JP6800167B2 - 半導体加工用テープ - Google Patents

半導体加工用テープ Download PDF

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Publication number
JP6800167B2
JP6800167B2 JP2017557751A JP2017557751A JP6800167B2 JP 6800167 B2 JP6800167 B2 JP 6800167B2 JP 2017557751 A JP2017557751 A JP 2017557751A JP 2017557751 A JP2017557751 A JP 2017557751A JP 6800167 B2 JP6800167 B2 JP 6800167B2
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JP
Japan
Prior art keywords
adhesive layer
resin
semiconductor
dicing tape
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017557751A
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English (en)
Japanese (ja)
Other versions
JPWO2017110203A1 (ja
Inventor
真沙美 青山
真沙美 青山
佐野　透
透 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Publication of JPWO2017110203A1 publication Critical patent/JPWO2017110203A1/ja
Application granted granted Critical
Publication of JP6800167B2 publication Critical patent/JP6800167B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2017557751A 2015-12-25 2016-10-05 半導体加工用テープ Active JP6800167B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015255313 2015-12-25
JP2015255313 2015-12-25
PCT/JP2016/079627 WO2017110203A1 (ja) 2015-12-25 2016-10-05 半導体加工用テープ

Publications (2)

Publication Number Publication Date
JPWO2017110203A1 JPWO2017110203A1 (ja) 2018-10-18
JP6800167B2 true JP6800167B2 (ja) 2020-12-16

Family

ID=59089994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017557751A Active JP6800167B2 (ja) 2015-12-25 2016-10-05 半導体加工用テープ

Country Status (7)

Country Link
JP (1) JP6800167B2 (zh)
KR (1) KR102513252B1 (zh)
CN (1) CN107960133B (zh)
MY (1) MY192250A (zh)
SG (1) SG11201708735SA (zh)
TW (1) TWI696683B (zh)
WO (1) WO2017110203A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI649398B (zh) * 2017-09-11 2019-02-01 達邁科技股份有限公司 熱硬化型黏著組成物以及黏著片
US10947417B2 (en) 2017-09-29 2021-03-16 Taimide Tech. Inc. Thermal-curable adhesive composition and adhesive sheet
JP7154809B2 (ja) * 2018-04-20 2022-10-18 株式会社ディスコ ウエーハの加工方法
JP7111562B2 (ja) * 2018-08-31 2022-08-02 株式会社ディスコ 加工方法
US11541691B2 (en) 2018-12-19 2023-01-03 The Goodyear Tire & Rubber Company Composite tread with targeted stiffness gradient and method of making
US20200198414A1 (en) * 2018-12-19 2020-06-25 The Goodyear Tire & Rubber Company Method and apparatus for forming a composite tread with microchimneys
JP7321639B2 (ja) * 2019-02-15 2023-08-07 株式会社ディスコ ウェーハの加工方法
JP7258421B2 (ja) * 2019-02-15 2023-04-17 株式会社ディスコ ウェーハの加工方法
JP7379829B2 (ja) * 2019-02-21 2023-11-15 味の素株式会社 プリント配線板の製造方法
TWI710288B (zh) * 2020-01-22 2020-11-11 頎邦科技股份有限公司 電路板的散熱片貼合方法及其貼合裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167699A (ja) * 1997-08-13 1999-03-09 Texas Instr Japan Ltd 半導体装置の製造方法
JP4865312B2 (ja) 2005-12-05 2012-02-01 古河電気工業株式会社 チップ用保護膜形成用シート
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP5026832B2 (ja) * 2007-03-22 2012-09-19 古河電気工業株式会社 半導体デバイス加工用粘着テープ
JP5534690B2 (ja) * 2009-03-23 2014-07-02 古河電気工業株式会社 ダイシングテープ
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5419226B2 (ja) * 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途

Also Published As

Publication number Publication date
SG11201708735SA (en) 2018-07-30
CN107960133A (zh) 2018-04-24
JPWO2017110203A1 (ja) 2018-10-18
MY192250A (en) 2022-08-11
KR20180098125A (ko) 2018-09-03
TWI696683B (zh) 2020-06-21
TW201722711A (zh) 2017-07-01
WO2017110203A1 (ja) 2017-06-29
CN107960133B (zh) 2021-10-26
KR102513252B1 (ko) 2023-03-24

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