JP6768185B2 - Dicing method and equipment - Google Patents

Description

The present invention relates to a dicing apparatus and a dicing method, and more particularly to a dicing apparatus and a dicing method for dividing a workpiece such as a wafer on which a semiconductor device or an electronic component is formed into individual chips.

In a dicing device that divides a workpiece such as a wafer on which a semiconductor device or an electronic component is formed into individual chips, a blade that is rotated at high speed by a spindle, a work table that attracts and holds the workpiece, and a work table and a blade are used. It includes X, Y, Z, and θ drive units that change their relative positions. In this dicing device, dicing (cutting) is performed by cutting the work with the blade while relatively moving the blade and the work by each drive unit.

In a dicing device, it is an important factor to match the cutting amount of the blade with the set value, and in order to match the cutting amount of the blade with the set value, positioning of the Z axis, which is the cutting direction to the work, is repeated with high accuracy. It is necessary to detect and correct the wear of the blade.

For example, as described in Patent Document 1, conventionally, in positioning the Z-axis, the blade is first brought into contact with the upper surface of the work table to detect electrical continuity, and the center position of the blade at this time is used as a reference position for the Z-axis. Is in control. The operation of bringing this blade into contact with the upper surface of the work table to detect electrical continuity is called a cutter set. Further, in the blade wear correction, the blade and the work table are brought into contact with each other every time the work is machined for a set number of lines, and the reference position is corrected. However, this method brings the blade into contact with the work table, which can damage the blade.

In order to solve the problem of the contact type cutter set, for example, Patent Document 2 proposes an optical cutter set device. In this optical cutter set device, the blade is moved in the Z-axis direction orthogonal to the optical axis between the light projecting means and the light receiving means, and the detected light is gradually blocked by the blade to reach a preset light receiving amount. The blade is positioned with reference to the center position of the blade when the blade is closed.

Japanese Unexamined Patent Publication No. 2003-21135 Japanese Unexamined Patent Publication No. 2003-234309

By the way, there are three blade dicing methods: half-cut, semi-full-cut, and full-cut. In recent years, as the diameter of the workpiece has increased, the full-cut method for completely cutting the workpiece has become the mainstream. In the full-cut method, the work is placed on the work table with the work attached to the dicing tape, and the work is cut from the surface side of the work to the dicing tape by the blade while moving the blade and the work table relatively. Is divided into individual chips.

However, the above-mentioned conventional technique has a problem that it cannot sufficiently cope with dicing for performing a full cut of a work.

That is, in the case of the full cut method, it is necessary to control the cutting depth (cutting amount) of the blade so that the blade sufficiently penetrates the work and does not reach the work table.

For example, as shown in FIG. 22, when the work W is fully cut, the height H of the blade 90 (height from the surface of the work table to the center position of the blade 90) is the depth of cut D into the work W. Is positioned to be larger than the thickness M of the work W. Then, the work table (not shown) is cut and fed in the X direction with respect to the blade 90 rotated at high speed, so that a cutting groove 92 for one line is formed in the work W.

However, when the thickness of the dicing tape T varies, for example, as shown in FIG. 23, when the dicing tape thickness K1 is thinner than the dicing tape thickness K shown in FIG. 22, the work W is reached. The cutting depth D1 of is smaller than the cutting depth D shown in FIG. That is, the blade 90 is shallowly cut with respect to the work W. In this case, the blade 90 is not sufficiently cut into the work W, which causes a cutting defect.

On the other hand, as shown in FIG. 24, in the portion where the dicing tape thickness K2 is thicker than the dicing tape thickness K shown in FIG. 22, the cutting depth D2 into the work W is the cutting depth D shown in FIG. Will be larger than. That is, the blade 90 is deeply cut with respect to the work W. In this case, the blade 90 cuts into the dicing tape T more than necessary. Therefore, the blade 90 is liable to be clogged by the adhesive on the surface of the dicing tape, which causes the blade 90 to become dull.

In this way, even when the blade is set to a predetermined height, if there is a thickness variation in the dicing tape, the depth at which the blade cuts into the dicing tape varies, so that the processing quality is stable. There may be problems that do not occur. It should be noted that the same problem occurs not only due to the variation in the thickness of the dicing tape but also due to the waviness of the surface of the work table and the wear of the blade.

Particularly in recent years, the blade width of the blade tends to become thinner as the number of chips per wafer increases. As the blade width becomes thinner, the abrasive grains of the blade also decrease, so that the blade is likely to be clogged by the adhesive on the surface of the dicing tape, and the above-mentioned problem becomes more remarkable.

The present invention has been made in view of such circumstances, and provides a dicing apparatus and a dicing method capable of stabilizing the processing quality without being affected by the thickness variation of the dicing tape. The purpose.

The following inventions are provided in order to achieve the above object.

The dicing device according to the first aspect of the present invention is a dicing device that performs dicing processing by relatively moving a blade rotated by a spindle and a work table while holding a work on a work table via a dicing tape. , The cutting depth to the dicing tape is determined based on the cutting mark detection part that detects the cutting mark information formed in the surface area of the dicing tape to which the work is not attached and the cutting mark information detected by the cutting mark detection part. A control unit that controls the height of the blade so as to be constant is provided.

The dicing apparatus according to the second aspect of the present invention is a dicing apparatus that performs dicing processing by relatively moving a blade rotated by a spindle and a work table while holding a work on a work table via a dicing tape. , Cutting mark detection that detects cutting mark information formed in the surface area of the dicing tape that is not attached with a work and is periodically provided with irregularities along the relative movement direction between the blade and the work table. A unit and a control unit that controls the height of the blade so that the cutting depth into the dicing tape becomes constant based on the cutting mark information detected by the cutting mark detecting unit are provided.

In the second aspect, the dicing apparatus according to the third aspect of the present invention is a plate arranged between the work table and the dicing tape, and irregularities are periodically formed along the relative movement direction between the blade and the work table. A shaped member is further provided, and the dicing tape is attracted to the work table via the plate-shaped member so that unevenness is formed on the surface region of the dicing tape.

In the second aspect of the dicing apparatus according to the fourth aspect of the present invention, the surface of the work table is periodically formed with irregularities along the relative movement direction between the blade and the work table, and the dicing tape is worked on. By adsorbing to the table, unevenness is formed on the surface area of the dicing tape.

A fifth aspect of the present invention is the dicing tape used in the dicing apparatus of the second aspect, which has irregularities provided on at least one of the base material and the adhesive layer of the dicing tape, and the surface of the dicing tape due to the irregularities. The unevenness of the area is configured.

In any of the first to fifth aspects of the dicing apparatus according to the sixth aspect of the present invention, the cutting mark detecting unit calculates the cutting mark formation rate in the surface region of the dicing tape based on the cutting mark information. The control unit controls the height of the blade so that the cutting mark formation rate is within a certain range based on the cutting mark formation rate calculated by the cutting mark detection unit.

The dicing apparatus according to the seventh aspect of the present invention is a dicing apparatus that performs dicing processing by relatively moving a blade rotated by a spindle and a work table while holding a work on a work table via a dicing tape. This is a cutting mark formation control unit that forms cutting marks in the surface area of the dicing tape to which the work is not attached, and moves the blade away from the dicing tape as the blade and the work table move relative to each other. Based on the cutting mark formation control unit that forms the cutting mark disappearance point, the cutting mark detection unit that detects the cutting mark information including the position of the cutting mark disappearance point, and the cutting mark information detected by the cutting mark detection unit. It is provided with a control unit that controls the height of the blade so that the depth of cut into the dicing tape is constant.

The dicing apparatus according to the eighth aspect of the present invention includes an image pickup device arranged at a position facing the work table in any one of the first to seventh aspects, and the cutting mark detection unit is imaged by the image pickup device. Cutting mark information is detected based on the image data of the surface area of the dicing tape.

In the eighth aspect of the dicing apparatus according to the ninth aspect of the present invention, the image pickup apparatus is composed of an alignment camera.

The dicing device according to the tenth aspect of the present invention includes a distance measuring device arranged at a position facing the work table in any one of the first to seventh aspects, and the cutting mark detecting unit measures with the distance measuring device. The cutting mark information is detected based on the distance data indicating the distance to the surface region of the dicing tape.

The dicing method according to the twelfth aspect of the present invention is a dicing method in which a dicing process is performed by relatively moving a blade rotated by a spindle and a work table while holding the work on a work table via a dicing tape. , The depth of cut into the dicing tape is constant based on the detection step that detects the cutting mark information formed in the surface area of the dicing tape to which the work is not attached and the cutting mark information detected in the detection step. It is equipped with a control step for controlling the height of the blade.

The dicing method according to the thirteenth aspect of the present invention is a dicing method in which a dicing process is performed by relatively moving a blade rotated by a spindle and a work table while holding the work on a work table via a dicing tape. , A detection step for detecting cutting mark information formed in the surface region of a dicing tape in which a work is not attached and irregularities are periodically provided along the relative movement direction between the blade and the work table. , A control step for controlling the height of the blade so that the depth of cut into the dicing tape becomes constant based on the cutting mark information detected in the detection step is provided.

In the thirteenth aspect, the dicing method according to the fourteenth aspect of the present invention is such that unevenness is formed on the surface region of the dicing tape by providing unevenness on at least one of the base material and the adhesive layer of the dicing tape. Is.

In the dicing method according to the fifteenth aspect of the present invention, in the thirteenth aspect, a plate-shaped member in which irregularities are periodically formed along the relative movement direction between the blade and the work table is placed between the work table and the dicing tape. The dicing tape is attracted to the work table via a plate-shaped member to form irregularities on the surface region of the dicing tape.

In the thirteenth aspect of the dicing method according to the sixteenth aspect of the present invention, unevenness is periodically formed on the surface of the work table along the relative movement direction between the blade and the work table, and the dicing tape is worked. By adsorbing to the table, unevenness is formed on the surface area of the dicing tape.

The dicing method according to the seventeenth aspect of the present invention is a dicing method in which a dicing process is performed by relatively moving a blade rotated by a spindle and a work table while holding a work on a work table via a dicing tape. This is a step of forming cutting marks in the surface area of the dicing tape to which the work is not attached, and the cutting marks disappear by moving the blade away from the dicing tape as the blade and the work table move relative to each other. A forming step for forming a point, a detection step for detecting cutting mark information including information on the position of a cutting mark disappearing point, a blade diameter calculated from the cutting mark information, and a cut into a dicing tape based on the blade diameter. It includes a control step that controls the height of the blade so that the depth is constant.

In the 17th aspect, the dicing method according to the 18th aspect of the present invention further includes a step of storing log data regarding the position of the blade at each time point when forming the cutting mark, and the cutting mark vanishing point in the detection step. The information about the position of is acquired from the log data.

The dicing method according to the 19th aspect of the present invention is such that a cutting mark is formed in the dicing tape region on the cut-out side of the work in the forming step of the 17th aspect or the 18th aspect.

In the dicing method according to the 20th aspect of the present invention, in any of the 17th to 19th aspects, the forming step and the detecting step are performed every at least one processing line.

According to the present invention, it is possible to stabilize the processing quality without being affected by the thickness variation of the dicing tape.

Schematic diagram showing the configuration of the dicing apparatus according to the present embodiment Floor plan showing the work Schematic diagram showing how dicing is performed on the work Schematic diagram showing how the image pickup device images the dicing tape area. Schematic diagram showing how the line sensor camera captures the dicing tape area. The figure which showed an example of the correction table The figure which showed the concrete operation example in this embodiment Diagram showing an example of cutting marks Cross-sectional view showing the first example in which the surface of the dicing tape is provided with irregularities. A cross-sectional view showing a second example in which the surface of the dicing tape is provided with irregularities. A cross-sectional view showing a third example in which the surface of the dicing tape is uneven. Cross-sectional view showing a fourth example in which the surface of the dicing tape is provided with irregularities. Cross-sectional view showing a fifth example in which the surface of the dicing tape is provided with irregularities. The figure which shows the example which imaged the cutting mark Flow chart showing the flow of cutting mark detection operation and blade height correction operation of this embodiment Schematic diagram showing how dicing is performed on the work The figure which shows the procedure of forming a cutting mark in a dicing tape region on a cut-out side. Top view showing cutting marks A flowchart showing a dicing method according to an embodiment of the present invention. Schematic diagram showing the configuration of the dicing apparatus according to another embodiment The figure which showed an example of the height graph generated by the cutting mark detection part. Diagram to explain conventional problems Diagram to explain conventional problems Diagram to explain conventional problems

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

<First Embodiment>
[Configuration of dicing device 10]
FIG. 1 is a schematic view showing the configuration of the dicing apparatus 10 according to the first embodiment.

As shown in FIG. 1, the dicing apparatus 10 includes a work table 12, a θ table 14, an X table 16, a blade 18, a spindle 20, a Y table (not shown), and a Z table (not shown). The image pickup device 22 and the control device 50 are provided.

The work table 12 sucks and holds the work W. The work W is attached to the frame F via a dicing tape Т having an adhesive on the surface, and is adsorbed and held on the work table 12. The frame F to which the dicing tape T is attached is held by the frame holding means (not shown) arranged on the work table 12.

FIG. 2 is a plan view showing the work W. As shown in FIG. 2, processing lines (scheduled division lines) S are formed in a grid pattern on the surface of the work W, and devices are formed in a plurality of regions (device formation regions) C partitioned by these processing lines S. Is formed.

Returning to FIG. 1, the X table 16 is provided on the upper surface of the X base (not shown). The X table 16 is configured to be movable in the X direction by an X drive unit (not shown) including a motor, a ball screw, and the like. A θ table 14 is placed on the X table 16, and a work table 12 is attached to the θ table 14. The θ table 14 is configured to be rotatable in the θ direction (rotation direction centered on the Z axis) by a rotation drive unit (not shown) including a motor and the like.

The Y table is provided on the side surface of the Y base (not shown). The Y table is configured to be movable in the Y direction by a Y drive unit (not shown) including a motor and a ball screw. A Z table (not shown) is attached to the Y table. The Z table is configured to be movable in the Z direction by a Z drive unit (not shown) including a motor and a ball screw. A spindle 20 with a built-in high-frequency motor, to which a blade 18 is attached to the tip, is fixed to the Z table.

With this configuration, the blade 18 is index-fed in the Y direction and cut-fed in the Z direction. Further, the work table 12 is rotated in the θ direction and cut and fed in the X direction.

The spindle 20 is rotated at high speed, for example, at 30,000 rpm to 60,000 rpm.

The blade 18 is a cutting blade configured in a thin disk shape. As the blade 18, a diamond abrasive grain, an electrodeposition blade in which CBN (Cubic Boron Nitride) abrasive grains are electrodeposited with nickel, a resin blade in which a resin is bonded, or the like is used. The dimensions of the blade 18 are variously selected depending on the processing content, but when dicing a normal semiconductor wafer as a work W, those having a diameter of about 50 mm and a thickness of about 30 μm are used.

The image pickup device 22 is arranged at a position facing the work table 12. The image pickup device 22 images the surface of the work W in order to evaluate the alignment and processing state of the work W (calf check). The image pickup device 22 is an example of the image pickup device (alignment camera) of the present invention.

The image pickup apparatus 22 is composed of a microscope, a camera, or the like, and images the surface of the work W at a high magnification (for example, 8.0 times) or a low magnification (for example, 1.0 times) by a method such as switching the lens of the microscope. It is possible. As the camera, an area sensor camera is used.

The image pickup device 22 is fixed to the spindle 20 via the holding member 24, and can move in the Y direction and the Z direction integrally with the spindle 20.

The control device 50 controls the operation of each part of the dicing device 10. The control device 50 is realized by a general-purpose computer such as a personal computer or a microcomputer.

The control device 50 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk, and the like. In the control device 50, various programs such as a control program stored in the ROM are expanded in the RAM, and the programs expanded in the RAM are executed by the CPU, so that each part shown in the control device 50 in FIG. 1 The function is realized.

The control device 50 functions as a cutting mark detection unit 52, a storage unit 54, and a control unit 56.

The control unit 56 controls the operation of each unit of the control device 50. Specifically, the control unit 56 controls the cutting feed of the work table 12 in the X direction via the X drive unit and the rotation of the work table 12 in the θ direction via the θ drive unit. Further, the control unit 56 controls the index feed of the spindle 20 in the Y direction via the Y drive unit and the cut feed of the spindle 20 in the Z direction via the Z drive unit. Further, the control unit 56 controls the rotation operation of the spindle 20 and the imaging operation of the imaging device 22.

The storage unit 54 stores various data necessary for the operation of the dicing device 10. The storage unit 54 also includes data on the work W, data on alignment, and the thickness of the dicing tape T. For example, the data related to the work W includes a product type number, a material, an external dimension, a thickness, a chip size, and the like. Further, the storage unit 54 also stores the cutting mark formation rate Q and the correction table (see FIG. 6), which will be described later.

The cutting mark detection unit 52 receives the image data captured by the image pickup apparatus 22 during the dicing process, and detects the cutting mark information described later by image processing or the like.

[Action of dicing device 10]
Next, the operation of the dicing device 10 configured in this way will be described.

First, the work W attached to the frame F via the dicing tape Т is conveyed by a conveying means (not shown) and placed on the work table 12. The work W placed on the work table 12 is imaged by the image pickup apparatus 22, and an alignment operation for relatively aligning the work W and the blade 18 is started.

When the alignment operation is completed, the spindle 20 is activated to rotate the blade 18, and cutting water and cooling water are supplied from various nozzles (not shown) provided on the wheel cover (not shown) covering the blade 18. In this state, the work table 12 is cut and fed in the X direction, the spindle 20 is cut and fed in the Z direction, and the work W is diced along the machining line S. Every time one line is machined, the spindle 20 is indexed in the Y direction, and when the machining in one direction is completed, the work table 12 rotates 90 degrees and the work W is diced in a grid pattern.

In the present embodiment, during the dicing of the work W, a cutting mark detection operation and a blade height correction operation, which will be described later, are performed for each processing line S.

In the present embodiment, the cutting mark detection operation and the blade height correction operation, which will be described later, are performed for each processing line S, but the present invention is not limited to this, and each processing line number specified by the user (for example, for example). It may be carried out every 5 processing lines). Further, it may be performed on a machining line S designated by the user (for example, a machining line S such as the first line, the fifth line, the seventh line, etc.).

(Cutting mark detection operation)
Next, the cutting mark detection operation will be described.

FIG. 3 is a schematic view showing how the dicing process is performed on the work W.

In the present embodiment, as shown in FIG. 3, the blade 18 is dicing while moving relative to the work W from the cutting start position P1 on one side to the cutting end position P4 on the other side with the work W in between. Processing is performed. At this time, a cutting groove 26 is formed in the work W, and the cutting is performed by the blade 18 in the surface region R (hereinafter, referred to as “dicing tape region R”) of the dicing tape T to which the work W is not attached. Traces 28 are formed.

For example, when the cutting mark 28 in the dicing tape region R is short and shredded as a whole (see FIG. 3), or when the cutting mark 28 does not exist at all, the blade 18 is shallowly cut. It has become. In this case, the blade 18 does not sufficiently cut into the work W, which causes a cutting defect.

On the other hand, when the cutting marks 28 in the dicing tape region R are connected for a long time as a whole, the blade 18 is deeply cut. In this case, the sharpness may deteriorate due to clogging of the blade 18.

As a result of repeated studies, the present inventor may correct the height (position in the Z direction) of the blade 18 based on the cutting mark formation rate Q in the dicing tape region R in order to stabilize the processing quality. I found a good thing. Here, the cutting mark formation rate Q is the ratio of the region (length in the cutting feed direction) in which the cutting mark 28 is formed in the dicing tape region R to the whole (total length in the cutting feed direction of the dicing tape region R). To say.

The cutting mark detection operation in the present embodiment is performed by imaging the dicing tape region R with the image pickup device 22.

FIG. 4 is a schematic view showing how the image pickup device 22 images the dicing tape region R. As shown in FIG. 4, the image pickup apparatus 22 images the dicing tape area R at a plurality of locations at a high magnification while shifting the position with respect to the dicing tape area R in the X direction, and divides the dicing tape area R into a plurality of divided images. Take an image of the whole. The image data captured by the image pickup device 22 is output to the control device 50. The image pickup device 22 may image a wide range of the dicing tape region R at a time with a low magnification.

In the present embodiment, the area sensor camera is used as the camera constituting the image pickup apparatus 22, but the present invention is not limited to this, and for example, a line sensor camera may be used.

FIG. 5 is a schematic view showing how the line sensor camera 30 images the dicing tape region R. As shown in FIG. 5, in the line sensor camera 30, a plurality of light receiving elements (not shown) are arranged in a row in the Y direction, and the entire dicing tape region R is imaged while scanning in the X direction. It has become.

The cutting mark detecting unit 52 detects the length (length in the cutting feed direction) of the cutting mark 28 formed in the dicing tape region R by performing image processing on the image data captured by the imaging device 22 by a known method. To do. Further, the cutting mark detection unit 52 calculates the cutting mark formation rate Q in the dicing tape region R based on the length of the detected cutting mark 28.

Here, a method of calculating the cutting mark formation rate Q in the dicing tape region R will be described.

In FIG. 3, when the blade 18 moves relative to the work W from the cutting start position P1 to the cutting end position P4, the position where the blade 18 starts cutting into the work W is set as the work entry position P2, and the blade 18 works. The position at which the cutting into W is completed is defined as the work exit position P3.

At this time, the cutting marks 28 are formed in the dicing tape area R1 between the cutting start position P1 and the work entry position P2, and in the dicing tape area R2 between the work exit position P3 and the cutting end position P4, respectively.

Further, the total length of the dicing tape areas R1 and R2 in the cutting feed direction (X direction) is L1 and L2, respectively, and the total length of the cutting marks 28 formed in the dicing tape areas R1 and R2 is l1. Let it be l2. For example, as shown in FIG. 3, when a plurality of cutting marks 28 are formed in the dicing tape region R1, the total length of each cutting mark 28 is set to l1. The same applies to the dicing tape area R2.

The cutting mark detection unit 52 calculates the cutting mark formation rate Q by the following formula (1). The cutting mark formation rate Q is stored in the storage unit 54 in association with the machining line information (machining line number or the like) when the cutting mark 28 is formed. The unit of the cutting mark formation rate Q is%.

Q = {(l1 + l2) / (L1 + L2)} × 100 ... (1)
(Blade height correction operation)
Next, the blade height correction operation will be described.

In the blade height correction operation, the control unit 56 acquires the cutting mark formation rate Q of the reference line from the storage unit 54. The reference line is a machining line S in which dicing is performed immediately before the current machining line S, and the cutting mark formation rate Q has already been calculated by the above-mentioned cutting mark detection operation.

The control unit 56 further determines the blade height correction amount G corresponding to the cutting mark formation rate Q of the reference line according to the correction table (see FIG. 6) stored in the storage unit 54. Then, the control unit 56 controls the height (position in the Z direction) of the blade 18 based on the determined blade height correction amount G.

(Correction table)
FIG. 6 is a diagram showing an example of a correction table. As shown in FIG. 6, the correction table shows the correspondence between the cutting mark formation rate Q and the blade height correction amount G. This correction table also includes a target cutting mark formation rate (target formation rate) and an allowable range thereof (target formation rate allowable range). Each numerical value in the correction table can be appropriately set by the user via an operation unit (not shown) connected to the control device 50. Further, the blade height correction amount G indicates a correction in the direction in which the depth of cut from the set value to the work W becomes deeper when the value is positive, and the set value when the value is negative. The correction is shown in the direction in which the depth of cut from the work W to the work W becomes shallower.

(Specific operation example)
FIG. 7 is a diagram showing a specific operation example in the present embodiment. Here, in order to simplify the description, a case where the four machining lines S1 to S4 along the cutting feed direction (X direction) are diced in the order of the line numbers will be described.

As shown in FIG. 7, first, dicing processing is performed on the first processing line S1. In this case, since the reference line does not exist, the control unit 56 sets the blade height correction amount G to 0 and leaves the height of the blade 18 as the set value without correcting it. Further, the cutting mark detection unit 52 calculates the cutting mark formation rate (23% in this example) of the first processing line S1 based on the image data captured by the imaging device 22, and stores it in the storage unit 54.

Next, a dicing process is performed on the second processing line S2. In this case, the control unit 56 acquires the cutting mark formation rate Q (23%) of the first machining line S1 which is the reference line from the storage unit 54. Then, the control unit 56 determines the blade height correction amount G to +0.006 mm, and controls the height of the blade 18 according to the blade height correction amount G. Further, the cutting mark detection unit 52 calculates the cutting mark formation rate (78% in this example) of the second processing line S2 based on the image data captured by the imaging device 22, and stores it in the storage unit 54.

Next, dicing processing is performed on the third processing line S3. In this case, the control unit 56 acquires the cutting mark formation rate (78%) of the second processing line S2, which is the reference line, from the storage unit 54. At this time, since the cutting mark formation rate (78%) exceeds the allowable range (± 5%) of the target ratio (70%), the control unit 56 determines the blade height correction amount G to be −0.001 mm. Then, the height of the blade 18 is controlled according to the blade height correction amount G. Further, the cutting mark detection unit 52 calculates the cutting mark formation rate (73% in this example) of the third processing line S3 based on the image data captured by the imaging device 22, and stores it in the storage unit 54.

Next, dicing processing is performed on the fourth processing line S4. In this case, the control unit 56 acquires the cutting mark formation rate (73%) of the third machining line S3, which is the reference line, from the storage unit 54. At this time, since the cutting mark formation rate (73%) is within the allowable range (± 5%) of the target ratio (70%), the control unit 56 determines that the blade height correction amount G is 0 mm, and the blade thereof. The height of the blade 18 is controlled according to the height correction amount G.

Next, a specific example of the cutting mark 28 will be described with reference to FIG. FIG. 8 is a diagram (photograph) showing an example in which a cutting mark is imaged.

In the example shown in FIG. 8, a plurality of cutting marks 28 are formed along the machining line S, and the cutting mark formation rate Q (Ratio in the figure) is 20%. Therefore, when the cutting mark 28 is formed, the blade 18
It can be seen that the lowest point in the Z direction of the dicing tape T was on the + Z side of the average value of the height variations (unevenness) of the dicing tape T.

The control unit 56 determines the blade height correction amount G to +0.01 mm from the cutting mark formation rate Q (20%) of the machining line S and the correction table, and the height of the blade 18 according to the blade height correction amount G. To control.

(Variation in dicing tape thickness)
By the way, when the thickness variation (unevenness) of the dicing tape T is large as compared with the case where the thickness variation (unevenness) of the dicing tape T is small, even if the height variation of the blade 18 is small, this The fluctuation can be regarded as a change in the cutting mark formation rate Q. Therefore, if the thickness variation (unevenness) of the dicing tape T is increased, the accuracy of height adjustment of the blade 18 can be improved.

Therefore, in the following example, an example of adjusting the fluctuation of the cutting mark formation rate Q according to the fluctuation of the height of the blade 18 by providing the surface of the dicing tape T with irregularities will be described. As an example of providing unevenness on the surface of the dicing tape T, for example, the following can be considered.

FIG. 9 is a cross-sectional view showing a first example in which the surface of the dicing tape is provided with irregularities.

In the example shown in FIG. 9, unevenness is formed on the base material B1 of the dicing tape T1. The unevenness is periodically formed along the relative movement direction (X-axis direction) between the blade 18 and the work table 12, and extends in the Y direction. An adhesive layer A1 having a certain thickness is formed on the surface of the base material B1.

The distance D1 between the vertices of the unevenness of the base material B1 (the difference in height between the vertices of the peak and the peak of the valley bottom) D1 is, for example, 5 μm to 10 μm. Further, the repetition period of the unevenness in the X direction is, for example, 800 μm to 1 mm.

The cross-sectional shape (shape with respect to the ZX plane) of the unevenness of the base material B1 may be, for example, a curved line (for example, a quadratic or higher-order curve, a sine wave) or a triangular wave. When the cross-sectional shape of the unevenness of the base material B1 (shape with respect to the ZX plane) is a triangular wave, there is an advantage that the relationship between the height (cutting depth) of the blade 18 and the cutting mark formation rate Q becomes linear. is there.

According to the example shown in FIG. 9, by providing the surface of the dicing tape T with irregularities, it is possible to prevent the cutting mark formation rate Q from fluctuating significantly according to the fluctuation in the height of the blade 18, so that the blade can be prevented from fluctuating significantly. The accuracy of height adjustment of 18 can be ensured.

FIG. 10 is a cross-sectional view showing a second example in which the surface of the dicing tape is provided with irregularities.

In the example shown in FIG. 10, the base material B2 of the dicing tape T2 has a constant thickness. Then, irregularities are periodically formed on the surface of the adhesive layer A2 formed on the surface of the base material B1 along the X-axis direction.

FIG. 11 is a cross-sectional view showing a third example in which the surface of the dicing tape is provided with irregularities.

In the example shown in FIG. 11, unevenness is periodically formed on the base material B3 of the dicing tape T3 in the X-axis direction. Further, the adhesive layer A3 formed on the surface of the base material B3 is also periodically formed with irregularities in the X-axis direction.

The distance between the vertices of the unevenness, the repetition period in the X direction, and the cross-sectional shape in the second and third examples can be the same as those in the first example.

Further, in the first to third examples, it is not necessary to provide unevenness on the entire surface of the dicing tapes T1 to T3. For example, of the dicing tapes T1 to T3, unevenness may be provided so as to surround the work W only in the area where the work W cannot be attached (at least one of the cut-out side and cut-out side areas of the blade 18).

FIG. 12 is a cross-sectional view showing a fourth example in which the surface of the dicing tape is provided with irregularities.

In the example shown in FIG. 12, the thickness of the base material and the adhesive layer of the dicing tape T are both constant.

In the example shown in FIG. 12, a plate-shaped member 70 is provided between the work table 12 and the dicing tape T. Concavities and convexities are periodically formed on the surface of the plate-shaped member 70 along the X-axis direction. The distance between the vertices of the unevenness of the plate-shaped member 70 (the difference in height between the apex of the mountain and the apex of the valley bottom) is 5 μm to 10 μm in one example, and the repetition period of the unevenness in the X direction is 800 μm to 1 mm in one example. .. Further, the cross-sectional shape of the unevenness may be a curved line or a triangular wave as in the first to third examples.

The plate-shaped member 70 is a porous member having a plurality of through holes (not shown) extending in the Z direction. The work table 12 can attract and hold the dicing tape T through the through hole. By adsorbing the dicing tape T via the plate-shaped member 70 in this way, it becomes possible to generate irregularities on the surface of the dicing tape T. As a result, it is possible to prevent the cutting mark formation rate Q from fluctuating significantly according to the fluctuation in the height of the blade 18.

In the example shown in FIG. 12, the plate-shaped member 70 may have a planar shape corresponding to a region to which the work W is not attached, for example, a shape surrounding the work W.

FIG. 13 is a cross-sectional view showing a fifth example in which the surface of the dicing tape is provided with irregularities.

In the example shown in FIG. 13, the thickness of the base material and the adhesive layer of the dicing tape T are both constant.

In the example shown in FIG. 13, irregularities are periodically formed on the surface of the work table 12 along the X-axis direction. The distance between the vertices of the unevenness of the work table 12 (difference in height between the apex of the mountain and the apex of the valley bottom) is 5 μm to 10 μm in one example, and the repetition period of the unevenness in the X direction is 800 μm to 1 mm in one example. Further, the cross-sectional shape of the unevenness may be a curved line or a triangular wave as in the first to fourth examples.

In the example shown in FIG. 13, by adsorbing the dicing tape T on the surface of the work table 12 provided with irregularities on the surface, it is possible to generate irregularities on the surface of the dicing tape T. As a result, it is possible to prevent the cutting mark formation rate Q from fluctuating significantly according to the fluctuation in the height of the blade 18.

In the example shown in FIG. 13, unevenness may be provided only on the surface of the work table 12 where the work W cannot be attached. Further, in the example shown in FIG. 13, irregularities are formed on the surface of the work table 12, but for example, a porous surface for adsorption on the surface of the work table 12 may be used as a concave portion.

(Specific example of cutting marks)
Next, a specific example of the cutting mark 28 will be described with reference to FIG. FIG. 14 is a diagram (photograph) showing an example in which a cutting mark is imaged. In FIG. 14, a solid line showing the cross-sectional shape of the unevenness of the dicing tape T and a broken line showing the locus of the lower end portion of the blade 18 are superimposed and shown.

In the example shown in FIG. 14, a plurality of cutting marks 28 are formed along the machining line S, and the cutting mark formation rate Q is 40%. Therefore, it can be seen that the lowest point in the Z direction of the blade 18 was on the + Z side of the average value of the height variations (unevenness) of the dicing tape T when the cutting marks 28 were formed.

The control unit 56 determines the blade height correction amount G to +0.006 mm from the cutting mark formation rate Q (40%) of the machining line S and the correction table, and the height of the blade 18 according to the blade height correction amount G. To control.

In the examples shown in FIGS. 9 to 14, by providing the surface of the dicing tape T with irregularities, it is possible to stabilize the processing quality without being affected by the thickness variation of the dicing tape.

(flowchart)
FIG. 15 is a flowchart showing the flow of the cutting mark detection operation and the blade height correction operation of the present embodiment.

First, when dicing the work W, the control unit 56 confirms whether or not the cutting mark formation rate Q of the reference line is stored in the storage unit 54 (step S10).

When the cutting mark formation rate Q of the reference line exists in the storage unit 54 (YES in step S10), the control unit 56 controls the height of the blade 18 based on the cutting mark formation rate Q of the reference line (YES in step S10). Step S12). Specifically, the control unit 56 determines the blade height correction amount G corresponding to the cutting mark formation rate Q of the reference line with reference to the correction table stored in the storage unit 54. Then, the control unit 56 controls the height of the blade 18 according to the determined blade height correction amount G. After that, the process proceeds to step S14. Step S12 is an example of the control step of the present invention.

On the other hand, if the cutting mark formation rate Q of the reference line does not exist in the storage unit 54 (NO in step S10), the process proceeds to step S14.

Next, the control unit 56 dices the work W with the blade 18 rotating at high speed while relatively moving the blade 18 and the work W along the current machining line S (step S14).

Next, the dicing tape region R is imaged by the image pickup device 22. Then, the cutting mark detection unit 52 acquires the image data captured by the imaging device 22, and performs image processing on the image data by a known method to obtain information on the cutting marks 28 formed in the dicing tape region R (the cutting mark 28). Cutting mark information) is detected (step S16). The cutting mark information includes at least information on the length of the cutting mark 28 (the length in the cutting feed direction). Step S16 is an example of the detection step of the present invention.

Next, the cutting mark detection unit 52 calculates the cutting mark formation rate Q in the dicing tape region R based on the detected cutting mark information (step S18). The method for calculating the cutting mark formation rate Q is as described above (see equation (1)).

Next, the cutting mark detection unit 52 stores the calculated cutting mark formation rate Q in the storage unit 54 in association with the information (line information) related to the machining line S (step S20).

Next, the control unit 56 determines whether or not the machining of all the machining lines S has been completed (step S22). If the machining of all the machining lines S is not completed, the process moves to the next machining line S (step S24). Then, the processes from step S10 to step S22 are repeated until the processing of all the processing lines S is completed.

[Action and effect of this embodiment]
Next, the action and effect of this embodiment will be described.

According to the present embodiment, the blade is set so that the depth of cut into the dicing tape T is constant based on the cutting mark information in the dicing tape region R (the surface region of the dicing tape T to which the work W is not attached). The height of 18 is controlled. As a result, the depth at which the blade 18 cuts into the dicing tape T can be made relatively shallow and constant without being affected by variations in the thickness of the dicing tape T, thereby stabilizing the processing quality. be able to.

Further, according to the present embodiment, the cutting mark detecting unit 52 detects the cutting mark information in the dicing tape region R based on the image data captured by the imaging device 22. The image pickup device 22 is composed of an alignment camera and is originally provided in the dicing device 10, so that problems such as complicated device configuration and cost increase do not occur.

In the present embodiment, the cutting mark information is detected based on the image data captured by the imaging device 22, but the present invention is not limited to this, and for example, a distance measuring device 32 (see FIG. 20) described later is used. It may be used to detect cutting mark information. Further, the cutting mark information may be detected visually.

Further, when the number of machining lines (for example, 2067 lines) is large, the amount of blade wear until the dicing of all the machining lines S is completed cannot be ignored. Therefore, conventionally, it has been necessary to perform the cutter set many times during the dicing process to measure the current blade wear amount and adjust the height of the blade 18. On the other hand, in the present embodiment, during the dicing process of the work W, a cutting mark detection operation is performed for each processing line S. Therefore, since the current blade wear amount can be grasped in real time, it is not necessary to frequently perform the conventional blade wear amount measurement operation, and there is an advantage that the time until the dicing process is completed can be reduced. ..

Further, in the present embodiment, when dicing the current machining line S, the blade height correction amount G is determined using the cutting mark formation rate Q with the immediately preceding machining line S as a reference line. However, the present invention is not limited to this, and a dicing line S temporally or spatially adjacent to or close to the current dicing line S may be used as a reference line. The adjacent machining line S means a machining line that is temporally or spatially adjacent to the current machining line S. Further, the adjacent machining line S means a machining line S within a range of several lines (for example, 1 to 5 lines) temporally or spatially from the current machining line. Further, the reference line is not limited to one processing line S, and may be a plurality of processing lines S. In this case, for example, the blade height correction amount G may be determined based on the average value of the cutting mark formation rates Q corresponding to each of the plurality of machining lines S.

Further, in the present embodiment, the cutting quality of the dicing processing lines S (first 1 to 3 lines) may deteriorate until the height of the blade 18 stabilizes. This problem can be solved by performing empty cutting on the dicing tape T several times before actually starting the dicing process, adjusting the height of the blade 18 in advance, and then performing the dicing process.

Further, in the present embodiment, in the cutting mark detection operation, the lengths of the cutting marks 28 of both the dicing tape area R1 on the cutting side and the dicing tape area R2 on the cutting side are measured. Depending on the situation, the following operations can be considered.

(For workpieces with a high cutting load)
Since the blade 18 wears more during the dicing process, only the length of the cutting mark 28 existing in the dicing tape region R2 on the cut-out side is measured. This is because the blade 18 is severely worn during the dicing process, and even if the length of the cutting mark 28 in the dicing tape region R1 on the cutting side is measured, it cannot be used as a reference for correcting the height of the blade 18.

(If you want to improve the overall throughput)
Only the cutting marks 28 of the dicing tape area R1 on the cut-out side or the dicing tape area R2 on the cut-out side are measured, and the time required for the cutting mark detection operation is shortened as compared with the case of measuring both sides. In this case, since it is not necessary to leave the cutting mark 28 on the dicing tape T on the side where the cutting mark 28 is not measured, the work W can be cut at the position where it can be cut, and the cutting time can be further shortened.

<Second embodiment>
Next, a second embodiment of the present invention will be described. In the following description, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In this embodiment, cutting mark formation, detection operation, and blade height correction operation, which will be described later, are performed for each number of machining lines specified by the user (for example, for each j machining lines). That is, the cutting mark formation, the detection operation, and the blade height correction operation are performed on the machining line S (i) at which i = j × k + 1 (j is an integer of 1 or more and k is an integer of 0 or more).

The cutting mark formation, detection operation, and blade height correction operation may be performed on the machining line S (i) (for example, i = 1, 5, 7, ...) Designated by the user, or may be machined. It may be carried out for each line S (in this case, j = 0).

(Cutting mark formation and detection operation)
Next, the cutting mark formation and detection operation will be described.

FIG. 16 is a schematic view showing how the dicing process is performed on the work W.

In the present embodiment, as shown in FIG. 16, the blade 18 is relative to the work W from the cutting start position P1 (i) on one side to the cutting end position P2 (i) on the other side of the work W. Dicing is performed while moving in a target manner (i is an integer of 1 or more). At this time, a cutting groove 26 (i) is formed in the work W, and the surface region R (hereinafter, referred to as “dicing tape region R”) of the dicing tape T on the cut-out side to which the work W is not attached is formed. Is formed with a cutting mark 28 (i) formed by the blade 18.

In the present embodiment, the cutting mark 28 is formed by controlling the scanning of the blade 18 in the dicing tape region R on the cut-out side of the work W. Then, the height of the blade 18 is controlled according to the cutting mark information.

FIG. 17 is a diagram showing a procedure for forming a cutting mark in the dicing tape region on the cut-out side. FIG. 17A is a side view, and FIG. 17B is a plan view (XVIIB arrow view of FIG. 17A).

In the present embodiment, when the blade 18 moves to the dicing tape region R on the cut-out side, the control unit 56 (cutting mark formation control unit) moves (descends) the blade 18 in the −Z direction as shown by arrow A1. Then, cut into the dicing tape T. At this time, the position of the blade 18 in the ZX direction is adjusted so as not to come into contact with the work W.

Here, the cutting depth of the blade 18 at the position of the arrow A1 may be adjusted manually by observing the surface of the dicing tape T visually or by observing the surface of the dicing tape T in real time with the imaging device 22. Further, a sensor for measuring the torque applied to the spindle 20 is provided so that the control unit 56 automatically adjusts the depth at the time of forming the cutting mark 28 (i) according to the change in the torque. May be good. In this case, data relating to the relationship between the type of tape (for example, material and thickness) and torque fluctuation is stored in the storage unit 54, and the control unit 56 determines the cutting depth of the blade 18 based on this data. It may be possible to determine.

Next, as shown by the arrow A2, the control unit 56 continuously moves the blade 18 in the direction away from the dicing tape T (+ Z direction) while relatively moving the blade 18 and the work W in the X direction. (Rise). At this time, the magnitude of the moving (rising) speed of the blade 18 is made smaller than the magnitude of the moving speed of the blade 18 when descending as shown by the arrow A1. The control unit 56 acquires log data regarding the relative positions of the blade 18 and the work W in the ZX direction, and stores the log data in the storage unit 54.

When the blade 18 is separated from the surface of the dicing tape T as shown in FIG. 17A, the cutting mark 28 is not formed (interrupted) as shown in FIG. 17B. The imaging device 22 captures an image of the cutting mark 28 is the cutting mark 28 includes a cutting trace vanishing point P _E was interrupted (see FIGS. 5 to 7). Control unit 56 detects the cutting mark vanishing point P _E from the image, the coordinates of the center of the blade 18 corresponding to the cutting marks vanishing point _{P E (X E, Z E} ) to create a cutting mark information including, storage It is stored in the part 54. Then, the control unit 56, the Z coordinate _{Z E} in the cutting marks vanishing point _{P E,} and the Z coordinate _{Z T} of the surface of the dicing tape T, the diameter _r B of the blade _{18 (= | Z E -Z T} |) of calculate.

Next, the control unit 56 calculates the positional relationship between the lowest point of the blade 18 in the Z direction and the dicing tape T, and when it moves to the next machining line S (i), it is based on the cutting mark information. The height of the blade 18 is controlled. At this time, the control unit 56 makes the cutting depth into the dicing tape T constant based on the diameter r _{B of the} blade 18, the coordinates and thickness of the surface of the work W, and the coordinates of the surface of the dicing tape T. The height of the blade 18 is controlled.

FIG. 18 is a plan view (photograph) showing a cutting mark formed in the dicing tape region R on the cut-out side.

In the example shown in FIG. 18, since the cutting mark forming operation is performed on the machining lines S (j × k + 1) and S (j × (k + 1) + 1), the cutting marks 28 are compared with other machining lines. Is clearly formed. As a result, the control unit 56 can easily detect the interrupted position of the cutting mark 28 (i) from the image.

[Dicing method]
Next, the dicing method according to the present embodiment will be described with reference to FIG. FIG. 19 is a flowchart showing a dicing method according to a second embodiment of the present invention.

First, when cutting of the first machining line S (1) is started (step S30), the control unit 56 controls the height of the blade 18 (step S32). In step S32, the height of the blade 18 is controlled based on, for example, the design value of the diameter of the blade 18 stored in the storage unit 54 or the diameter of the blade 18 calculated in the immediately preceding dicing process.

Next, dicing (cutting) is performed on the processing line S (1) (step S34).

When the cutting of the machining line S (1) is completed and the blade 18 moves to the dicing tape region R on the cut-out side, the control unit 56 performs a cutting mark forming operation (step S40). In step S40, as shown in FIG. 17, the control unit 56 lowers the blade 18 in the dicing tape region R and then gradually and continuously raises the cutting mark 28 while scanning in the X direction to make the cutting mark 28. Form. At this time, the control unit 56 creates log data of the coordinates of the blade 18 at each time point and stores it in the storage unit 54.

Next, the image pickup apparatus 22 takes an image of the cutting mark 28 formed on the cut-out side of the processing line S (1). Control unit 56 detects the cutting mark vanishing point P _E cutting mark 28 from the image captured, detects the cutting mark information including coordinates of the cutting marks vanishing point P _E (Step S42). The control unit 56 calculates the diameter r _{B of the} blade 18 based on the cutting mark information (step S44). The diameter r _{B of the} blade 18 is stored in the storage unit 54.

Next, the control unit 56 starts cutting the next machining line S (2) and moves the blade 18 to the machining line S (2) (step S46). The control unit 56 controls the height of the blade 18 based on the diameter of the blade 18 calculated using the cutting mark information (step S48), and cuts the machining line S (2) (step S34). In step S48, the height of the blade 18 is controlled so that the depth of cut into the dicing tape T is constant.

Hereinafter, steps S34 to S52 are repeated to cut the machining line after S (3). The height of the blade 18 is controlled based on the cutting mark information every j line.

That is, in the case of i = j × k + 1 (j is an integer of 1 or more and k is an integer of 0 or more) (Yes in step S38), the process proceeds to step S40, and the dicing tape on the cut-out side of the machining line S (i) In the region R, the cutting mark forming operation (step S40) and the cutting mark detecting operation (step S42), the calculation of the diameter r _B of the blade 18 based on the cutting mark information (step S44), and the next machining line S (i). The height control of the blade 18 during cutting (steps S46 and S48) is performed. In step S44, the diameter r _{B of the} blade 18 stored in the storage unit 54 is updated.

On the other hand, when i ≠ j × k + 1 (No in step S38), the height of the blade 18 is controlled after moving to the next machining line (step S50) (step S52). In step S52, it may be the control of the height of the blade 18 is performed based on the most recent value of the diameter r _B of the blade 18 stored in the storage unit 54.

Then, when the cutting of all the processing lines S (i) is completed (Yes in step S36), the processing of FIG. 19 is completed.

[Action and effect of this embodiment]
Next, the action and effect of this embodiment will be described.

According to the present embodiment, the cutting depth into the dicing tape T becomes constant based on the cutting mark information in the dicing tape region R (the surface region of the dicing tape T on the cut-out side to which the work W is not attached). The height of the blade 18 is controlled in this way. As a result, the depth at which the blade 18 cuts into the dicing tape T can be made relatively shallow and constant without being affected by variations in the thickness of the dicing tape T, thereby stabilizing the processing quality. be able to.

Further, when the number of machining lines (for example, 2067 lines) is large, the amount of blade wear until the dicing of all the machining lines S is completed cannot be ignored. Therefore, conventionally, it has been necessary to perform the cutter set many times during the dicing process to measure the current blade wear amount and adjust the height of the blade 18. On the other hand, in the present embodiment, since the cutting mark formation and the detection operation are performed during the dicing process of the work W, the current blade wear amount can be grasped in real time. For this reason, it is not necessary to frequently perform the conventional blade wear amount measurement operation, and there is an advantage that the time until the dicing process is completed can be reduced.

Further, in the present embodiment, the cutting mark 28 is formed and detected in the dicing tape region R on the cut-out side, but the present invention is not limited to this. For example, the cutting mark forming and detecting operation may be performed in both the dicing tape region on the cutting side and the cutting tape region, or may be performed only in the dicing tape region on the cutting side.

[Other Embodiments]
FIG. 20 is a schematic view showing the configuration of the dicing apparatus 10A according to another embodiment. In FIG. 20, components common to those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 20, the dicing device 10A according to another embodiment includes a distance measuring device 32 in addition to the configuration of the dicing device 10 according to the present embodiment.

The distance measuring device 32 is arranged at a position facing the work table 12. The distance measuring device 32 measures the distance to the surface of the dicing tape region R, which is the object to be measured, and is composed of, for example, a laser displacement meter or an interference microscope. The measurement result of the distance measuring device 32 is output to the cutting mark detection unit 52 as distance data.

Further, the distance measuring device 32 is fixed to the side surface of the image pickup device 22, and can move in the Y direction and the Z direction integrally with the spindle 20 and the image pickup device 22.

With such a configuration, as a cutting mark detecting operation (first embodiment) or a cutting mark forming and detecting operation (second embodiment) performed while the work W is dicing, the distance measuring device 32 refers to the dicing tape area R. The distance to the dicing tape area R is measured while shifting the position in the X direction. The distance data, which is the measurement result of the distance measuring device 32, is output to the cutting mark detection unit 52.

The cutting mark detection unit 52 generates a height graph showing a change in height (concavo-convex state) in the dicing tape region R based on the distance data acquired from the distance measuring device 32.

FIG. 21 is a diagram showing an example of a height graph generated by the cutting mark detection unit 52. As shown in FIG. 21, the cutting mark detecting unit 52 sets a region lower than a predetermined threshold height (height indicated by a broken line in FIG. 21) in the generated height graph as a cutting mark forming region K (cutting mark). It is detected as a region where 28 is formed). Then, the cutting mark detection unit 52 calculates the cutting mark formation rate Q based on the detected cutting mark forming region K. Subsequent processing is the same as in this embodiment.

According to another embodiment, the cutting mark information in the dicing tape region R (the surface region of the dicing tape T to which the work W is not attached) can be detected based on the measurement result of the distance measuring device 32. It is possible to stabilize the processing quality in the same manner as in the present embodiment described above.

Although an example of the present invention has been described in detail, the present invention is not limited to this, and it goes without saying that various improvements and modifications may be made without departing from the gist of the present invention.

10 ... Dicing device, 12 ... Work table, 14 ... θ table, 16 ... X table, 18 ... Blade, 20 ... Spindle, 22 ... Imaging device, 24 ... Holding member, 26 ... Cutting groove, 28 ... Cutting marks, 30 ... Line sensor camera, 32 ... distance measuring device, 50 ... control device, 52 ... cutting mark detection unit, 54 ... storage unit, 56 ... control unit, 70 ... plate-shaped member, 90 ... blade, 92 ... cutting groove, 94 ... cutting Mark, W ... Work, T ... Dicing tape, Q ... Cutting mark formation rate, G ... Blade height correction amount

Claims (8)

This is a dicing method in which a blade rotated by a spindle and the work table are relatively moved to perform dicing while the work is held on the work table via a dicing tape.
It is a step of forming a cutting mark in the surface region of the dicing tape to which the work is not attached, and the blade is moved in a direction away from the dicing tape as the blade and the work table move relative to each other. And the forming step to form one cutting mark vanishing point
A detection step for detecting cutting mark information including information on the position of one cutting mark vanishing point formed in the forming step in the cutting feed direction and the position of the blade in the cutting feed direction at the cutting mark vanishing point .
A control step of calculating the diameter of the blade from the cutting mark information and controlling the height of the blade so that the cutting depth into the dicing tape becomes constant based on the diameter of the blade.
A dicing method that includes. Further provided with a step of storing log data regarding the position of the blade at each time point in forming the cutting mark.
In the detection step, information regarding the position of the cutting mark vanishing point is acquired from the log data.
The dicing method according to claim 1. In the forming step, the cutting mark is formed in the dicing tape region on the cut-out side of the work.
The dicing method according to claim 1 or 2. The forming step and the detecting step are performed every at least one machining line.
The dicing method according to any one of claims 1 to 3. A dicing device that performs dicing by relatively moving a blade that is rotated by a spindle and the work table while holding the work on the work table via dicing tape.
A cutting mark forming control unit that forms a cutting mark in the surface region of the dicing tape to which the work is not attached, and separates the blade from the dicing tape as the blade and the work table move relative to each other. A cutting mark formation control unit that moves in the direction to form one cutting mark vanishing point,
Cutting mark detection that detects cutting mark information including information on the position of one cutting mark vanishing point formed by the cutting mark forming control unit in the cutting feed direction and the position of the blade in the cutting feed direction at the cutting mark vanishing point. Department and
Based on the cutting mark information detected by the cutting mark detecting unit, a control unit that controls the height of the blade so that the cutting depth into the dicing tape becomes constant.
A dicing device equipped with. An image pickup device arranged at a position facing the work table is provided.
The cutting mark detecting unit detects the cutting mark information based on the image data of the surface region of the dicing tape imaged by the imaging device.
The dicing apparatus according to claim 5. The image pickup device is composed of an alignment camera.
The dicing apparatus according to claim 6. A distance measuring device arranged at a position facing the work table is provided.
The cutting mark detecting unit detects the cutting mark information based on the distance data indicating the distance to the surface region of the dicing tape measured by the distance measuring device.
The dicing apparatus according to claim 5.