JP6768185B2 - ダイシング方法及び装置 - Google Patents

ダイシング方法及び装置 Download PDF

Info

Publication number
JP6768185B2
JP6768185B2 JP2018211635A JP2018211635A JP6768185B2 JP 6768185 B2 JP6768185 B2 JP 6768185B2 JP 2018211635 A JP2018211635 A JP 2018211635A JP 2018211635 A JP2018211635 A JP 2018211635A JP 6768185 B2 JP6768185 B2 JP 6768185B2
Authority
JP
Japan
Prior art keywords
blade
cutting mark
dicing
cutting
dicing tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018211635A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020037170A (ja
JP2020037170A5 (https=
Inventor
朋来 福家
朋来 福家
翼 清水
翼 清水
真生 西山
真生 西山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of JP2020037170A publication Critical patent/JP2020037170A/ja
Publication of JP2020037170A5 publication Critical patent/JP2020037170A5/ja
Application granted granted Critical
Publication of JP6768185B2 publication Critical patent/JP6768185B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2018211635A 2018-02-08 2018-11-09 ダイシング方法及び装置 Active JP6768185B2 (ja)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2018021222 2018-02-08
JP2018021222 2018-02-08
JP2018163614 2018-08-31
JP2018163613 2018-08-31
JP2018163614 2018-08-31
JP2018163615 2018-08-31
JP2018163615 2018-08-31
JP2018163613 2018-08-31

Publications (3)

Publication Number Publication Date
JP2020037170A JP2020037170A (ja) 2020-03-12
JP2020037170A5 JP2020037170A5 (https=) 2020-08-06
JP6768185B2 true JP6768185B2 (ja) 2020-10-14

Family

ID=67549577

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018211635A Active JP6768185B2 (ja) 2018-02-08 2018-11-09 ダイシング方法及び装置
JP2018211636A Active JP6748892B2 (ja) 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法並びにダイシングテープ
JP2018211634A Active JP6748891B2 (ja) 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2018211636A Active JP6748892B2 (ja) 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法並びにダイシングテープ
JP2018211634A Active JP6748891B2 (ja) 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法

Country Status (3)

Country Link
JP (3) JP6768185B2 (https=)
CN (3) CN112536700B (https=)
WO (1) WO2019155707A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7266398B2 (ja) * 2018-12-11 2023-04-28 株式会社ディスコ 切削装置及び切削装置を用いたウエーハの加工方法
JP7562230B2 (ja) * 2020-08-31 2024-10-07 株式会社ディスコ ウェーハの加工方法
JP2022080757A (ja) * 2020-11-18 2022-05-30 株式会社ディスコ 切削ブレードの直径測定方法
CN114057384B (zh) * 2021-12-10 2024-06-11 青岛天仁微纳科技有限责任公司 一种扫描电镜辅助定位裂片装置及使用方法
CN117301328A (zh) * 2023-10-20 2023-12-29 北京中电科电子装备有限公司 一种晶片切割装置、划膜测高方法及切割方法
CN117790294B (zh) * 2023-12-29 2026-02-06 沈阳和研科技股份有限公司 一种用于划片机的切割刀高度调整方法、装置及划片机

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227557A (ja) * 1990-02-01 1991-10-08 Mitsubishi Electric Corp ダイシング装置
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP2005203540A (ja) * 2004-01-15 2005-07-28 Disco Abrasive Syst Ltd ウエーハの切削方法
JP4554265B2 (ja) * 2004-04-21 2010-09-29 株式会社ディスコ 切削ブレードの位置ずれ検出方法
JP4748643B2 (ja) * 2005-01-28 2011-08-17 株式会社ディスコ 切削ブレードの基準位置検出方法
JP4943688B2 (ja) * 2005-10-21 2012-05-30 株式会社ディスコ 切削装置
JP5340808B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5647510B2 (ja) * 2010-12-27 2014-12-24 株式会社小金井精機製作所 切削加工装置及び切削加工方法
JP5858684B2 (ja) * 2011-08-15 2016-02-10 株式会社ディスコ 切削方法
JP6219628B2 (ja) * 2013-07-17 2017-10-25 株式会社ディスコ 切削ブレード先端形状検出方法
JP6228044B2 (ja) * 2014-03-10 2017-11-08 株式会社ディスコ 板状物の加工方法
JP2016019249A (ja) * 2014-07-11 2016-02-01 キヤノン株式会社 表示制御装置
JP2016063060A (ja) * 2014-09-18 2016-04-25 株式会社ディスコ ウエーハの加工方法
JP2016192494A (ja) * 2015-03-31 2016-11-10 株式会社ディスコ ウエーハの分割方法
CN106334989A (zh) * 2016-11-02 2017-01-18 佛山市百思科铁芯制造有限公司 一种变压器铁芯专用切割机

Also Published As

Publication number Publication date
JP2020037170A (ja) 2020-03-12
JP2020037171A (ja) 2020-03-12
JP6748892B2 (ja) 2020-09-02
CN113290484B (zh) 2023-04-25
CN113290484A (zh) 2021-08-24
JP6748891B2 (ja) 2020-09-02
CN111699545B (zh) 2021-09-14
CN111699545A (zh) 2020-09-22
CN112536700B (zh) 2022-04-29
WO2019155707A1 (ja) 2019-08-15
CN112536700A (zh) 2021-03-23
JP2020037169A (ja) 2020-03-12

Similar Documents

Publication Publication Date Title
JP6768185B2 (ja) ダイシング方法及び装置
KR102154719B1 (ko) 판형물의 가공 방법
JP7596631B2 (ja) ダイシング装置及びダイシング方法
TWI782163B (zh) 切割刀片的修整方法
JP5919002B2 (ja) 切削装置
JP6953075B2 (ja) 切削装置及びウェーハの加工方法
JP5762005B2 (ja) 加工位置調製方法及び加工装置
JP6457327B2 (ja) セットアップ方法
JP6899270B2 (ja) 板状ワークの分割方法
JP6184162B2 (ja) 切削方法
JP7292799B2 (ja) 修正方法
JP6252838B2 (ja) ダイシング装置及びその切削方法
JP5387887B2 (ja) 面取り加工方法及び面取り加工装置
JP2020116655A (ja) 切削装置及び切削ブレードのドレッシング方法
JP2025079929A (ja) 鋸ブレードのドレッシング方法
JP2025097209A (ja) 測定方法、測定装置、及び被加工物の加工方法
JP2022080757A (ja) 切削ブレードの直径測定方法
JP2024053742A (ja) ウエーハの加工方法及び加工装置
JP2014086610A (ja) 加工方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200624

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200624

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20200624

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20200701

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200709

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200807

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200819

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200901

R150 Certificate of patent or registration of utility model

Ref document number: 6768185

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250