CN112536700B - 切割方法以及切割装置 - Google Patents

切割方法以及切割装置 Download PDF

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Publication number
CN112536700B
CN112536700B CN202011396997.9A CN202011396997A CN112536700B CN 112536700 B CN112536700 B CN 112536700B CN 202011396997 A CN202011396997 A CN 202011396997A CN 112536700 B CN112536700 B CN 112536700B
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China
Prior art keywords
cutting
blade
mark
cut
workpiece
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CN202011396997.9A
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English (en)
Chinese (zh)
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CN112536700A (zh
Inventor
福家朋来
清水翼
西山真生
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Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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Publication of CN112536700A publication Critical patent/CN112536700A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN202011396997.9A 2018-02-08 2018-11-09 切割方法以及切割装置 Active CN112536700B (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2018-021222 2018-02-08
JP2018021222 2018-02-08
JP2018-163615 2018-08-31
JP2018163614 2018-08-31
JP2018163615 2018-08-31
JP2018-163613 2018-08-31
JP2018-163614 2018-08-31
JP2018163613 2018-08-31
PCT/JP2018/041727 WO2019155707A1 (ja) 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法並びにダイシングテープ
CN201880088934.1A CN111699545B (zh) 2018-02-08 2018-11-09 切割装置以及切割方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201880088934.1A Division CN111699545B (zh) 2018-02-08 2018-11-09 切割装置以及切割方法

Publications (2)

Publication Number Publication Date
CN112536700A CN112536700A (zh) 2021-03-23
CN112536700B true CN112536700B (zh) 2022-04-29

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN202011396997.9A Active CN112536700B (zh) 2018-02-08 2018-11-09 切割方法以及切割装置
CN201880088934.1A Active CN111699545B (zh) 2018-02-08 2018-11-09 切割装置以及切割方法
CN202110555098.7A Active CN113290484B (zh) 2018-02-08 2018-11-09 切割装置、切割方法以及切割带

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201880088934.1A Active CN111699545B (zh) 2018-02-08 2018-11-09 切割装置以及切割方法
CN202110555098.7A Active CN113290484B (zh) 2018-02-08 2018-11-09 切割装置、切割方法以及切割带

Country Status (3)

Country Link
JP (3) JP6768185B2 (https=)
CN (3) CN112536700B (https=)
WO (1) WO2019155707A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7266398B2 (ja) * 2018-12-11 2023-04-28 株式会社ディスコ 切削装置及び切削装置を用いたウエーハの加工方法
JP7562230B2 (ja) * 2020-08-31 2024-10-07 株式会社ディスコ ウェーハの加工方法
JP2022080757A (ja) * 2020-11-18 2022-05-30 株式会社ディスコ 切削ブレードの直径測定方法
CN114057384B (zh) * 2021-12-10 2024-06-11 青岛天仁微纳科技有限责任公司 一种扫描电镜辅助定位裂片装置及使用方法
CN117301328A (zh) * 2023-10-20 2023-12-29 北京中电科电子装备有限公司 一种晶片切割装置、划膜测高方法及切割方法
CN117790294B (zh) * 2023-12-29 2026-02-06 沈阳和研科技股份有限公司 一种用于划片机的切割刀高度调整方法、装置及划片机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013041972A (ja) * 2011-08-15 2013-02-28 Disco Abrasive Syst Ltd 切削方法
CN106024709A (zh) * 2015-03-31 2016-10-12 株式会社迪思科 晶片的分割方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227557A (ja) * 1990-02-01 1991-10-08 Mitsubishi Electric Corp ダイシング装置
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP2005203540A (ja) * 2004-01-15 2005-07-28 Disco Abrasive Syst Ltd ウエーハの切削方法
JP4554265B2 (ja) * 2004-04-21 2010-09-29 株式会社ディスコ 切削ブレードの位置ずれ検出方法
JP4748643B2 (ja) * 2005-01-28 2011-08-17 株式会社ディスコ 切削ブレードの基準位置検出方法
JP4943688B2 (ja) * 2005-10-21 2012-05-30 株式会社ディスコ 切削装置
JP5340808B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5647510B2 (ja) * 2010-12-27 2014-12-24 株式会社小金井精機製作所 切削加工装置及び切削加工方法
JP6219628B2 (ja) * 2013-07-17 2017-10-25 株式会社ディスコ 切削ブレード先端形状検出方法
JP6228044B2 (ja) * 2014-03-10 2017-11-08 株式会社ディスコ 板状物の加工方法
JP2016019249A (ja) * 2014-07-11 2016-02-01 キヤノン株式会社 表示制御装置
JP2016063060A (ja) * 2014-09-18 2016-04-25 株式会社ディスコ ウエーハの加工方法
CN106334989A (zh) * 2016-11-02 2017-01-18 佛山市百思科铁芯制造有限公司 一种变压器铁芯专用切割机

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013041972A (ja) * 2011-08-15 2013-02-28 Disco Abrasive Syst Ltd 切削方法
CN106024709A (zh) * 2015-03-31 2016-10-12 株式会社迪思科 晶片的分割方法

Also Published As

Publication number Publication date
JP2020037170A (ja) 2020-03-12
JP2020037171A (ja) 2020-03-12
JP6748892B2 (ja) 2020-09-02
JP6768185B2 (ja) 2020-10-14
CN113290484B (zh) 2023-04-25
CN113290484A (zh) 2021-08-24
JP6748891B2 (ja) 2020-09-02
CN111699545B (zh) 2021-09-14
CN111699545A (zh) 2020-09-22
WO2019155707A1 (ja) 2019-08-15
CN112536700A (zh) 2021-03-23
JP2020037169A (ja) 2020-03-12

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