JP6787364B2 - 導電性ペースト - Google Patents
導電性ペースト Download PDFInfo
- Publication number
- JP6787364B2 JP6787364B2 JP2018094191A JP2018094191A JP6787364B2 JP 6787364 B2 JP6787364 B2 JP 6787364B2 JP 2018094191 A JP2018094191 A JP 2018094191A JP 2018094191 A JP2018094191 A JP 2018094191A JP 6787364 B2 JP6787364 B2 JP 6787364B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- copper powder
- external electrode
- powder
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 67
- 239000002245 particle Substances 0.000 claims description 64
- 239000011521 glass Substances 0.000 claims description 58
- 239000000843 powder Substances 0.000 claims description 39
- 239000000919 ceramic Substances 0.000 claims description 24
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- 239000011593 sulfur Substances 0.000 claims description 6
- 239000000460 chlorine Substances 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 5
- -1 chlorine ions Chemical class 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 description 18
- 230000007547 defect Effects 0.000 description 13
- 239000003985 ceramic capacitor Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 238000010304 firing Methods 0.000 description 9
- 229910018054 Ni-Cu Inorganic materials 0.000 description 8
- 229910018481 Ni—Cu Inorganic materials 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000012808 vapor phase Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Powder Metallurgy (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018094191A JP6787364B2 (ja) | 2018-05-16 | 2018-05-16 | 導電性ペースト |
KR1020190048818A KR102226688B1 (ko) | 2018-05-16 | 2019-04-26 | 도전성 페이스트 |
CN201910400837.8A CN110504042B (zh) | 2018-05-16 | 2019-05-14 | 导电性膏 |
JP2020180064A JP7475259B2 (ja) | 2018-05-16 | 2020-10-28 | チップ型セラミック電子部品 |
KR1020210029351A KR102426098B1 (ko) | 2018-05-16 | 2021-03-05 | 칩형 세라믹 전자부품 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018094191A JP6787364B2 (ja) | 2018-05-16 | 2018-05-16 | 導電性ペースト |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020180064A Division JP7475259B2 (ja) | 2018-05-16 | 2020-10-28 | チップ型セラミック電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019200896A JP2019200896A (ja) | 2019-11-21 |
JP6787364B2 true JP6787364B2 (ja) | 2020-11-18 |
Family
ID=68585683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018094191A Active JP6787364B2 (ja) | 2018-05-16 | 2018-05-16 | 導電性ペースト |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6787364B2 (ko) |
KR (2) | KR102226688B1 (ko) |
CN (1) | CN110504042B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230107899A (ko) * | 2019-03-28 | 2023-07-18 | 가부시키가이샤 무라타 세이사쿠쇼 | 칩형 세라믹 전자부품 |
JP6704083B1 (ja) * | 2019-11-22 | 2020-06-03 | 東邦チタニウム株式会社 | 銅粉体とその製造方法 |
JP7396191B2 (ja) * | 2020-05-01 | 2023-12-12 | 株式会社村田製作所 | セラミック電子部品およびセラミック電子部品の製造方法 |
JP2022014533A (ja) * | 2020-07-07 | 2022-01-20 | 株式会社村田製作所 | 電子部品 |
JP7355182B2 (ja) | 2020-10-28 | 2023-10-03 | 株式会社村田製作所 | チップ型セラミック電子部品の製造方法 |
JP2022116729A (ja) * | 2021-01-29 | 2022-08-10 | Tdk株式会社 | 電子部品 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002110444A (ja) * | 2000-09-26 | 2002-04-12 | Murata Mfg Co Ltd | 導電性ペーストおよび積層セラミック電子部品 |
CN1545111A (zh) * | 2003-11-26 | 2004-11-10 | 廖晓华 | 用于片式电容器端电极的导电浆料 |
JP2011026631A (ja) | 2009-07-21 | 2011-02-10 | Mitsui Mining & Smelting Co Ltd | 銅粉、導電性ペースト及び導電性接続構造 |
JP5820202B2 (ja) * | 2010-09-30 | 2015-11-24 | Dowaエレクトロニクス株式会社 | 導電性ペースト用銅粉およびその製造方法 |
JP2013131459A (ja) * | 2011-12-22 | 2013-07-04 | Kyocera Corp | 導電性ペーストおよびセラミックス電子部品 |
EP2824682A4 (en) * | 2012-03-05 | 2015-09-23 | Murata Manufacturing Co | ELECTRONIC COMPONENT |
JP2015035581A (ja) * | 2013-07-10 | 2015-02-19 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
KR20150008632A (ko) * | 2013-07-15 | 2015-01-23 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자 부품 |
KR101671324B1 (ko) * | 2014-02-14 | 2016-11-02 | 미쓰이금속광업주식회사 | 구리분 |
KR101574462B1 (ko) * | 2015-01-16 | 2015-12-11 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 전자 부품 |
WO2016121749A1 (ja) * | 2015-01-30 | 2016-08-04 | 住友電気工業株式会社 | 金属粉末、インク、焼結体及びプリント配線板用基材並びに金属粉末の製造方法 |
KR102428149B1 (ko) * | 2015-02-04 | 2022-08-02 | 나믹스 가부시끼가이샤 | 열전도성 페이스트 및 그의 제조 방법 |
JP6060225B1 (ja) * | 2015-07-27 | 2017-01-11 | 三井金属鉱業株式会社 | 銅粉及びその製造方法 |
-
2018
- 2018-05-16 JP JP2018094191A patent/JP6787364B2/ja active Active
-
2019
- 2019-04-26 KR KR1020190048818A patent/KR102226688B1/ko active IP Right Grant
- 2019-05-14 CN CN201910400837.8A patent/CN110504042B/zh active Active
-
2021
- 2021-03-05 KR KR1020210029351A patent/KR102426098B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102226688B1 (ko) | 2021-03-11 |
KR20210028631A (ko) | 2021-03-12 |
CN110504042B (zh) | 2021-06-01 |
KR20190131424A (ko) | 2019-11-26 |
CN110504042A (zh) | 2019-11-26 |
KR102426098B1 (ko) | 2022-07-28 |
JP2019200896A (ja) | 2019-11-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6787364B2 (ja) | 導電性ペースト | |
JP6645470B2 (ja) | 外部電極用導電性ペーストおよびその外部電極用導電性ペーストを用いて製造する電子部品の製造方法 | |
CN104282438B (zh) | 陶瓷电子部件及其制造方法 | |
US9218909B2 (en) | Multi-layered ceramic electronic component | |
JP5253351B2 (ja) | 積層セラミック電子部品およびその製造方法、積層セラミック電子部品用の扁平状導電性微粉末ならびに積層セラミック電子部品用の扁平状導電性微粉末分散液 | |
CN112242250B (zh) | 层叠型电子部件 | |
JP2015026815A (ja) | セラミック電子部品およびその製造方法 | |
JP3736802B2 (ja) | 導電性組成物とセラミック電子部品 | |
JP2023099415A (ja) | 積層型電子部品 | |
JP2021010034A (ja) | チップ型セラミック電子部品 | |
JP2002110444A (ja) | 導電性ペーストおよび積層セラミック電子部品 | |
JP2007165063A (ja) | 導電性粒子、導電性ペースト及び電子部品 | |
JP7355182B2 (ja) | チップ型セラミック電子部品の製造方法 | |
JP4826881B2 (ja) | 導電性ペースト、及び積層セラミック電子部品の製造方法、並びに積層セラミック電子部品 | |
JP7447804B2 (ja) | 積層インダクタの内部電極形成用銀ペースト | |
JP7338310B2 (ja) | 積層型電子部品 | |
JP6649840B2 (ja) | 導体形成用ペースト | |
JP2003297146A (ja) | 導電性ペースト、およびそれを用いた積層セラミック電子部品 | |
JP7092103B2 (ja) | 導電性ペーストおよび積層型電子部品 | |
JP2005150659A (ja) | 導電性ペーストおよび積層セラミック電子部品 | |
JP2005317776A (ja) | セラミック電子部品の製造方法 | |
JP2005129425A (ja) | 導電性ペーストおよび積層セラミック電子部品 | |
JP7447805B2 (ja) | 積層インダクタの内部電極形成用銀ペースト | |
JP2005129328A (ja) | 導電性ペーストおよび積層セラミック電子部品 | |
JP2023160719A (ja) | 導電性ペースト及び積層型電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191224 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200722 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200825 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200917 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200929 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201012 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6787364 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |