JP6806405B1 - 複合銅部材 - Google Patents

複合銅部材 Download PDF

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Publication number
JP6806405B1
JP6806405B1 JP2020539869A JP2020539869A JP6806405B1 JP 6806405 B1 JP6806405 B1 JP 6806405B1 JP 2020539869 A JP2020539869 A JP 2020539869A JP 2020539869 A JP2020539869 A JP 2020539869A JP 6806405 B1 JP6806405 B1 JP 6806405B1
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JP
Japan
Prior art keywords
copper
layer containing
composite
copper foil
oxide
Prior art date
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JP2020539869A
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English (en)
Japanese (ja)
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JPWO2021220524A1 (https=
Inventor
牧子 佐藤
牧子 佐藤
慎 寺木
慎 寺木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Priority claimed from PCT/JP2020/027739 external-priority patent/WO2021220524A1/ja
Priority to JP2020197075A priority Critical patent/JP7217999B2/ja
Application granted granted Critical
Publication of JP6806405B1 publication Critical patent/JP6806405B1/ja
Publication of JPWO2021220524A1 publication Critical patent/JPWO2021220524A1/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63Treatment of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/12Oxygen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14Nitrogen-containing compounds
    • C23F11/149Heterocyclic compounds containing nitrogen as hetero atom
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/16Sulfur-containing compounds
    • C23F11/165Heterocyclic compounds containing sulfur as hetero atom
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/18Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using inorganic inhibitors
    • C23F11/182Sulfur, boron or silicon containing compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20Use of solutions containing silanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Treatment Of Metals (AREA)
JP2020539869A 2020-04-27 2020-07-16 複合銅部材 Active JP6806405B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020197075A JP7217999B2 (ja) 2020-04-27 2020-11-27 複合銅部材

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020078603 2020-04-27
JP2020078603 2020-04-27
PCT/JP2020/027739 WO2021220524A1 (ja) 2020-04-27 2020-07-16 複合銅部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020197075A Division JP7217999B2 (ja) 2020-04-27 2020-11-27 複合銅部材

Publications (2)

Publication Number Publication Date
JP6806405B1 true JP6806405B1 (ja) 2021-01-06
JPWO2021220524A1 JPWO2021220524A1 (https=) 2021-11-04

Family

ID=73992794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020539869A Active JP6806405B1 (ja) 2020-04-27 2020-07-16 複合銅部材

Country Status (3)

Country Link
JP (1) JP6806405B1 (https=)
KR (1) KR102846566B1 (https=)
CN (1) CN115461495A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022202921A1 (https=) * 2021-03-25 2022-09-29
JPWO2022224684A1 (https=) * 2021-04-20 2022-10-27
WO2022230803A1 (ja) * 2021-04-30 2022-11-03 Rimtec株式会社 金属樹脂積層体及び金属樹脂積層体の製造方法
JP2023051784A (ja) * 2021-09-30 2023-04-11 ナミックス株式会社 銅部材
JP2023107101A (ja) * 2022-01-21 2023-08-02 ナミックス株式会社 銅部材

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013534054A (ja) * 2010-07-06 2013-08-29 イーサイオニック・スリーサウザンド・インコーポレーテッド プリント配線板において使用するために、銅表面を処理して有機基板への接着を強化する方法
JP2017048467A (ja) * 2013-09-20 2017-03-09 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP2018016886A (ja) * 2016-07-15 2018-02-01 ナミックス株式会社 プリント配線板に用いる銅箔の製造方法
JP2019218602A (ja) * 2018-06-20 2019-12-26 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB706566A (en) * 1950-06-09 1954-03-31 Bataafsche Petroleum Improvements in or relating to lubricant and hydraulic fluids compositions
JP4706081B2 (ja) * 2001-06-05 2011-06-22 メック株式会社 銅または銅合金のエッチング剤ならびにエッチング法
JP2014037585A (ja) * 2012-08-17 2014-02-27 Fujifilm Corp 酸化防止処理方法、これを用いた半導体製品の製造方法
US9978609B2 (en) * 2015-04-27 2018-05-22 Versum Materials Us, Llc Low dishing copper chemical mechanical planarization
JP2018053305A (ja) * 2016-09-28 2018-04-05 大阪瓦斯株式会社 銅管の孔食の抑制方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013534054A (ja) * 2010-07-06 2013-08-29 イーサイオニック・スリーサウザンド・インコーポレーテッド プリント配線板において使用するために、銅表面を処理して有機基板への接着を強化する方法
JP2017048467A (ja) * 2013-09-20 2017-03-09 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP2018016886A (ja) * 2016-07-15 2018-02-01 ナミックス株式会社 プリント配線板に用いる銅箔の製造方法
JP2019218602A (ja) * 2018-06-20 2019-12-26 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022202921A1 (https=) * 2021-03-25 2022-09-29
WO2022202921A1 (ja) * 2021-03-25 2022-09-29 ナミックス株式会社 積層体の製造方法
CN116745462A (zh) * 2021-03-25 2023-09-12 纳美仕有限公司 叠层体的制造方法
JPWO2022224684A1 (https=) * 2021-04-20 2022-10-27
WO2022224684A1 (ja) * 2021-04-20 2022-10-27 ナミックス株式会社 銅部材
CN116670326A (zh) * 2021-04-20 2023-08-29 纳美仕有限公司 铜部件
WO2022230803A1 (ja) * 2021-04-30 2022-11-03 Rimtec株式会社 金属樹脂積層体及び金属樹脂積層体の製造方法
JP2023051784A (ja) * 2021-09-30 2023-04-11 ナミックス株式会社 銅部材
JP2023107101A (ja) * 2022-01-21 2023-08-02 ナミックス株式会社 銅部材
JP7837038B2 (ja) 2022-01-21 2026-03-30 ナミックス株式会社 銅部材

Also Published As

Publication number Publication date
JPWO2021220524A1 (https=) 2021-11-04
KR102846566B1 (ko) 2025-08-18
CN115461495A (zh) 2022-12-09
KR20230007390A (ko) 2023-01-12

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