CN112536700B - Cutting method and cutting device - Google Patents

Cutting method and cutting device Download PDF

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Publication number
CN112536700B
CN112536700B CN202011396997.9A CN202011396997A CN112536700B CN 112536700 B CN112536700 B CN 112536700B CN 202011396997 A CN202011396997 A CN 202011396997A CN 112536700 B CN112536700 B CN 112536700B
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Prior art keywords
cutting
blade
mark
cut
workpiece
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CN112536700A (en
Inventor
福家朋来
清水翼
西山真生
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Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

A cutting device (10) that performs cutting by moving a blade (18) that is rotated by a spindle (20) relative to a table (18) while holding a workpiece (W) on the table (12) with a cutting belt (T) therebetween, the cutting device (10) comprising: a cutting mark detection unit (52) that detects cutting mark information of a cutting mark formed on a surface region of a work (W) not attached to a dicing tape (T); and a control unit (56) that controls the height of the blade (18) so that the depth of cut into the cutting belt (T) is constant, on the basis of the cutting mark information detected by the cutting mark detection unit (52).

Description

Cutting method and cutting device
The present application is a divisional application of an invention patent application having an application number of 201880088934.1, an application date of 2018, 11/9/h, and an invention name of "cutting device, cutting method, and cutting tape".
Technical Field
The present invention relates to a dicing apparatus, a dicing method, and the like, and more particularly to a dicing apparatus, a dicing method, and the like for dividing a workpiece such as a wafer on which a semiconductor device and an electronic component are formed into individual chips.
Background
A dicing apparatus for dividing a workpiece such as a wafer on which semiconductor devices and electronic components are formed into individual chips, the dicing apparatus comprising: a blade rotated at a high speed by a spindle, a table for holding a workpiece by suction, and X, Y, Z and a theta drive unit for changing the relative position of the table and the blade. In this cutting device, cutting (cutting) is performed by cutting into a workpiece with the blade while relatively moving the blade and the workpiece by the respective driving portions.
In a cutting device, it is an important element to match the cutting depth of a blade with a set value, and in order to match the cutting depth of the blade with the set value, it is necessary to repeatedly perform positioning of the Z axis, which is the cutting direction into a workpiece, with high accuracy, and to detect and correct wear of the blade.
For example, as described in patent document 1, in the conventional Z-axis positioning, first, the blade is brought into contact with the top surface of the table to detect electrical conduction, and the Z-axis control is performed using the center position of the blade at that time as a reference position. The operation of bringing the blade into contact with the upper surface of the table and detecting electrical conduction is referred to as tool setting. In addition, for the wear correction of the blade, the blade is brought into contact with the table every time the workpiece is processed by a set number of lines, and the reference position is corrected. However, in this method, the blade may be damaged because the blade is brought into contact with the table.
In order to solve the problem of the contact type tool setting, for example, patent document 2 proposes an optical tool setting device. The optical tool setting device moves a blade between a projection light unit and a light receiving unit along a Z-axis direction orthogonal to an optical axis, gradually blocks detection light by the blade, and positions the blade with reference to a blade center position when a preset light receiving amount is reached.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open publication No. 2003-211350
Patent document 2: japanese patent laid-open publication No. 2003-234309
Disclosure of Invention
Problems to be solved by the invention
However, the blade cutting method includes three methods, i.e., half-cut, half-full-cut, and full-cut. In recent years, with the increase in the diameter of a workpiece, a full-cutting type for completely cutting the workpiece has become mainstream. In the full-cut method, a workpiece is placed on a table in a state of being attached to a dicing tape, and the workpiece is cut into the dicing tape from the front surface side of the workpiece by a blade while relatively moving the blade and the table, thereby dividing the workpiece into individual chips.
However, the above-described conventional techniques have a problem that the cutting for performing the full-cut of the workpiece cannot be sufficiently performed.
That is, in the case of the full cutting method, it is necessary to control the cutting depth (cutting depth) of the blade so that the blade penetrates the workpiece sufficiently and does not reach the table.
For example, as shown in fig. 22, when performing full cutting of the workpiece W, the height H of the blade 90 (height from the table surface to the center position of the blade 90) is positioned so that the depth D of cut into the workpiece W is greater than the thickness M of the workpiece W. Then, the table (not shown) is cut and fed in the X direction with respect to the blade 90 rotating at a high speed, thereby forming the cutting grooves 92 corresponding to one line in the workpiece W.
However, when the thickness of the dicing tape T varies, for example, as shown in fig. 23, the depth D1 of the cut into the workpiece W is smaller than the depth D of the cut shown in fig. 22 in a portion where the dicing tape thickness K1 is smaller than the dicing tape thickness K shown in fig. 22. That is, the insert 90 is shallow cut with respect to the workpiece W. In this case, the insert 90 cannot sufficiently cut into the workpiece W, which causes a cutting failure.
On the other hand, as shown in fig. 24, in the portion where the dicing tape thickness K2 is thicker than the dicing tape thickness K shown in fig. 22, the depth D2 of cut into the workpiece W is larger than the depth D shown in fig. 22. That is, the blade 90 is deep cut with respect to the workpiece W. In this case, the blade 90 cuts into the cutting tape T beyond the need. Therefore, the blade 90 is likely to be clogged by an adhesive or the like on the surface of the dicing tape, and becomes a factor of deterioration in the sharpness of the blade 90.
In this way, even when the blade is set to a predetermined height, if the thickness of the dicing tape varies, the depth of the blade cutting into the dicing tape varies, and thus there is a possibility that the processing quality becomes unstable. The same problem occurs not only with the thickness variation of the dicing tape but also with the undulation of the surface of the table, the abrasion of the blade, and the like.
In particular, in recent years, the blade width of the blade tends to be thin as the number of chips per wafer increases. When the blade width is made thin, the abrasive grains of the blade are also reduced, and therefore the blade is easily clogged by the adhesive or the like on the surface of the dicing tape, and the above problem becomes more remarkable.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a dicing apparatus, a dicing method, and a dicing tape that can stabilize processing quality without being affected by variations in thickness of the dicing tape or the like.
Means for solving the problems
In order to achieve the above object, the following invention is provided.
A cutting device according to a first aspect of the present invention performs cutting by relatively moving a blade rotated by a spindle and a table with a workpiece held on the table via a cutting belt, the cutting device including: a cut mark detection unit that detects cut mark information of a cut mark formed in a surface region of a dicing tape to which a workpiece is not attached; and a control unit that controls the height of the blade so that the cutting depth into the cutting belt is constant, based on the cutting mark information detected by the cutting mark detection unit.
A cutting device according to a second aspect of the present invention performs cutting by relatively moving a blade rotated by a spindle and a table with a workpiece held on the table via a cutting belt, the cutting device including: a cut mark detection unit that detects cut mark information of a cut mark formed in a surface region of the dicing tape where no workpiece is attached and where irregularities are periodically provided along a relative movement direction of the blade and the table; and a control unit that controls the height of the blade so that the cutting depth into the cutting belt is constant, based on the cutting mark information detected by the cutting mark detection unit.
A cutting device according to a third aspect of the present invention is the cutting device according to the second aspect, further comprising a plate-like member that is disposed between the table and the dicing tape and that periodically forms irregularities along a relative movement direction of the blade and the table, wherein the cutting device forms the irregularities in a surface region of the dicing tape by attracting the dicing tape to the table via the plate-like member.
A cutting device according to a fourth aspect of the present invention is the cutting device according to the second aspect, wherein irregularities are periodically formed on the surface of the table along the direction of relative movement between the blade and the table, and the irregularities are formed in the surface region of the cutting belt by attracting the cutting belt to the table.
A fifth aspect of the present invention is a dicing tape used in the dicing apparatus of the second aspect, the dicing tape having irregularities provided on at least one of a base material and an adhesive layer of the dicing tape, the irregularities constituting surface areas of the dicing tape.
A cutting apparatus according to a sixth aspect of the present invention is the cutting apparatus according to any one of the first to fifth aspects, wherein the cut mark detection unit calculates a cut mark formation rate in the surface region of the dicing tape based on the cut mark information, and the control unit controls the height of the blade so that the cut mark formation rate is within a constant range based on the cut mark formation rate calculated by the cut mark detection unit.
A cutting device according to a seventh aspect of the present invention performs cutting by moving a blade rotated by a spindle relative to a table while holding a workpiece on the table with a cutting belt interposed therebetween, the cutting device including: a cutting mark forming control part which forms a cutting mark on the surface area of the non-adhered workpiece of the cutting belt and moves the blade in a direction away from the cutting belt along with the relative movement of the blade and the workbench so as to form a cutting mark vanishing point; a cut mark detection unit that detects cut mark information including information on a position of a cut mark vanishing point; and a control unit that controls the height of the blade so that the cutting depth into the cutting belt is constant, based on the cutting mark information detected by the cutting mark detection unit.
A dicing apparatus according to an eighth aspect of the present invention is the dicing apparatus according to any one of the first to seventh aspects, further comprising an imaging device disposed at a position facing the table, wherein the cut mark detection unit detects the cut mark information based on image data of the surface area of the dicing tape imaged by the imaging device.
A cutting device according to a ninth aspect of the present invention is the eighth aspect, wherein the imaging device is constituted by an alignment camera.
A cutting device according to a tenth aspect of the present invention is the cutting device according to any one of the first through seventh aspects, further comprising a distance measuring device disposed at a position facing the table, wherein the cut mark detecting unit detects cut mark information based on distance data measured by the distance measuring device, and the distance data indicates a distance to a surface area of the dicing tape.
A cutting method according to a twelfth aspect of the present invention is a cutting method for performing cutting by relatively moving a blade rotated by a spindle and a table while holding a workpiece on the table via a cutting belt, the cutting method including: a detection step of detecting cutting mark information of a cutting mark formed in a surface area of the dicing tape to which the workpiece is not attached; and a control step of controlling the height of the blade so that the depth of cut into the cutting belt is constant, based on the cutting mark information detected in the detection step.
A cutting method according to a thirteenth aspect of the present invention is a cutting method for performing cutting by relatively moving a blade rotated by a spindle and a table with a workpiece held on the table via a cutting belt, the cutting method including: a detection step of detecting cutting mark information of a cutting mark formed by a surface region on which a workpiece is not attached and on which irregularities are periodically provided along a relative movement direction of the blade and the table of the dicing tape; and a control step of controlling the height of the blade so that the depth of cut into the cutting belt is constant, based on the cutting mark information detected in the detection step.
A dicing method according to a fourteenth aspect of the present invention is the thirteenth aspect, wherein unevenness is provided on at least one of the base material and the adhesive layer of the dicing tape, thereby forming unevenness in the surface region of the dicing tape.
A cutting method according to a fifteenth aspect of the present invention is the cutting method according to the thirteenth aspect, wherein a plate-like member having irregularities periodically formed along a direction of relative movement between the blade and the table is disposed between the table and the dicing tape, and the dicing tape is attracted to the table via the plate-like member, thereby forming the irregularities in a surface region of the dicing tape.
A cutting method according to a sixteenth aspect of the present invention is the cutting method according to the thirteenth aspect, wherein the surface of the table is periodically formed with irregularities along a direction of relative movement between the blade and the table, and the cutting tape is attached to the table, thereby forming the irregularities in the surface region of the cutting tape.
A cutting method according to a seventeenth aspect of the present invention is a cutting method for performing cutting by relatively moving a blade rotated by a spindle and a table with a workpiece held on the table via a cutting belt, the cutting method including: a forming step of forming a cutting mark in a surface area of the dicing tape to which the workpiece is not attached, and forming a cutting mark vanishing point by moving the blade in a direction away from the dicing tape in accordance with a relative movement of the blade and the table; a detection step of detecting cutting mark information including information on a position of a cutting mark vanishing point; and a control step of calculating the radius of the blade from the cutting mark information, and controlling the height of the blade based on the radius of the blade so that the depth of cut into the cutting zone is constant.
A cutting method according to an eighteenth aspect of the present invention is the seventeenth aspect, further comprising a step of storing log data on a position of the blade at each time when the cutting mark is formed, wherein in the detecting step, information on a position of the point where the cutting mark disappears is acquired from the log data.
A cutting method according to a nineteenth aspect of the present invention is the cutting method according to the seventeenth or eighteenth aspect, wherein a cutting trace is formed in a cutting tape region on a cut-off side of the workpiece.
A cutting method according to a twentieth aspect of the present invention is the cutting method according to any one of the seventeenth to nineteenth aspects, wherein the forming step and the detecting step are performed every at least one processing line.
Effects of the invention
According to the present invention, the processing quality can be stabilized without being affected by variations in the thickness of the dicing tape or the like.
Drawings
Fig. 1 is a schematic diagram showing a configuration of a cutting apparatus according to the present embodiment.
Fig. 2 is a plan view showing a workpiece.
Fig. 3 is a schematic view showing a case where a workpiece is cut.
Fig. 4 is a schematic diagram showing a case where the image pickup device picks up an image of a dicing tape region.
Fig. 5 is a schematic diagram showing a case where the linear sensor camera photographs a dicing tape region.
Fig. 6 is a diagram showing an example of the correction table.
Fig. 7 is a diagram showing a specific operation example of the present embodiment.
Fig. 8 is a view showing an example of a cut mark.
Fig. 9 is a cross-sectional view showing a first example in which irregularities are provided on the surface of a dicing tape.
Fig. 10 is a cross-sectional view showing a second example in which irregularities are provided on the surface of a dicing tape.
Fig. 11 is a cross-sectional view showing a third example in which unevenness is provided on the surface of a dicing tape.
Fig. 12 is a cross-sectional view showing a fourth example in which unevenness is provided on the surface of a dicing tape.
Fig. 13 is a cross-sectional view showing a fifth example in which unevenness is provided on the surface of a dicing tape.
Fig. 14 is a view showing an example of imaging a cut mark.
Fig. 15 is a flowchart showing the flow of the cutting mark detection operation and the blade height correction operation according to the present embodiment.
Fig. 16 is a schematic view showing a case where a workpiece is cut.
Fig. 17 is a view showing a procedure of forming a cutting mark in a cut tape region on the cut-off side.
Fig. 18 is a plan view showing a cut mark.
Fig. 19 is a flowchart showing a cutting method according to an embodiment of the present invention.
Fig. 20 is a schematic diagram showing a configuration of a cutting apparatus according to another embodiment.
Fig. 21 is a diagram showing an example of a height profile generated by the cut mark detection unit.
Fig. 22 is a diagram for explaining a conventional problem.
Fig. 23 is a diagram for explaining a conventional problem.
Fig. 24 is a diagram for explaining a conventional problem.
Description of reference numerals:
10.. a cutting device, 12.. a table, 14.. a θ table, 16.. an X table, 18.. a blade, 20.. a spindle, 22.. a photographing device, 24.. a holding member, 26.. a cutting groove, 28.. a cutting mark, 30.. a linear sensor camera, 32.. a distance measuring device, 50.. a control device, 52.. a cutting mark detecting portion, 54.. a storing portion, 56.. a control portion, 70.. a plate-shaped member, 90.. a blade, 92.. a cutting groove, 94.. a cutting mark, w.. a workpiece, t.. a cutting tape, q.. a cutting mark forming rate, g.. a blade height correction amount.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
< first embodiment >
[ Structure of cutting device 10 ]
Fig. 1 is a schematic diagram showing a configuration of a cutting apparatus 10 according to a first embodiment.
As shown in fig. 1, the cutting apparatus 10 includes a table 12, a θ table 14, an X table 16, a blade 18, a spindle 20, a Y table (not shown), a Z table (not shown), an imaging device 22, and a control device 50.
The table 12 holds the workpiece W by suction. The workpiece W is attached to the frame F by a dicing tape T having an adhesive on the surface thereof, and is sucked and held on the table 12. The frame F to which the dicing tape T is bonded is held by a frame holding unit (not shown) disposed on the table 12.
Fig. 2 is a plan view showing the workpiece W. As shown in fig. 2, machining lines (planned dividing lines) S are formed in a grid pattern on the front surface of the workpiece W, and devices are formed in a plurality of regions (device forming regions) C defined by these machining lines S.
Returning to fig. 1, the X stage 16 is provided on the upper surface of an X base, not shown. The X stage 16 is configured to be movable in the X direction by an X driving unit (not shown) including a motor, a ball screw, and the like. The θ table 14 is placed on the X table 16, and the table 12 is attached to the θ table 14. The θ table 14 is configured to be rotatable in the θ direction (a rotation direction about the Z axis) by a rotation driving unit (not shown) including a motor and the like.
The Y stage is provided on a side surface of a Y base, not shown. The Y stage is configured to be movable in the Y direction by a Y drive unit (not shown) including a motor, a ball screw, and the like. A Z stage (not shown) is attached to the Y stage. The Z stage is configured to be movable in the Z direction by a Z driving unit (not shown) including a motor, a ball screw, and the like. A spindle 20 of a high-frequency motor built-in type having a blade 18 attached to a tip thereof is fixed to the Z stage.
According to this structure, the insert 18 is indexed in the Y direction, and plunge-feed is performed in the Z direction. In addition, the table 12 is rotated in the θ direction, and the cutting feed is performed in the X direction.
The spindle 20 rotates at a high speed of, for example, 30,000rpm to 60,000 rpm.
The blade 18 is a cutting edge configured in a thin disk shape. As the blade 18, a plating blade in which diamond abrasive grains, cbn (cubic Boron nitride) abrasive grains, and resin blades bonded with resin are plated with nickel is used. The size of the blade 18 is variously selected according to the processing contents, but when a normal semiconductor wafer is cut as the workpiece W, a blade having a diameter of 50mm and a thickness of about 30 μm is used.
The imaging device 22 is disposed at a position facing the table 12. The imaging device 22 images the surface of the workpiece W in order to evaluate (notch inspection) the alignment and machining state of the workpiece W. The imaging device 22 is an example of an imaging device (alignment camera) according to the present invention.
The imaging device 22 is configured by a microscope, a camera, or the like, and can image the surface of the workpiece W at a high magnification (for example, 8.0 times) or a low magnification (for example, 1.0 times) by a method of switching a lens of the microscope or the like. As the camera, an area sensor camera is used.
The imaging device 22 is fixed to the main shaft 20 via a holding member 24, and is movable in the Y direction and the Z direction integrally with the main shaft 20.
The control device 50 controls the operation of each part of the cutting apparatus 10. The control device 50 is realized by a general-purpose computer such as a personal computer or a microcomputer.
The control device 50 includes a cpu (central Processing unit), a rom (read Only memory), a ram (random Access memory), a hard disk, and the like. In the control device 50, various programs such as control programs stored in the ROM are developed in the RAM, and the programs developed in the RAM are executed by the CPU, thereby realizing the functions of the respective sections shown in the control device 50 in fig. 1.
The control device 50 functions as a cut mark detection unit 52, a storage unit 54, and a control unit 56.
The control unit 56 controls the operations of the respective units of the control device 50. Specifically, the control unit 56 controls the cutting feed of the table 12 in the X direction via the X drive unit, and controls the rotation of the table 12 in the θ direction via the θ drive unit. The controller 56 controls the index feed of the spindle 20 in the Y direction via the Y driver and controls the cut feed of the spindle 20 in the Z direction via the Z driver. The control unit 56 controls the rotation operation of the spindle 20 and the imaging operation of the imaging device 22.
The storage unit 54 stores various data necessary for the operation of the cutting apparatus 10. The storage unit 54 also contains data relating to the workpiece W, data relating to the alignment, and the thickness of the dicing tape T. For example, the data relating to the workpiece W includes a product number, a material, an outer dimension, a thickness, a chip size, and the like. The storage unit 54 also stores a cutting mark formation rate Q, a correction table (see fig. 6), and the like, which will be described later.
The cut mark detection unit 52 receives image data captured by the imaging device 22 during the cutting process, and detects cut mark information to be described later by image processing or the like.
[ Effect of the cutting device 10 ]
Next, the operation of the cutting apparatus 10 configured as described above will be described.
First, the workpiece W attached to the frame F via the dicing tape T is conveyed by a conveying unit not shown and placed on the table 12. The workpiece W placed on the table 12 is imaged by the imaging device 22, and an alignment operation for aligning the relative positions of the workpiece W and the blade 18 is started.
When the alignment operation is completed, the spindle 20 is started to rotate the blade 18, and cutting water and cooling water are supplied from various nozzles (not shown) provided in a wheel cover (not shown) covering the blade 18. In this state, the table 12 is cut and fed in the X direction, and the spindle 20 is cut and fed in the Z direction, so that the workpiece W is cut and processed along the processing line S. For every 1 line of machining, the spindle 20 is indexed in the Y direction, and when the machining in one direction is completed, the table 12 is rotated by 90 degrees, so that the workpiece W is cut and machined into a grid shape.
In the present embodiment, in the cutting process of the workpiece W, a cutting mark detection operation and a blade height correction operation, which will be described later, are performed for each processing line S.
In the present embodiment, the cutting mark detection operation and the blade height correction operation, which will be described later, are performed for each processing line S, but the present invention is not limited thereto, and the operation may be performed for each number of processing lines (for example, for every 5 processing lines) designated by the user. The processing may be performed in a processing line S designated by the user (e.g., a processing line S such as the 1 st line, the 5 th line, or the 7 th line).
(cutting mark detection operation)
Next, the cutting-mark detection operation will be described.
Fig. 3 is a schematic view showing a case where the workpiece W is cut.
In the present embodiment, as shown in fig. 3, the blade 18 performs cutting while moving relative to the workpiece W from the cutting start position P1 on one side to the cutting end position P4 on the other side with the workpiece W interposed therebetween. At this time, a cutting groove 26 is formed in the workpiece W, and a cutting mark 28 formed by the blade 18 is formed in a surface region R of the dicing tape T to which the workpiece W is not attached (hereinafter, referred to as "dicing tape region R").
For example, in the case where the cutting marks 28 in the cutting belt region R are short and fragmentary as a whole (see fig. 3), or in the case where the cutting marks 28 are not present at all, the blade 18 is a shallow cut. In this case, the blade 18 does not sufficiently cut into the workpiece W, which causes a cutting failure.
On the other hand, in the case where the cutting mark 28 in the cutting belt region R is long as a whole, the blade 18 is a deep cut. In this case, the cutting quality may be deteriorated due to clogging of the blade 18.
As a result of repeated studies, the present inventors found that the height (Z-direction position) of the insert 18 can be corrected based on the cutting mark formation rate Q in the cutting zone region R in order to stabilize the machining quality. Here, the cutting mark formation rate Q is a ratio of the area (length in the cutting feed direction) in which the cutting mark 28 is formed in the cutting band region R to the entire area (the entire length in the cutting feed direction of the cutting band region R).
In the cutting mark detection operation of the present embodiment, the cutting tape region R is imaged by the imaging device 22.
Fig. 4 is a schematic diagram showing a case where the image pickup device 22 picks up an image of the cutting zone region R. As shown in fig. 4, the imaging device 22 images the cutting band region R at a plurality of positions at a high magnification while shifting the position relative to the cutting band region R in the X direction, and images the entire cutting band region R as a plurality of divided images. The image data captured by the imaging device 22 is output to the control device 50. The imaging device 22 may image a wide range of the cutting band region R at a time with a low magnification.
In the present embodiment, an area sensor camera is used as the camera constituting the imaging device 22, but the present invention is not limited thereto, and a linear sensor camera, for example, may be used.
Fig. 5 is a schematic diagram showing a case where the linear sensor camera 30 captures the cutting zone region R. As shown in fig. 5, in the linear sensor camera 30, a plurality of light receiving elements (not shown) are aligned in a line in the Y direction, and the entire cutting region R is imaged while scanning in the X direction.
The cut mark detection unit 52 performs image processing on the image data captured by the imaging device 22 by a known method, thereby detecting the length (the length in the cutting feed direction) of the cut mark 28 formed in the cut region R. Further, the cut mark detector 52 calculates the cut mark formation rate Q in the dicing tape region R based on the length of the detected cut mark 28.
Here, a method of calculating the cut mark formation rate Q in the cut band region R will be described.
In fig. 3, when the blade 18 moves relative to the workpiece W from the cutting start position P1 to the cutting end position P4, the position at which the blade 18 starts cutting into the workpiece W is defined as a workpiece entry position P2, and the position at which the blade 18 ends cutting into the workpiece W is defined as a workpiece exit position P3.
At this time, the cutting marks 28 are formed in the cutting zone R1 between the cutting start position P1 and the workpiece entry position P2, and the cutting zone R2 between the workpiece exit position P3 and the cutting end position P4, respectively.
The total lengths in the cutting feed direction (X direction) of the dicing tape regions R1 and R2 are L1 and L2, respectively, and the total lengths of the cutting marks 28 formed in the dicing tape regions R1 and R2 are L1 and L2, respectively. For example, as shown in fig. 3, when a plurality of cutting scratches 28 are formed in the dicing tape region R1, the total length of the cutting scratches 28 is l 1. The same applies to the dicing tape region R2.
The cut mark detection unit 52 calculates the cut mark formation rate Q by the following equation (1). The machining-mark formation rate Q is stored in the storage unit 54 in association with machining-line information (machining-line number, etc.) at the time of forming the cutting mark 28. The unit of the cut mark formation rate Q is%.
Q＝{(l1+l2)/(L1+L2)}×100···(1)
(blade height correcting action)
Next, the blade height correcting operation will be described.
In the blade height correcting operation, the control unit 56 obtains the cut mark formation rate Q of the reference line from the storage unit 54. The reference line is a machining line S on which cutting machining is performed immediately before the current machining line S, and the cut mark formation rate Q has been calculated by the above-described cut mark detection operation.
The control unit 56 also determines the insert height correction amount G corresponding to the cut mark formation rate Q of the reference line, based on the correction table (see fig. 6) stored in the storage unit 54. Then, the control unit 56 controls the height (Z-direction position) of the blade 18 based on the determined blade height correction amount G.
(correcting watch)
Fig. 6 is a diagram showing an example of the correction table. As shown in fig. 6, the correction table shows a correspondence relationship between the cutting mark formation rate Q and the insert height correction amount G. The correction table also includes a target cutting mark formation rate (target formation rate) and a permissible range thereof (target formation rate permissible range). The values of the correction table may be set appropriately by a user via an operation unit (not shown) connected to the control device 50. The insert height correction amount G indicates a correction in a direction in which the depth of cut into the workpiece W from the set value becomes deeper when the value is a positive value, and indicates a correction in a direction in which the depth of cut into the workpiece W from the set value becomes shallower when the value is a negative value.
(concrete operation example)
Fig. 7 is a diagram showing a specific operation example of the present embodiment. Here, for the sake of simplicity of explanation, a case will be described in which four processing lines S1 to S4 along the cutting feed direction (X direction) are cut in the order of line number.
As shown in fig. 7, first, the first processing line S1 is subjected to a cutting process. In this case, since there is no reference line, the control unit 56 sets the insert height correction amount G to 0, and maintains the height of the insert 18 at the set value without correcting it. The cut mark detection unit 52 calculates the cut mark formation rate (23% in this example) of the first machining line S1 based on the image data captured by the imaging device 22, and stores the calculated rate in the storage unit 54.
Subsequently, the second processing line S2 is subjected to a cutting process. In this case, the controller 56 obtains the cut mark formation rate Q (23%) of the first machining line S1 as a reference line from the storage unit 54. Then, the control section 56 determines the blade height correction amount G to be +0.006mm, and controls the height of the blade 18 in accordance with the blade height correction amount G. The cut mark detection unit 52 calculates the cut mark formation rate (78% in this example) of the second machining line S2 based on the image data captured by the imaging device 22, and stores the cut mark formation rate in the storage unit 54.
Subsequently, the third processing line S3 is subjected to a cutting process. In this case, the controller 56 obtains the cut mark formation rate (78%) of the second machining line S2 as a reference line from the storage unit 54. At this time, since the cut mark formation rate (78%) exceeds the allowable range (± 5%) of the target ratio (70%), the control unit 56 determines the insert height correction amount G to be-0.001 mm, and controls the height of the insert 18 based on the insert height correction amount G. The cut mark detection unit 52 calculates the cut mark formation rate (73% in this example) of the third machining line S3 based on the image data captured by the imaging device 22, and stores the calculated rate in the storage unit 54.
Next, the fourth processing line S4 is subjected to a cutting process. In this case, the controller 56 obtains the cut mark formation rate (73%) of the third processing line S3 as a reference line from the storage unit 54. At this time, since the cut mark formation rate (73%) is within the allowable range (± 5%) of the target ratio (70%), the control unit 56 determines the insert height correction amount G to be 0mm, and controls the height of the insert 18 based on the insert height correction amount G.
Next, a specific example of the cut line 28 will be described with reference to fig. 8. Fig. 8 is a view (photograph) showing an example of the cut mark.
In the example shown in fig. 8, a plurality of cutting marks 28 are formed along the machining line S, and the cutting mark formation rate Q (Ratio in the figure) is 20%. Therefore, when the cutting mark 28 is formed, the lowermost point of the blade 18 in the Z direction is found to be on the + Z side with respect to the average value of the heights of the thickness variations (irregularities) of the dicing tape T.
The control unit 56 determines the insert height correction amount G to be +0.01mm based on the cutting mark formation rate Q (20%) of the machining line S and the correction table, and controls the height of the insert 18 based on the insert height correction amount G.
(thickness deviation of dicing tape)
However, in the case where the thickness variation (unevenness) of the dicing tape T is large, even if the variation in the height of the blade 18 is slight, the variation can be captured as a change in the cut mark formation rate Q, as compared with the case where the thickness variation (unevenness) of the dicing tape T is small. Therefore, if the thickness variation (unevenness) of the dicing tape T is increased, the accuracy of the height adjustment of the blade 18 can be improved.
Therefore, in the following example, an example will be described in which the surface of the dicing tape T is provided with irregularities to adjust the variation in the cutting mark formation rate Q corresponding to the variation in the height of the blade 18. As an example of providing the unevenness on the surface of the dicing tape T, for example, the following example can be considered.
Fig. 9 is a cross-sectional view showing a first example in which irregularities are provided on the surface of a dicing tape.
In the example shown in fig. 9, unevenness is formed on the base material B1 of the dicing tape T1. The irregularities are formed periodically along the relative movement direction (X-axis direction) of the blade 18 and the table 12, and extend in the Y-direction. An adhesive layer a1 having a constant thickness is formed on the surface of the base material B1.
The distance D1 between the peaks of the irregularities of the base material B1 (height difference between the peak of the peak and the peak of the valley bottom) is 5 μm to 10 μm in one example. The repetition period of the irregularities in the X direction is, for example, 800 μm to 1 mm.
The cross-sectional shape (shape with respect to the ZX plane) of the irregularities of the substrate B1 may be, for example, a curve (e.g., a quadratic or higher-order curve, a sine wave), or a triangular wave. When the cross-sectional shape of the irregularities of the base material B1 (shape with respect to the ZX plane) is a triangular wave, there is an advantage that the relationship between the height (depth of cut) of the blade 18 and the cut mark formation rate Q is linear.
According to the example shown in fig. 9, by providing the surface of the dicing tape T with the irregularities, the cut mark formation rate Q can be prevented from largely varying with the variation in the height of the blade 18, and therefore the accuracy of the height adjustment of the blade 18 can be ensured.
Fig. 10 is a cross-sectional view showing a second example in which irregularities are provided on the surface of a dicing tape.
In the example shown in fig. 10, the thickness of the base material B2 of the dicing tape T2 was constant. In addition, irregularities are periodically formed in the X-axis direction on the surface of adhesive layer a2 formed on the surface of substrate B1.
Fig. 11 is a cross-sectional view showing a third example in which unevenness is provided on the surface of a dicing tape.
In the example shown in fig. 11, irregularities are periodically formed in the X-axis direction on the base material B3 of the dicing tape T3. In addition, irregularities are also periodically formed in the X-axis direction on adhesive layer A3 formed on the surface of substrate B3.
The distance between the apexes of the concavities and convexities, the repetition period in the X direction, and the cross-sectional shape in the second and third examples may be the same as those in the first example.
In the first to third examples, the unevenness may not be provided on the entire surfaces of the dicing tapes T1 to T3. For example, the irregularities may be provided so as to surround the workpiece W only in the region where the workpiece W is not attached (at least one of the regions on the cut-in side and the cut-out side of the blade 18) among the dicing tapes T1 to T3.
Fig. 12 is a cross-sectional view showing a fourth example in which unevenness is provided on the surface of a dicing tape.
In the example shown in fig. 12, the thicknesses of the base material and the adhesive layer of the dicing tape T are constant.
In the example shown in fig. 12, a plate-like member 70 is provided between the table 12 and the dicing tape T. The surface of the plate-like member 70 is periodically formed with irregularities along the X-axis direction. The distance between the apexes of the irregularities of the plate-like member 70 (the difference in height between the apex of the peak and the apex of the valley bottom) is, for example, 5 μm to 10 μm, and the repetition period of the irregularities in the X direction is, for example, 800 μm to 1 mm. In addition, the cross-sectional shape of the concave-convex may be a curved line or a triangular wave, as in the first to third examples.
The plate-like member 70 is a porous member having a plurality of through holes (not shown) extending in the Z direction. The table 12 can hold the dicing tape T by suction through the through holes. By sucking the dicing tape T through the plate-like member 70 in this manner, unevenness can be generated on the surface of the dicing tape T. This can prevent the cut mark formation rate Q from varying greatly with variations in the height of the insert 18.
In the example shown in fig. 12, the plate-like member 70 may have a planar shape corresponding to a region where the workpiece W is not attached, for example, a shape surrounding the workpiece W.
Fig. 13 is a cross-sectional view showing a fifth example in which unevenness is provided on the surface of a dicing tape.
In the example shown in fig. 13, the thicknesses of the base material and the adhesive layer of the dicing tape T are constant.
In the example shown in fig. 13, irregularities are periodically formed on the surface of the table 12 in the X-axis direction. The distance between the apexes of the irregularities of the stage 12 (the difference in height between the apex of the peak and the apex of the valley bottom) is, for example, 5 μm to 10 μm, and the repetition period of the irregularities in the X direction is, for example, 800 μm to 1 mm. In addition, the cross-sectional shape of the concave-convex may be a curved line or a triangular wave, as in the first to fourth examples.
In the example shown in fig. 13, the dicing tape T is sucked onto the surface of the table 12 having the surface provided with irregularities, whereby the irregularities can be generated on the surface of the dicing tape T. This can prevent the cut mark formation rate Q from varying greatly with variations in the height of the insert 18.
In the example shown in fig. 13, the irregularities may be provided only in the region of the surface of the table 12 to which the workpiece W is not attached. In the example shown in fig. 13, the surface of the table 12 is formed with irregularities, but for example, a porous structure for suction on the surface of the table 12 may be used as the concave portion.
(specific example of cutting marks)
Next, a specific example of the cut line 28 will be described with reference to fig. 14. Fig. 14 is a view (photograph) showing an example of the cut mark. Fig. 14 shows a solid line showing the cross-sectional shape of the irregularities of the dicing tape T and a broken line showing the trajectory of the lower end portion of the blade 18, superimposed on each other.
In the example shown in fig. 14, a plurality of cutting marks 28 are formed along the processing line S, and the cutting mark formation rate Q is 40%. Therefore, when the cutting mark 28 is formed, the lowermost point of the blade 18 in the Z direction is found to be on the + Z side with respect to the average value of the heights of the thickness variations (irregularities) of the dicing tape T.
The control unit 56 determines the insert height correction amount G to be +0.006mm based on the cutting mark formation rate Q (40%) of the machining line S and the correction table, and controls the height of the insert 18 based on the insert height correction amount G.
In the examples shown in fig. 9 to 14, by providing the surface of the dicing tape T with the irregularities, the processing quality can be stabilized without being affected by variations in the thickness of the dicing tape and the like.
(flow chart)
Fig. 15 is a flowchart showing a flow of the cutting mark detection operation and the blade height correction operation according to the present embodiment.
First, when the workpiece W is cut, the control unit 56 checks whether or not the cut mark formation rate Q of the reference line is stored in the storage unit 54 (step S10).
If the cut mark formation rate Q of the reference line is present in the storage unit 54 (yes in step S10), the control unit 56 controls the height of the blade 18 based on the cut mark formation rate Q of the reference line (step S12). Specifically, the control unit 56 refers to the correction table stored in the storage unit 54, and determines the insert height correction amount G corresponding to the cut mark formation rate Q of the reference line. Then, the control unit 56 controls the height of the blade 18 based on the determined blade height correction amount G. Then, the process proceeds to step S14. Step S12 exemplifies a control procedure of the present invention.
On the other hand, if the cut mark formation rate Q of the reference line is not present in the memory unit 54 (no in step S10), the process proceeds to step S14.
Next, the control unit 56 cuts the workpiece W by the blade 18 rotating at a high speed while relatively moving the blade 18 and the workpiece W along the current machining line S (step S14).
Next, the cutting zone R is photographed by the photographing device 22. The cut mark detection unit 52 acquires image data captured by the imaging device 22, and performs image processing on the image data by a known method to detect information (cut mark information) on the cut mark 28 formed in the cut region R (step S16). The cutting mark information includes at least information on the length of the cutting mark 28 (the length in the cutting feed direction). Step S16 exemplifies the detection step of the present invention.
Next, the cut mark detection section 52 calculates a cut mark formation rate Q in the dicing tape region R based on the detected cut mark information (step S18). The method of calculating the cut mark formation rate Q is as described above (see formula (1)).
Next, the cut mark detection unit 52 associates the calculated cut mark formation rate Q with information (line information) on the machining line S and stores the information in the storage unit 54 (step S20).
Next, the control unit 56 determines whether or not the machining of all the machining lines S is completed (step S22). If the processing in all the processing lines S is not completed, the processing line moves to the next processing line S (step S24). Then, the processing from step S10 to step S22 is repeated until the processing in all the processing lines S is completed.
[ Effect of the present embodiment ]
Next, the operation and effects of the present embodiment will be described.
According to the present embodiment, the height of the blade 18 is controlled based on the cutting mark information in the dicing tape region R (the surface region of the dicing tape T to which the workpiece W is not attached) so that the depth of cut into the dicing tape T is constant. This makes it possible to keep the depth of the blade 18 cut into the dicing tape T relatively shallow and constant without being affected by variations in the thickness of the dicing tape T, and thus to stabilize the processing quality.
In addition, according to the present embodiment, the cut mark detection section 52 detects the cut mark information in the cut region R based on the image data captured by the imaging device 22. The imaging device 22 is a device originally provided in the dicing device 10 and is configured by an alignment camera, and thus the problems of the complicated device structure and the increase in cost are not caused.
In the present embodiment, the cutting mark information is detected based on the image data captured by the imaging device 22, but the present invention is not limited to this, and the cutting mark information may be detected using, for example, a distance measuring device 32 (see fig. 20) described later. Further, the cutting mark information may be visually detected.
In addition, when the number of processing lines (for example, 2067 lines) is large, the amount of blade wear until the cutting processing of all the processing lines S is completed cannot be ignored. Therefore, conventionally, it is necessary to perform tool setting a plurality of times during the cutting process, measure the current blade wear amount, and adjust the height of the blade 18. In contrast, in the present embodiment, the cutting mark detection operation is performed for each processing line S during the cutting of the workpiece W. Therefore, since the current amount of blade wear can be grasped in real time, there is no need to frequently perform the operation of measuring the amount of blade wear as in the conventional art, and there is an advantage that the time required until the cutting process is completed can be reduced.
In the present embodiment, the blade height correction amount G is determined using the cutting mark formation rate Q of the immediately preceding machining line S as a reference line when the current machining line S is cut, but the present invention is not limited thereto, and a machining line S adjacent to or close to the current machining line S in terms of time or space may be used as a reference line. The adjacent processing line S is a processing line adjacent to the current processing line S in terms of time or space. The adjacent processing line S is a processing line S that is within a range of several lines (for example, 1 to 5 lines) in terms of time or space from the current processing line. The reference line is not limited to one processing line S, and may be a plurality of processing lines S. In this case, for example, the insert height correction amount G may be determined based on an average value of the cutting mark formation rates Q corresponding to the plurality of machining lines S.
In the present embodiment, the cutting quality of the processing lines S (first 1 to 3 lines) after the cutting process may be deteriorated until the height of the blade 18 is stabilized. This problem can be solved by performing the cutting process after the height of the blade 18 is adjusted in advance by performing the blank cutting on the cutting tape T several times before actually starting the cutting process.
In the present embodiment, the lengths of the cutting marks 28 of both the cutting band region R1 on the entry side and the cutting band region R2 on the completion side are measured in the cutting mark detection operation, but the following operation may be considered depending on the cutting conditions.
(case of cutting work with high load)
Since the blade 18 is more easily worn in the cutting process, only the length of the cutting mark 28 existing in the cutting belt region R2 that becomes the cut-off side is measured. This is because the blade 18 is worn seriously during the cutting process, and therefore even if the length of the cutting mark 28 of the cutting belt region R1 to be the entry side is measured, it does not contribute to the height correction of the blade 18.
(case where it is desired to improve the overall productivity)
Only the cutting trace 28 of the cutting tape region R1 on the entry side or the cutting tape region R2 on the cut-off side is measured, and the time required for the cutting trace detection operation is shortened as compared with the case where both sides are measured. In this case, since the cut mark 28 does not need to be left on the dicing tape T on the side where the cut mark 28 is not measured, the cutting can be performed at a position just enough to cut the workpiece W, and the cutting time can be further shortened.
< second embodiment >
Next, a second embodiment of the present invention will be explained. In the following description, the same components as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
In the present embodiment, the cutting mark forming, detecting operation, and blade height correcting operation, which will be described later, are performed for the number of machining lines (for example, for each j machining lines) specified by the user. That is, the cutting mark forming operation, the detecting operation, and the insert height correcting operation are performed on a machining line s (i) where i is j × k +1(j is an integer of 1 or more, and k is an integer of 0 or more).
The cutting mark formation, detection, and blade height correction operations may be performed on a machining line S (i) (e.g., i 1, 5, 7, etc.) designated by the user, or may be performed on each machining line S (in this case, j 0).
(cutting mark formation and detection operation)
Next, the cutting mark formation and detection operation will be described.
Fig. 16 is a schematic view showing a case where the workpiece W is cut.
In the present embodiment, as shown in fig. 16, the blade 18 performs cutting while moving relative to the workpiece W from one cutting start position P1(i) to the other cutting end position P2(i) with the workpiece W interposed therebetween (i is an integer of 1 or more). At this time, a cutting groove 26(i) is formed in the workpiece W, and a cutting mark 28(i) formed by the blade 18 is formed in a surface region R (hereinafter, referred to as "cutting tape region R") on the cut side of the cutting tape T to which the workpiece W is not attached.
In the present embodiment, the scanning control of the blade 18 is performed in the cutting zone R on the cut side of the workpiece W to form the cut mark 28. Then, the height control of the insert 18 is performed based on the cutting mark information.
Fig. 17 is a view showing a procedure of forming a cutting mark in a cut tape region on the cut-off side. Fig. 17 (a) is a side view, and fig. 17 (b) is a top view (XVIIB view of fig. 17 (a)).
In the present embodiment, when the blade 18 moves to the cut-off side cutting belt region R, the controller 56 (cut-mark formation controller) moves (lowers) the blade 18 in the-Z direction as indicated by an arrow a1 to cut into the cutting belt T. At this time, the position of the blade 18 in the ZX direction is adjusted so that the blade 18 does not contact the workpiece W.
Here, the adjustment of the depth of cut of the blade 18 at the position of the arrow a1 may be performed manually by observing the surface of the cut tape T visually or in real time by the imaging device 22. Further, a sensor for measuring the torque applied to the spindle 20 may be provided, and the control unit 56 may automatically adjust the depth at which the cutting mark 28(i) is formed, based on a change in the torque. In this case, data relating to the relationship between the type of the belt (e.g., material and thickness) and the torque variation may be stored in the storage unit 54, and the control unit 56 may be configured to determine the cutting depth of the blade 18 based on the data.
Next, as indicated by an arrow a2, the control unit 56 continuously moves (raises) the blade 18 in a direction (+ Z direction) away from the dicing tape T while relatively moving the blade 18 and the workpiece W in the X direction. At this time, the moving (raising) speed of the blade 18 is smaller than the moving speed of the blade 18 when it is lowered as shown by arrow a 1. The control unit 56 acquires log data on the relative position of the blade 18 and the workpiece W in the ZX direction, and stores the log data in the storage unit 54.
When the blade 18 leaves the surface of the dicing tape T as shown in fig. 17 (a), no cutting mark 28 (break) is formed as shown in fig. 17 (b). The imaging device 22 images a cutting mark vanishing point P including a cut mark 28 interruptionEThe cutting mark 28 (see fig. 5 to 7). The control unit 56 detects the cutting mark vanishing point P from the imageEGenerating a vanishing point P including and cutting markECoordinates (X) of the center of the corresponding blade 18E、ZE) The cutting mark information is stored in the storage unit 54. Then, the control unit 56 controls the cutting mark vanishing point P based on the cutting markEZ coordinate of (A)EAnd Z coordinate Z of the surface of the cutting tape TTCalculating the radius r of the blade 18B(＝|ZE-ZT|)。
Next, the control unit 56 calculates the positional relationship between the lowermost point of the blade 18 in the Z direction and the dicing tape T, and performs height control of the blade 18 based on the cutting mark information when moving to the next processing line s (i). At this time, the control unit 56 determines the radius r of the blade 18BThe height of the blade 18 is controlled so that the depth of cut into the cutting tape T is constant, along with the coordinates and thickness of the surface of the workpiece W and the coordinates of the surface of the cutting tape T.
Fig. 18 is a plan view (photograph) showing a cutting trace formed in the cut-off side dicing tape region R.
In the example shown in fig. 18, since the cutting mark forming operation is performed on the processing lines S (j × k +1) and S (j × (k +1) +1), the cutting mark 28 is clearly formed as compared with the other processing lines. Thus, the control unit 56 can easily detect the position of the cut mark 28(i) at which the cut mark is interrupted from the image.
[ cutting method ]
Next, the dicing method according to the present embodiment will be described with reference to fig. 19. Fig. 19 is a flowchart showing a dicing method according to a second embodiment of the present invention.
First, when the cutting in the first machining line S (1) is started (step S30), the controller 56 controls the height of the blade 18 (step S32). In step S32, the height of the blade 18 is controlled based on, for example, a design value of the radius of the blade 18 stored in the storage unit 54 or the radius of the blade 18 calculated by the immediately preceding cutting process.
Next, the cutting process (cutting) is performed on the processing line S (1) (step S34).
When the cutting of the machining line S (1) is completed and the blade 18 moves to the cut-off belt region R on the cut-off side, the control unit 56 performs a cutting trace forming operation (step S40). In step S40, as shown in fig. 17, the control section 56 causes the blade 18 to descend in the dicing tape region R and then successively ascend while scanning in the X direction, thereby forming the cutting mark 28. At this time, the control unit 56 generates log data of the coordinates of the blade 18 at each time and stores the log data in the storage unit 54.
Next, the imaging device 22 images the cut mark 28 formed on the cut side of the processing line S (1). The control unit 56 detects the cutting mark vanishing point P from the image in which the cutting mark 28 is capturedEAnd detecting the vanishing point P including the cutting markECutting mark information including the coordinates of (a) (b) (step S42). The control unit 56 calculates the radius r of the insert 18 based on the cutting mark informationB(step S44). Radius r of the blade 18BAnd stored in the storage unit 54.
Next, the control unit 56 starts cutting in the next processing line S (2) and moves the blade 18 to the processing line S (2) (step S46). The controller 56 controls the height of the blade 18 based on the radius of the blade 18 calculated using the cutting mark information (step S48), and performs cutting on the machining line S (2) (step S34). In step S48, the height of the blade 18 is controlled so that the depth of cut into the dicing tape T is constant.
Thereafter, steps S34 to S52 are repeated to cut the machining line after S (3). The height control of the blade 18 based on the cutting mark information is performed every j rows.
That is, when i is j × k +1(j is an integer of 1 or more, and k is an integer of 0 or more) (yes in step S38), the process proceeds to step S40, and in the cutting zone R on the cut side of the machining line S (i), the cutting mark forming operation (step S40), the cutting mark detecting operation (step S42), and the radius R of the blade 18 based on the cutting mark information are performed (step S40)BThe calculation (step S44), and the height control of the blade 18 when cutting the next processing line S (i) (steps S46 and S48). In step S44, the radius r of the blade 18 stored in the storage unit 54 is updatedB。
On the other hand, if i ≠ j × k +1 (no in step S38), after moving to the next machining line (step S50), the height of the blade 18 is controlled (step S52). In step S52, the radius r of the blade 18 stored in the storage unit 54 may be used as the basisBThe latest value of (c) to control the height of the blade 18.
When the cutting in all the machining lines S (i) is completed (yes in step S36), the processing in fig. 19 is ended.
[ Effect of the present embodiment ]
Next, the operation and effects of the present embodiment will be described.
According to the present embodiment, the height of the blade 18 is controlled based on the cutting mark information in the dicing tape region R (the surface region on the cut-off side of the non-pasted workpiece W of the dicing tape T) so that the depth of cut into the dicing tape T is constant. This makes it possible to keep the depth of the blade 18 cut into the dicing tape T relatively shallow and constant without being affected by variations in the thickness of the dicing tape T, and thus to stabilize the processing quality.
In addition, when the number of processing lines (for example, 2067 lines) is large, the amount of blade wear until the cutting processing of all the processing lines S is completed cannot be ignored. Therefore, conventionally, it is necessary to perform tool setting a plurality of times during the cutting process, measure the current blade wear amount, and adjust the height of the blade 18. In contrast, in the present embodiment, since the cutting mark forming and detecting operations are performed during the cutting of the workpiece W, the current amount of blade wear can be grasped in real time. Therefore, there is no need to frequently perform the blade wear amount measuring operation as in the conventional art, and there is an advantage that the time required for completing the cutting process can be reduced.
In the present embodiment, the cutting mark 28 is formed and detected in the cutting band region R that is the cut-off side, but the present invention is not limited to this. For example, the cutting mark forming and detecting operation may be performed in both the cutting-in side and the cutting-out side cutting band regions, or may be performed only in the cutting-in side cutting band region.
[ other embodiments ]
Fig. 20 is a schematic diagram showing the structure of a cutting apparatus 10A according to another embodiment. In fig. 20, the same components as those in fig. 1 are denoted by the same reference numerals, and the description thereof is omitted.
As shown in fig. 20, the cutting apparatus 10A according to the other embodiment includes a distance measuring device 32 in addition to the configuration of the cutting apparatus 10 according to the present embodiment.
The distance measuring device 32 is disposed at a position facing the table 12. The distance measuring device 32 measures the distance to the surface of the cutting zone region R as the object to be measured, and is configured by, for example, a laser displacement meter, an interference microscope, or the like. The measurement result of the distance measuring device 32 is output to the cut mark detecting unit 52 as distance data.
The distance measuring device 32 is fixed to a side surface of the imaging device 22 and is movable in the Y direction and the Z direction integrally with the spindle 20 and the imaging device 22.
According to this configuration, as the cut mark detection operation (first embodiment) or the cut mark formation and detection operation (second embodiment) performed during cutting of the workpiece W, the distance measuring device 32 measures the distance to the cut region R while shifting the position with respect to the cut region R in the X direction. Distance data as a measurement result of the distance measuring device 32 is output to the cut mark detecting unit 52.
The cut mark detection unit 52 generates a height map indicating a change in height (a state of unevenness) in the cutting band region R based on the distance data acquired from the distance measurement device 32.
Fig. 21 is a diagram showing an example of a height profile generated by the cut mark detector 52. As shown in fig. 21, the cut mark detection unit 52 detects, as a cut mark forming region K (a region in which the cut mark 28 is formed), a region lower than a predetermined threshold height (a height indicated by a broken line in fig. 21) in the generated height map. Then, the cut mark detection unit 52 calculates a cut mark formation rate Q based on the detected cut mark formation region K. The subsequent processing is the same as in the present embodiment.
According to the other embodiment, since the cutting mark information in the dicing tape region R (the surface region of the dicing tape T to which the workpiece W is not attached) can be detected based on the measurement result of the distance measuring device 32, the processing quality can be stabilized as in the present embodiment described above.
While one embodiment of the present invention has been described in detail, the present invention is not limited to the embodiment, and various improvements and modifications may be made without departing from the scope of the present invention.

Claims (11)

1. A cutting method for performing cutting by relatively moving a blade rotated by a spindle and a table with a workpiece held on the table via a cutting belt,
the cutting method comprises the following steps:
a forming step of forming a cutting mark in a surface area of the dicing tape to which the workpiece is not attached, and moving the blade in a direction away from the dicing tape in accordance with a relative movement between the blade and the table to form a cutting mark vanishing point;
a detection step of detecting cutting mark information including information on a position in a cutting feed direction of one of the cutting mark vanishing points formed in the forming step and a position in a cutting feed direction of the blade at the cutting mark vanishing point; and
and a control step of calculating a diameter of the blade from the cutting mark information, and controlling a height of the blade based on the diameter of the blade so that a cutting depth into the cutting zone is constant.
2. The cutting method according to claim 1,
the cutting method further includes a step of storing log data on the position of the blade at each time when the cutting mark is formed,
in the detecting step, information on a position of the cutting mark vanishing point is acquired from the log data.
3. The cutting method according to claim 1 or 2,
in the forming step, the cutting mark is formed in a cutting belt region on the cut-off side of the workpiece.
4. The cutting method according to claim 1 or 2,
the forming step and the detecting step are performed every other at least one processing line.
5. The cutting method according to claim 3,
the forming step and the detecting step are performed every other at least one processing line.
6. The cutting method according to claim 1 or 2,
the cutting mark information includes information relating to a position in the cutting feed direction of one of the cutting mark vanishing points formed in the forming step, and a position in the cutting feed direction of the center of the insert at the cutting mark vanishing point.
7. A cutting device for cutting a workpiece by relatively moving a blade rotated by a spindle and a table with the workpiece held on the table via a cutting belt,
the cutting device includes:
a cutting mark forming control unit that forms a cutting mark in a surface region of the dicing tape to which the workpiece is not attached, and forms one cutting mark vanishing point by moving the blade in a direction away from the dicing tape in accordance with relative movement of the blade and the table;
a cutting mark detection unit that detects cutting mark information including information on a position in a cutting feed direction of one of the cutting mark vanishing points formed by the cutting mark formation control unit and a position in a cutting feed direction of the blade at the cutting mark vanishing point; and
a control unit that controls the height of the blade so that the cutting depth into the cutting belt is constant, based on the cutting mark information detected by the cutting mark detection unit.
8. The cutting device of claim 7,
the cutting device is provided with a shooting device which is arranged at the opposite position of the workbench,
the cut mark detection section detects the cut mark information based on image data of a surface area of the dicing tape photographed by the photographing device.
9. The cutting device of claim 8,
the imaging device is constituted by an alignment camera.
10. The cutting device of claim 7,
the cutting device is provided with a distance measuring device arranged at the opposite position of the worktable,
the cutting mark detection unit detects the cutting mark information based on distance data measured by the distance measurement device, the distance data indicating a distance to a surface area of the dicing tape.
11. The cutting device according to any one of claims 7 to 10,
the cutting mark information includes information on a position in the cutting feed direction of one of the cutting mark vanishing points formed by the cutting mark formation control section and a position in the cutting feed direction of the center of the insert at the cutting mark vanishing point.
CN202011396997.9A 2018-02-08 2018-11-09 Cutting method and cutting device Active CN112536700B (en)

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PCT/JP2018/041727 WO2019155707A1 (en) 2018-02-08 2018-11-09 Dicing device, dicing method, and dicing tape
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