JP6806405B1 - 複合銅部材 - Google Patents
複合銅部材 Download PDFInfo
- Publication number
- JP6806405B1 JP6806405B1 JP2020539869A JP2020539869A JP6806405B1 JP 6806405 B1 JP6806405 B1 JP 6806405B1 JP 2020539869 A JP2020539869 A JP 2020539869A JP 2020539869 A JP2020539869 A JP 2020539869A JP 6806405 B1 JP6806405 B1 JP 6806405B1
- Authority
- JP
- Japan
- Prior art keywords
- copper
- layer containing
- composite
- copper foil
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
- C23F11/165—Heterocyclic compounds containing sulfur as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/18—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using inorganic inhibitors
- C23F11/182—Sulfur, boron or silicon containing compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Treatment Of Metals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020197075A JP7217999B2 (ja) | 2020-04-27 | 2020-11-27 | 複合銅部材 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020078603 | 2020-04-27 | ||
| JP2020078603 | 2020-04-27 | ||
| PCT/JP2020/027739 WO2021220524A1 (ja) | 2020-04-27 | 2020-07-16 | 複合銅部材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020197075A Division JP7217999B2 (ja) | 2020-04-27 | 2020-11-27 | 複合銅部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6806405B1 true JP6806405B1 (ja) | 2021-01-06 |
| JPWO2021220524A1 JPWO2021220524A1 (https=) | 2021-11-04 |
Family
ID=73992794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020539869A Active JP6806405B1 (ja) | 2020-04-27 | 2020-07-16 | 複合銅部材 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6806405B1 (https=) |
| KR (1) | KR102846566B1 (https=) |
| CN (1) | CN115461495A (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022202921A1 (https=) * | 2021-03-25 | 2022-09-29 | ||
| JPWO2022224684A1 (https=) * | 2021-04-20 | 2022-10-27 | ||
| WO2022230803A1 (ja) * | 2021-04-30 | 2022-11-03 | Rimtec株式会社 | 金属樹脂積層体及び金属樹脂積層体の製造方法 |
| JP2023051784A (ja) * | 2021-09-30 | 2023-04-11 | ナミックス株式会社 | 銅部材 |
| JP2023107101A (ja) * | 2022-01-21 | 2023-08-02 | ナミックス株式会社 | 銅部材 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013534054A (ja) * | 2010-07-06 | 2013-08-29 | イーサイオニック・スリーサウザンド・インコーポレーテッド | プリント配線板において使用するために、銅表面を処理して有機基板への接着を強化する方法 |
| JP2017048467A (ja) * | 2013-09-20 | 2017-03-09 | 三井金属鉱業株式会社 | 銅箔、キャリア箔付銅箔及び銅張積層板 |
| JP2018016886A (ja) * | 2016-07-15 | 2018-02-01 | ナミックス株式会社 | プリント配線板に用いる銅箔の製造方法 |
| JP2019218602A (ja) * | 2018-06-20 | 2019-12-26 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB706566A (en) * | 1950-06-09 | 1954-03-31 | Bataafsche Petroleum | Improvements in or relating to lubricant and hydraulic fluids compositions |
| JP4706081B2 (ja) * | 2001-06-05 | 2011-06-22 | メック株式会社 | 銅または銅合金のエッチング剤ならびにエッチング法 |
| JP2014037585A (ja) * | 2012-08-17 | 2014-02-27 | Fujifilm Corp | 酸化防止処理方法、これを用いた半導体製品の製造方法 |
| US9978609B2 (en) * | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| JP2018053305A (ja) * | 2016-09-28 | 2018-04-05 | 大阪瓦斯株式会社 | 銅管の孔食の抑制方法 |
-
2020
- 2020-07-16 JP JP2020539869A patent/JP6806405B1/ja active Active
- 2020-07-16 CN CN202080100179.1A patent/CN115461495A/zh active Pending
- 2020-07-16 KR KR1020227039993A patent/KR102846566B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013534054A (ja) * | 2010-07-06 | 2013-08-29 | イーサイオニック・スリーサウザンド・インコーポレーテッド | プリント配線板において使用するために、銅表面を処理して有機基板への接着を強化する方法 |
| JP2017048467A (ja) * | 2013-09-20 | 2017-03-09 | 三井金属鉱業株式会社 | 銅箔、キャリア箔付銅箔及び銅張積層板 |
| JP2018016886A (ja) * | 2016-07-15 | 2018-02-01 | ナミックス株式会社 | プリント配線板に用いる銅箔の製造方法 |
| JP2019218602A (ja) * | 2018-06-20 | 2019-12-26 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022202921A1 (https=) * | 2021-03-25 | 2022-09-29 | ||
| WO2022202921A1 (ja) * | 2021-03-25 | 2022-09-29 | ナミックス株式会社 | 積層体の製造方法 |
| CN116745462A (zh) * | 2021-03-25 | 2023-09-12 | 纳美仕有限公司 | 叠层体的制造方法 |
| JPWO2022224684A1 (https=) * | 2021-04-20 | 2022-10-27 | ||
| WO2022224684A1 (ja) * | 2021-04-20 | 2022-10-27 | ナミックス株式会社 | 銅部材 |
| CN116670326A (zh) * | 2021-04-20 | 2023-08-29 | 纳美仕有限公司 | 铜部件 |
| WO2022230803A1 (ja) * | 2021-04-30 | 2022-11-03 | Rimtec株式会社 | 金属樹脂積層体及び金属樹脂積層体の製造方法 |
| JP2023051784A (ja) * | 2021-09-30 | 2023-04-11 | ナミックス株式会社 | 銅部材 |
| JP2023107101A (ja) * | 2022-01-21 | 2023-08-02 | ナミックス株式会社 | 銅部材 |
| JP7837038B2 (ja) | 2022-01-21 | 2026-03-30 | ナミックス株式会社 | 銅部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021220524A1 (https=) | 2021-11-04 |
| KR102846566B1 (ko) | 2025-08-18 |
| CN115461495A (zh) | 2022-12-09 |
| KR20230007390A (ko) | 2023-01-12 |
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