JP6779748B2 - インプリント装置、インプリント方法、および物品の製造方法 - Google Patents

インプリント装置、インプリント方法、および物品の製造方法 Download PDF

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Publication number
JP6779748B2
JP6779748B2 JP2016213544A JP2016213544A JP6779748B2 JP 6779748 B2 JP6779748 B2 JP 6779748B2 JP 2016213544 A JP2016213544 A JP 2016213544A JP 2016213544 A JP2016213544 A JP 2016213544A JP 6779748 B2 JP6779748 B2 JP 6779748B2
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Japan
Prior art keywords
substrate
mold
mesa portion
imprint
pattern
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JP2016213544A
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English (en)
Japanese (ja)
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JP2018074041A5 (enExample
JP2018074041A (ja
Inventor
服部　正
服部　　正
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Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016213544A priority Critical patent/JP6779748B2/ja
Priority to KR1020170137234A priority patent/KR102246569B1/ko
Publication of JP2018074041A publication Critical patent/JP2018074041A/ja
Publication of JP2018074041A5 publication Critical patent/JP2018074041A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016213544A 2016-10-31 2016-10-31 インプリント装置、インプリント方法、および物品の製造方法 Active JP6779748B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016213544A JP6779748B2 (ja) 2016-10-31 2016-10-31 インプリント装置、インプリント方法、および物品の製造方法
KR1020170137234A KR102246569B1 (ko) 2016-10-31 2017-10-23 임프린트 장치, 임프린트 방법 및 물품의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016213544A JP6779748B2 (ja) 2016-10-31 2016-10-31 インプリント装置、インプリント方法、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2018074041A JP2018074041A (ja) 2018-05-10
JP2018074041A5 JP2018074041A5 (enExample) 2020-07-27
JP6779748B2 true JP6779748B2 (ja) 2020-11-04

Family

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Family Applications (1)

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JP2016213544A Active JP6779748B2 (ja) 2016-10-31 2016-10-31 インプリント装置、インプリント方法、および物品の製造方法

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JP (1) JP6779748B2 (enExample)
KR (1) KR102246569B1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7278163B2 (ja) * 2019-07-11 2023-05-19 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7475185B2 (ja) * 2020-04-10 2024-04-26 キヤノン株式会社 計測方法、インプリント装置及び物品の製造方法
JP7604257B2 (ja) 2021-02-10 2024-12-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810496B2 (ja) * 2007-04-25 2011-11-09 株式会社東芝 パターン形成装置、パターン形成方法及びテンプレート
JP4641552B2 (ja) 2008-06-23 2011-03-02 キヤノン株式会社 微細加工方法及び微細加工装置
JP5407525B2 (ja) 2009-04-27 2014-02-05 大日本印刷株式会社 ナノインプリント転写用基板およびナノインプリント転写方法
JP2011066180A (ja) * 2009-09-17 2011-03-31 Toshiba Corp テンプレート作成管理方法、テンプレート及びテンプレート作成管理装置
US20120261849A1 (en) * 2011-04-14 2012-10-18 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method using same
JP6029268B2 (ja) * 2011-09-12 2016-11-24 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5686779B2 (ja) * 2011-10-14 2015-03-18 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6071221B2 (ja) 2012-03-14 2017-02-01 キヤノン株式会社 インプリント装置、モールド、インプリント方法及び物品の製造方法
JP5865208B2 (ja) * 2012-08-07 2016-02-17 富士フイルム株式会社 モールドの製造方法
JP6412317B2 (ja) * 2013-04-24 2018-10-24 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6381184B2 (ja) * 2013-07-09 2018-08-29 キヤノン株式会社 校正方法、測定装置、露光装置および物品の製造方法
JP6317620B2 (ja) * 2014-05-02 2018-04-25 キヤノン株式会社 インプリント方法、インプリント装置及び物品の製造方法
JP6450105B2 (ja) * 2014-07-31 2019-01-09 キヤノン株式会社 インプリント装置及び物品製造方法
JP6379937B2 (ja) * 2014-09-30 2018-08-29 大日本印刷株式会社 ステージ制御方法、修正テンプレートの製造方法、およびテンプレート観察修正装置
CN105487151A (zh) * 2016-01-22 2016-04-13 武汉理工大学 一种基于纳米压印的图形转移制备光栅的方法

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Publication number Publication date
KR102246569B1 (ko) 2021-04-30
KR20180048323A (ko) 2018-05-10
JP2018074041A (ja) 2018-05-10

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