07-26 2014-07-02 京セラ株式会社 半導体素子収納用パッケージ、これを備えた半導体装置および電子装置
JP5981660B2 (ja) * 2013-09-25 2016-08-31 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2015103619A (ja) * 2013-11-22 2015-06-04 京セラ株式会社 素子収納用パッケージおよび実装構造体

Also Published As

Publication number Publication date
JP2022046748A (ja) 2022-03-23
WO2018155282A1 (ja) 2018-08-30
JP7350902B2 (ja) 2023-09-26
CN110337718B (zh) 2023-06-16
EP3588549A4 (en) 2020-12-02
JPWO2018155282A1 (ja) 2019-12-12
JP2021064812A (ja) 2021-04-22
US11335613B2 (en) 2022-05-17
JP7007502B2 (ja) 2022-01-24
EP3588549A1 (en) 2020-01-01
US20200058578A1 (en) 2020-02-20
US11901247B2 (en) 2024-02-13
US20220238400A1 (en) 2022-07-28
CN110337718A (zh) 2019-10-15

Similar Documents

Publication Publication Date Title
EP2237316B1 (en) Connection terminal, package using the same and electronic device
JP7197647B2 (ja) 高周波基体、高周波パッケージおよび高周波モジュール
CN109863591B (zh) 高频基体、高频封装件以及高频模块
JP6633656B2 (ja) 配線基板、光半導体素子パッケージおよび光半導体装置
JP7350902B2 (ja) 絶縁基体、半導体パッケージおよび半導体装置
JP7021041B2 (ja) 配線基板、電子部品パッケージおよび電子装置
JP7145311B2 (ja) 配線基板、電子部品用パッケージおよび電子装置
EP2717309A1 (en) Element housing package, component for semiconductor device, and semiconductor device
CN103999209B (zh) 电子部件收纳用封装体以及电子装置
JP7230251B2 (ja) 配線基板、電子部品パッケージおよび電子装置
JP7244630B2 (ja) 配線基板、電子部品用パッケージおよび電子装置
JP2015103619A (ja) 素子収納用パッケージおよび実装構造体
JP5709427B2 (ja) 素子収納用パッケージおよびこれを備えた半導体装置
JP7254011B2 (ja) 配線基体、半導体素子収納用パッケージ、および半導体装置
JP5725886B2 (ja) 素子収納用パッケージおよび実装構造体

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190808

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201013

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201209

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201222

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210121

R150 Certificate of patent or registration of utility model

Ref document number: 6829303

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150