JP6792439B2 - キャップ部材及びその製造方法と発光装置 - Google Patents

キャップ部材及びその製造方法と発光装置 Download PDF

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Publication number
JP6792439B2
JP6792439B2 JP2016245301A JP2016245301A JP6792439B2 JP 6792439 B2 JP6792439 B2 JP 6792439B2 JP 2016245301 A JP2016245301 A JP 2016245301A JP 2016245301 A JP2016245301 A JP 2016245301A JP 6792439 B2 JP6792439 B2 JP 6792439B2
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Japan
Prior art keywords
top plate
opening
plate portion
tubular portion
cap member
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JP2016245301A
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English (en)
Japanese (ja)
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JP2018101653A5 (enExample
JP2018101653A (ja
Inventor
勝哉 中澤
勝哉 中澤
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2016245301A priority Critical patent/JP6792439B2/ja
Priority to US15/840,366 priority patent/US10164403B2/en
Publication of JP2018101653A publication Critical patent/JP2018101653A/ja
Publication of JP2018101653A5 publication Critical patent/JP2018101653A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
JP2016245301A 2016-12-19 2016-12-19 キャップ部材及びその製造方法と発光装置 Active JP6792439B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016245301A JP6792439B2 (ja) 2016-12-19 2016-12-19 キャップ部材及びその製造方法と発光装置
US15/840,366 US10164403B2 (en) 2016-12-19 2017-12-13 Cap member and light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016245301A JP6792439B2 (ja) 2016-12-19 2016-12-19 キャップ部材及びその製造方法と発光装置

Publications (3)

Publication Number Publication Date
JP2018101653A JP2018101653A (ja) 2018-06-28
JP2018101653A5 JP2018101653A5 (enExample) 2019-06-27
JP6792439B2 true JP6792439B2 (ja) 2020-11-25

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JP2016245301A Active JP6792439B2 (ja) 2016-12-19 2016-12-19 キャップ部材及びその製造方法と発光装置

Country Status (2)

Country Link
US (1) US10164403B2 (enExample)
JP (1) JP6792439B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11740419B2 (en) * 2019-11-01 2023-08-29 CIG Photonics Japan Limited Optical subassembly
JP7128232B2 (ja) * 2020-06-11 2022-08-30 ダイハツディーゼル株式会社 要因分析装置および要因分析方法
JP7507682B2 (ja) * 2020-12-28 2024-06-28 新光電気工業株式会社 半導体パッケージ用ステム
JP7645106B2 (ja) * 2021-03-16 2025-03-13 山村フォトニクス株式会社 保護カバー

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941309B2 (ja) * 1979-10-16 1984-10-05 日本電気ホームエレクトロニクス株式会社 レンズキヤツプの製造方法
US4355321A (en) * 1981-02-02 1982-10-19 Varian Associates, Inc. Optoelectronic assembly including light transmissive single crystal semiconductor window
JPS5851454U (ja) * 1981-09-30 1983-04-07 新光電気工業株式会社 半導体装置
JPS5856482A (ja) * 1981-09-30 1983-04-04 Shinko Electric Ind Co Ltd 半導体装置
JPS6180840A (ja) * 1984-09-28 1986-04-24 Hitachi Ltd 光電子装置
JPS6197862U (enExample) * 1984-12-04 1986-06-23
JPS63198360A (ja) * 1987-02-13 1988-08-17 Nec Kansai Ltd 光装置用キヤツプの製造方法
JPH0468573U (enExample) * 1990-10-24 1992-06-17
KR100436467B1 (ko) * 1995-11-14 2004-08-09 로무 가부시키가이샤 반도체레이저및그제조방법
JP2000183442A (ja) * 1998-12-15 2000-06-30 Nippon Electric Glass Co Ltd 光素子用キャップ
JP2004170214A (ja) * 2002-11-19 2004-06-17 Denso Corp センサ装置及びその製造方法
JP2006186166A (ja) 2004-12-28 2006-07-13 Mitsubishi Electric Corp 半導体レーザー素子およびそれを用いた光ディスクシステム
US7856038B2 (en) * 2006-03-27 2010-12-21 Sumitomo Electric Industries, Ltd. Light-emitting module installing thermo-electric controller
DE102006031358A1 (de) * 2006-07-05 2008-01-17 Schott Ag Verfahren zur Gehäusung optischer oder optoelektronischer Bauteile, sowie verfahrensgemäß herstellbares optisches oder optoelektronisches Gehäuseelement
JP2009094179A (ja) * 2007-10-05 2009-04-30 Sony Corp レーザモジュール及び光ピックアップ装置
JP5079474B2 (ja) * 2007-11-29 2012-11-21 シャープ株式会社 キャップ部材およびそれを用いた半導体装置
JP5064249B2 (ja) * 2008-01-21 2012-10-31 シャープ株式会社 キャップ部材およびそれを用いた半導体装置
DE102013209919B4 (de) * 2013-05-28 2025-06-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement mit einem Gehäuse mit mehreren Öffnungen
JP6209946B2 (ja) * 2013-11-06 2017-10-11 三菱電機株式会社 光モジュール
JP2015106106A (ja) * 2013-12-02 2015-06-08 セイコーエプソン株式会社 電子デバイスおよび電子機器
JP6186266B2 (ja) * 2013-12-17 2017-08-23 新光電気工業株式会社 金属キャップ及び発光装置

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Publication number Publication date
US20180175584A1 (en) 2018-06-21
JP2018101653A (ja) 2018-06-28
US10164403B2 (en) 2018-12-25

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