JP6787364B2 - 導電性ペースト - Google Patents

導電性ペースト Download PDF

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Publication number
JP6787364B2
JP6787364B2 JP2018094191A JP2018094191A JP6787364B2 JP 6787364 B2 JP6787364 B2 JP 6787364B2 JP 2018094191 A JP2018094191 A JP 2018094191A JP 2018094191 A JP2018094191 A JP 2018094191A JP 6787364 B2 JP6787364 B2 JP 6787364B2
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JP
Japan
Prior art keywords
conductive paste
copper powder
external electrode
powder
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018094191A
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English (en)
Japanese (ja)
Other versions
JP2019200896A (ja
Inventor
康弘 西坂
康弘 西坂
真人 木村
真人 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2018094191A priority Critical patent/JP6787364B2/ja
Priority to KR1020190048818A priority patent/KR102226688B1/ko
Priority to CN201910400837.8A priority patent/CN110504042B/zh
Publication of JP2019200896A publication Critical patent/JP2019200896A/ja
Priority to JP2020180064A priority patent/JP7475259B2/ja
Application granted granted Critical
Publication of JP6787364B2 publication Critical patent/JP6787364B2/ja
Priority to KR1020210029351A priority patent/KR102426098B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14Conductive material dispersed in non-conductive inorganic material
    • H01B1/16Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Powder Metallurgy (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2018094191A 2018-05-16 2018-05-16 導電性ペースト Active JP6787364B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018094191A JP6787364B2 (ja) 2018-05-16 2018-05-16 導電性ペースト
KR1020190048818A KR102226688B1 (ko) 2018-05-16 2019-04-26 도전성 페이스트
CN201910400837.8A CN110504042B (zh) 2018-05-16 2019-05-14 导电性膏
JP2020180064A JP7475259B2 (ja) 2018-05-16 2020-10-28 チップ型セラミック電子部品
KR1020210029351A KR102426098B1 (ko) 2018-05-16 2021-03-05 칩형 세라믹 전자부품

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018094191A JP6787364B2 (ja) 2018-05-16 2018-05-16 導電性ペースト

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020180064A Division JP7475259B2 (ja) 2018-05-16 2020-10-28 チップ型セラミック電子部品

Publications (2)

Publication Number Publication Date
JP2019200896A JP2019200896A (ja) 2019-11-21
JP6787364B2 true JP6787364B2 (ja) 2020-11-18

Family

ID=68585683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018094191A Active JP6787364B2 (ja) 2018-05-16 2018-05-16 導電性ペースト

Country Status (3)

Country Link
JP (1) JP6787364B2 (ko)
KR (2) KR102226688B1 (ko)
CN (1) CN110504042B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230107899A (ko) * 2019-03-28 2023-07-18 가부시키가이샤 무라타 세이사쿠쇼 칩형 세라믹 전자부품
JP6704083B1 (ja) * 2019-11-22 2020-06-03 東邦チタニウム株式会社 銅粉体とその製造方法
JP7396191B2 (ja) * 2020-05-01 2023-12-12 株式会社村田製作所 セラミック電子部品およびセラミック電子部品の製造方法
JP2022014533A (ja) * 2020-07-07 2022-01-20 株式会社村田製作所 電子部品
JP7355182B2 (ja) 2020-10-28 2023-10-03 株式会社村田製作所 チップ型セラミック電子部品の製造方法
JP2022116729A (ja) * 2021-01-29 2022-08-10 Tdk株式会社 電子部品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110444A (ja) * 2000-09-26 2002-04-12 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
CN1545111A (zh) * 2003-11-26 2004-11-10 廖晓华 用于片式电容器端电极的导电浆料
JP2011026631A (ja) 2009-07-21 2011-02-10 Mitsui Mining & Smelting Co Ltd 銅粉、導電性ペースト及び導電性接続構造
JP5820202B2 (ja) * 2010-09-30 2015-11-24 Dowaエレクトロニクス株式会社 導電性ペースト用銅粉およびその製造方法
JP2013131459A (ja) * 2011-12-22 2013-07-04 Kyocera Corp 導電性ペーストおよびセラミックス電子部品
EP2824682A4 (en) * 2012-03-05 2015-09-23 Murata Manufacturing Co ELECTRONIC COMPONENT
JP2015035581A (ja) * 2013-07-10 2015-02-19 株式会社村田製作所 セラミック電子部品およびその製造方法
KR20150008632A (ko) * 2013-07-15 2015-01-23 삼성전기주식회사 기판 내장용 적층 세라믹 전자 부품
KR101671324B1 (ko) * 2014-02-14 2016-11-02 미쓰이금속광업주식회사 구리분
KR101574462B1 (ko) * 2015-01-16 2015-12-11 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 전자 부품
WO2016121749A1 (ja) * 2015-01-30 2016-08-04 住友電気工業株式会社 金属粉末、インク、焼結体及びプリント配線板用基材並びに金属粉末の製造方法
KR102428149B1 (ko) * 2015-02-04 2022-08-02 나믹스 가부시끼가이샤 열전도성 페이스트 및 그의 제조 방법
JP6060225B1 (ja) * 2015-07-27 2017-01-11 三井金属鉱業株式会社 銅粉及びその製造方法

Also Published As

Publication number Publication date
KR102226688B1 (ko) 2021-03-11
KR20210028631A (ko) 2021-03-12
CN110504042B (zh) 2021-06-01
KR20190131424A (ko) 2019-11-26
CN110504042A (zh) 2019-11-26
KR102426098B1 (ko) 2022-07-28
JP2019200896A (ja) 2019-11-21

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