JP6762317B2 - 基板の面内歪みを検査する方法およびシステム - Google Patents

基板の面内歪みを検査する方法およびシステム Download PDF

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Publication number
JP6762317B2
JP6762317B2 JP2017552449A JP2017552449A JP6762317B2 JP 6762317 B2 JP6762317 B2 JP 6762317B2 JP 2017552449 A JP2017552449 A JP 2017552449A JP 2017552449 A JP2017552449 A JP 2017552449A JP 6762317 B2 JP6762317 B2 JP 6762317B2
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Prior art keywords
substrate
plane strain
state
unchucked
film stress
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Japanese (ja)
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JP2018512738A5 (enExample
JP2018512738A (ja
Inventor
マーク ディー スミス
マーク ディー スミス
ホセ ソロモン
ホセ ソロモン
スチュアート シャーウィン
スチュアート シャーウィン
ウォルター ディー ミーハー
ウォルター ディー ミーハー
アディ レヴィ
アディ レヴィ
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KLA Corp
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KLA Corp
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Publication of JP2018512738A5 publication Critical patent/JP2018512738A5/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02021—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different faces of object, e.g. opposite faces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers
    • H10P74/203—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2017552449A 2015-04-06 2016-04-06 基板の面内歪みを検査する方法およびシステム Active JP6762317B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562143708P 2015-04-06 2015-04-06
US62/143,708 2015-04-06
US15/091,021 US10024654B2 (en) 2015-04-06 2016-04-05 Method and system for determining in-plane distortions in a substrate
US15/091,021 2016-04-05
PCT/US2016/026148 WO2016164415A1 (en) 2015-04-06 2016-04-06 Method and system for determining in-plane distortions in a substrate

Publications (3)

Publication Number Publication Date
JP2018512738A JP2018512738A (ja) 2018-05-17
JP2018512738A5 JP2018512738A5 (enExample) 2019-05-16
JP6762317B2 true JP6762317B2 (ja) 2020-09-30

Family

ID=57017441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017552449A Active JP6762317B2 (ja) 2015-04-06 2016-04-06 基板の面内歪みを検査する方法およびシステム

Country Status (7)

Country Link
US (1) US10024654B2 (enExample)
JP (1) JP6762317B2 (enExample)
KR (1) KR102353250B1 (enExample)
CN (1) CN107431030B (enExample)
SG (1) SG11201708137VA (enExample)
TW (1) TWI661175B (enExample)
WO (1) WO2016164415A1 (enExample)

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JP7198912B2 (ja) * 2018-08-22 2023-01-04 エーエスエムエル ネザーランズ ビー．ブイ． 基板全体の面内ディストーション（ｉｐｄ）を決定する方法、及びコンピュータプログラム
KR102760929B1 (ko) 2019-01-21 2025-02-03 삼성전자주식회사 반도체 소자 제조 방법
TWI731760B (zh) * 2020-07-28 2021-06-21 亞亞科技股份有限公司 電路板翹曲檢測裝置
US11829077B2 (en) * 2020-12-11 2023-11-28 Kla Corporation System and method for determining post bonding overlay
CN113203357B (zh) * 2021-04-09 2022-08-09 中国科学院上海光学精密机械研究所 一种双侧斐索干涉仪检测装置
US12165930B2 (en) * 2021-06-03 2024-12-10 Kla Corporation Adaptive modeling misregistration measurement system and method
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JP2025516535A (ja) * 2022-05-13 2025-05-30 アプライド マテリアルズ インコーポレイテッド 基板曲率を使用して面外歪みを補償するためのドーズマッピング
US20250028294A1 (en) * 2023-07-18 2025-01-23 Applied Materials, Inc. Measurement of inherent substrate distortion
CN117238812B (zh) * 2023-11-10 2024-04-05 四川省农业机械科学研究院 基板翘曲测量装置及测量方法

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Also Published As

Publication number Publication date
US10024654B2 (en) 2018-07-17
CN107431030B (zh) 2020-10-09
CN107431030A (zh) 2017-12-01
KR20170136569A (ko) 2017-12-11
WO2016164415A1 (en) 2016-10-13
TW201702552A (zh) 2017-01-16
TWI661175B (zh) 2019-06-01
JP2018512738A (ja) 2018-05-17
US20160290789A1 (en) 2016-10-06
SG11201708137VA (en) 2017-11-29
KR102353250B1 (ko) 2022-01-18

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