JP6723648B2 - 位置検出装置及び位置検出方法 - Google Patents

位置検出装置及び位置検出方法 Download PDF

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Publication number
JP6723648B2
JP6723648B2 JP2016146855A JP2016146855A JP6723648B2 JP 6723648 B2 JP6723648 B2 JP 6723648B2 JP 2016146855 A JP2016146855 A JP 2016146855A JP 2016146855 A JP2016146855 A JP 2016146855A JP 6723648 B2 JP6723648 B2 JP 6723648B2
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Japan
Prior art keywords
image
substrate
corner
imaging
supported
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JP2016146855A
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English (en)
Japanese (ja)
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JP2018017562A (ja
Inventor
裕司 岡本
裕司 岡本
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP2016146855A priority Critical patent/JP6723648B2/ja
Priority to TW106123224A priority patent/TWI681265B/zh
Priority to KR1020170094735A priority patent/KR102320369B1/ko
Priority to CN201710621072.1A priority patent/CN107662415B/zh
Publication of JP2018017562A publication Critical patent/JP2018017562A/ja
Application granted granted Critical
Publication of JP6723648B2 publication Critical patent/JP6723648B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0095—Detecting means for copy material, e.g. for detecting or sensing presence of copy material or its leading or trailing end
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2016146855A 2016-07-27 2016-07-27 位置検出装置及び位置検出方法 Active JP6723648B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016146855A JP6723648B2 (ja) 2016-07-27 2016-07-27 位置検出装置及び位置検出方法
TW106123224A TWI681265B (zh) 2016-07-27 2017-07-11 位置檢測裝置及位置檢測方法
KR1020170094735A KR102320369B1 (ko) 2016-07-27 2017-07-26 위치검출장치 및 위치검출방법
CN201710621072.1A CN107662415B (zh) 2016-07-27 2017-07-27 位置检测装置及位置检测方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016146855A JP6723648B2 (ja) 2016-07-27 2016-07-27 位置検出装置及び位置検出方法

Publications (2)

Publication Number Publication Date
JP2018017562A JP2018017562A (ja) 2018-02-01
JP6723648B2 true JP6723648B2 (ja) 2020-07-15

Family

ID=61075700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016146855A Active JP6723648B2 (ja) 2016-07-27 2016-07-27 位置検出装置及び位置検出方法

Country Status (4)

Country Link
JP (1) JP6723648B2 (zh)
KR (1) KR102320369B1 (zh)
CN (1) CN107662415B (zh)
TW (1) TWI681265B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019196511A (ja) * 2018-05-08 2019-11-14 住友重機械工業株式会社 板処理装置及び板処理方法
CN113791524A (zh) * 2021-09-30 2021-12-14 深圳迈塔兰斯科技有限公司 用于超表面加工的光刻系统及方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4189820A (en) * 1978-02-21 1980-02-26 Slack Otto G Template pattern alignment
JPS6414917A (en) * 1987-07-09 1989-01-19 Canon Kk Alignment accuracy measuring mark and measuring method for accuracy using the same
JP2988680B2 (ja) * 1990-02-13 1999-12-13 株式会社東芝 変位測定装置
JP2919994B2 (ja) * 1991-04-08 1999-07-19 株式会社東芝 半導体装置
JP3352761B2 (ja) * 1993-06-01 2002-12-03 武藤工業株式会社 画像データの位置変換方法
JP3849363B2 (ja) * 1999-08-30 2006-11-22 松下電器産業株式会社 半導体チップのピックアップ方法
US6701197B2 (en) 2000-11-08 2004-03-02 Orbotech Ltd. System and method for side to side registration in a printed circuit imager
JP4768731B2 (ja) * 2005-04-28 2011-09-07 東レエンジニアリング株式会社 フリップチップ実装ずれ検査方法および実装装置
KR20100107019A (ko) * 2008-03-31 2010-10-04 후지쯔 가부시끼가이샤 면형체의 얼라이먼트 장치, 제조 장치, 면형체의 얼라이먼트 방법 및 제조 방법
JP5374909B2 (ja) 2008-04-10 2013-12-25 株式会社Ｉｈｉ マーキング装置
CN102198751A (zh) * 2010-03-23 2011-09-28 株式会社东芝 喷墨图像形成装置和喷墨图像形成方法
JP2012049326A (ja) * 2010-08-26 2012-03-08 Nsk Technology Co Ltd マスクの位置決め装置及びマスクの回転中心算出方法
JP5609513B2 (ja) 2010-10-05 2014-10-22 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
JP5554228B2 (ja) * 2010-12-28 2014-07-23 三星ダイヤモンド工業株式会社 基板加工方法
KR20160044587A (ko) * 2011-07-27 2016-04-25 스미도모쥬기가이고교 가부시키가이샤 기판제조장치 및 기판제조방법
CN103029452B (zh) * 2011-09-30 2014-12-24 北大方正集团有限公司 双面打印方法和装置
TWI421972B (zh) * 2011-12-08 2014-01-01 Metal Ind Res & Dev Ct 無標記異空間基板組裝對位方法及系統
JP5907110B2 (ja) * 2013-04-12 2016-04-20 信越化学工業株式会社 スクリーン印刷方法及びスクリーン印刷装置
JP6351992B2 (ja) * 2014-02-17 2018-07-04 株式会社Ｓｃｒｅｅｎホールディングス 変位検出装置、基板処理装置、変位検出方法および基板処理方法

Also Published As

Publication number Publication date
KR20180012710A (ko) 2018-02-06
CN107662415B (zh) 2019-10-22
KR102320369B1 (ko) 2021-11-01
TW201804266A (zh) 2018-02-01
JP2018017562A (ja) 2018-02-01
TWI681265B (zh) 2020-01-01
CN107662415A (zh) 2018-02-06

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