JPS6414917A - Alignment accuracy measuring mark and measuring method for accuracy using the same - Google Patents
Alignment accuracy measuring mark and measuring method for accuracy using the sameInfo
- Publication number
- JPS6414917A JPS6414917A JP62169809A JP16980987A JPS6414917A JP S6414917 A JPS6414917 A JP S6414917A JP 62169809 A JP62169809 A JP 62169809A JP 16980987 A JP16980987 A JP 16980987A JP S6414917 A JPS6414917 A JP S6414917A
- Authority
- JP
- Japan
- Prior art keywords
- deltax1
- pattern
- accuracy
- displacement
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To measure an accurate alignment accuracy by detecting the displacement of each corresponding repetition element of repetition pattern of first and second marks to obtain the displacement between the marks. CONSTITUTION:The alignment error of a first layer pattern 2 and a second layer pattern 3 formed on a surface 1 to be detected is calculated by intervals a1-a11 of pattern stepwise differences determined by using a signal processing, such as a threshold method, an extreme value method, etc., from detection signals S1-S11 of the differences obtained by optical and electronic methods from a section A-A. The displacement DELTAx1 of the first and second layers of the left side pattern is determined by DELTAx1={a1-(a3-a2)}/2. Similarly, the displacements of the central and right side patterns are obtained, DELTAx1-DELTAx2, DELTAx2-DELTAx3, (DELTAx1-DELTAx3)/2 are measured, these values are compared with DELTAL, an abnormal value is, if any, removed, and the magnification error alpha and alignment error DELTAx of a measuring system are obtained by minimum squaring method with the remaining measured values.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62169809A JPS6414917A (en) | 1987-07-09 | 1987-07-09 | Alignment accuracy measuring mark and measuring method for accuracy using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62169809A JPS6414917A (en) | 1987-07-09 | 1987-07-09 | Alignment accuracy measuring mark and measuring method for accuracy using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6414917A true JPS6414917A (en) | 1989-01-19 |
Family
ID=15893299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62169809A Pending JPS6414917A (en) | 1987-07-09 | 1987-07-09 | Alignment accuracy measuring mark and measuring method for accuracy using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6414917A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07153673A (en) * | 1993-11-30 | 1995-06-16 | Nec Corp | Manufacture of semiconductor device and measuring-mark pattern |
| CN107662415A (en) * | 2016-07-27 | 2018-02-06 | 住友重机械工业株式会社 | Position detecting device and method for detecting position |
-
1987
- 1987-07-09 JP JP62169809A patent/JPS6414917A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07153673A (en) * | 1993-11-30 | 1995-06-16 | Nec Corp | Manufacture of semiconductor device and measuring-mark pattern |
| CN107662415A (en) * | 2016-07-27 | 2018-02-06 | 住友重机械工业株式会社 | Position detecting device and method for detecting position |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0240020B1 (en) | A capacitance type transducer for measuring positions | |
| US4773760A (en) | Procedure and means for measuring the thickness of a film-like or sheet-like web | |
| EP1766335B1 (en) | Scale and readhead apparatus | |
| ATE142775T1 (en) | METHOD AND DEVICE FOR MEASURING THE LAYER ARRANGEMENT IN A SEMICONDUCTOR WAFER | |
| CN100527375C (en) | Testing wafer and testing method for edge bead removal | |
| WO1999021057A3 (en) | System and method for performing bulge testing of films, coatings and/or layers | |
| CA2356337A1 (en) | Web caliper measuring system | |
| US4863548A (en) | Test pattern for use monitoring variations of critical dimensions of patterns during fabrication of semiconductor devices | |
| DE68911659D1 (en) | Method for thin film thickness measurement. | |
| US4878753A (en) | Method for measuring double print offset in printing systems | |
| EP0369493A3 (en) | Method for contactless position measurement | |
| KR940012479A (en) | How to measure the dimensions of a circuit pattern | |
| JPS6414917A (en) | Alignment accuracy measuring mark and measuring method for accuracy using the same | |
| JPS634654B2 (en) | ||
| GB2138943A (en) | Dimension measuring instrument | |
| US4380395A (en) | Reduction projection aligner system | |
| KR970012022A (en) | Alignment method | |
| US4467280A (en) | System for measuring the length of a long magnetizable material | |
| EP0019941A1 (en) | Reduction projection aligner system | |
| JPH0814881A (en) | Method of calculating diameter value by use of three-dimensionally measuring unit | |
| JPS5548602A (en) | Steel rope surface unevenness detection measuring method via magnetism-sensitive element | |
| JPS552979A (en) | Vehiclesigma gradient measuring device | |
| JPS5591826A (en) | Method of exposing electronic beam | |
| JPS57196377A (en) | Pattern recognizing method | |
| JPS57147007A (en) | Method for measurement of length of continuously running material |