JP6689859B2 - 銀−金属酸化物電気接点材料の製造方法および製造装置ならびに該材料の使用 - Google Patents
銀−金属酸化物電気接点材料の製造方法および製造装置ならびに該材料の使用 Download PDFInfo
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- JP6689859B2 JP6689859B2 JP2017531394A JP2017531394A JP6689859B2 JP 6689859 B2 JP6689859 B2 JP 6689859B2 JP 2017531394 A JP2017531394 A JP 2017531394A JP 2017531394 A JP2017531394 A JP 2017531394A JP 6689859 B2 JP6689859 B2 JP 6689859B2
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- Prior art keywords
- silver
- metal oxide
- electrical contact
- solution
- contact material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 117
- 239000000463 material Substances 0.000 title claims description 54
- 229910044991 metal oxide Inorganic materials 0.000 title claims description 50
- 238000000034 method Methods 0.000 title claims description 25
- 239000000243 solution Substances 0.000 claims description 54
- 239000004332 silver Substances 0.000 claims description 43
- 229910052709 silver Inorganic materials 0.000 claims description 42
- 239000012702 metal oxide precursor Substances 0.000 claims description 24
- 239000012298 atmosphere Substances 0.000 claims description 23
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 22
- 238000001914 filtration Methods 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 239000011259 mixed solution Substances 0.000 claims description 21
- 239000002243 precursor Substances 0.000 claims description 20
- PLKATZNSTYDYJW-UHFFFAOYSA-N azane silver Chemical compound N.[Ag] PLKATZNSTYDYJW-UHFFFAOYSA-N 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 150000004706 metal oxides Chemical class 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 16
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 15
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 12
- 239000003638 chemical reducing agent Substances 0.000 claims description 12
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 11
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 239000012279 sodium borohydride Substances 0.000 claims description 8
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 8
- 239000000725 suspension Substances 0.000 claims description 8
- 229910052756 noble gas Inorganic materials 0.000 claims description 7
- 239000002244 precipitate Substances 0.000 claims description 7
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 6
- 239000011668 ascorbic acid Substances 0.000 claims description 6
- 229960005070 ascorbic acid Drugs 0.000 claims description 6
- 235000010323 ascorbic acid Nutrition 0.000 claims description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052754 neon Inorganic materials 0.000 claims description 4
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 description 14
- 238000001035 drying Methods 0.000 description 13
- 239000011787 zinc oxide Substances 0.000 description 12
- 239000005751 Copper oxide Substances 0.000 description 9
- 238000004458 analytical method Methods 0.000 description 9
- 229910000431 copper oxide Inorganic materials 0.000 description 9
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 7
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- WZSWPMDIARCYDN-UHFFFAOYSA-N copper;oxosilver Chemical compound [Ag].[Cu]=O WZSWPMDIARCYDN-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000004949 mass spectrometry Methods 0.000 description 5
- 239000004246 zinc acetate Substances 0.000 description 5
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 4
- 229910001960 metal nitrate Inorganic materials 0.000 description 4
- 239000011812 mixed powder Substances 0.000 description 4
- 229940078494 nickel acetate Drugs 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- -1 Silver ions Chemical class 0.000 description 3
- DUCFBDUJLLKKPR-UHFFFAOYSA-N [O--].[Zn++].[Ag+] Chemical compound [O--].[Zn++].[Ag+] DUCFBDUJLLKKPR-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910017937 Ag-Ni Inorganic materials 0.000 description 2
- 229910017984 Ag—Ni Inorganic materials 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000000877 morphologic effect Effects 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 239000013618 particulate matter Substances 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000007954 hypoxia Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000005551 mechanical alloying Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011085 pressure filtration Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/142—Thermal or thermo-mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
- H01H1/0237—Composite material having a noble metal as the basic material and containing oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2201/00—Treatment under specific atmosphere
- B22F2201/10—Inert gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
- H01H1/0237—Composite material having a noble metal as the basic material and containing oxides
- H01H1/02372—Composite material having a noble metal as the basic material and containing oxides containing as major components one or more oxides of the following elements only: Cd, Sn, Zn, In, Bi, Sb or Te
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2300/00—Orthogonal indexing scheme relating to electric switches, relays, selectors or emergency protective devices covered by H01H
- H01H2300/036—Application nanoparticles, e.g. nanotubes, integrated in switch components, e.g. contacts, the switch itself being clearly of a different scale, e.g. greater than nanoscale
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410768634.1 | 2014-12-12 | ||
CN201410768634.1A CN105728714B (zh) | 2014-12-12 | 2014-12-12 | 银-金属氧化物电触头材料的制备方法、装置以及应用 |
PCT/CN2015/097184 WO2016091216A1 (zh) | 2014-12-12 | 2015-12-11 | 银-金属氧化物电触头材料的制备方法、装置以及应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018505302A JP2018505302A (ja) | 2018-02-22 |
JP6689859B2 true JP6689859B2 (ja) | 2020-04-28 |
Family
ID=56106745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017531394A Active JP6689859B2 (ja) | 2014-12-12 | 2015-12-11 | 銀−金属酸化物電気接点材料の製造方法および製造装置ならびに該材料の使用 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10639722B2 (zh) |
EP (1) | EP3225333B1 (zh) |
JP (1) | JP6689859B2 (zh) |
CN (1) | CN105728714B (zh) |
WO (1) | WO2016091216A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109128213B (zh) * | 2018-08-16 | 2022-05-31 | 西安工程大学 | 一种银碳氧化锡触头合金的制备方法 |
RU2699486C1 (ru) * | 2018-11-29 | 2019-09-05 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Сибирский государственный индустриальный университет", ФГБОУ ВО "СибГИУ" | Способ нанесения электроэрозионностойких покрытий на основе оксида меди и серебра на медные электрические контакты |
JP7198855B2 (ja) | 2020-03-26 | 2023-01-04 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法、並びに導電性ペースト |
CN112609247B (zh) * | 2020-11-06 | 2022-05-10 | 东北大学 | 一种静电纺丝法制备银氧化锡电接触材料的方法 |
CN115710653B (zh) * | 2022-11-09 | 2023-08-29 | 浙江福达合金材料科技有限公司 | 银金属氧化物电触头材料的制备方法 |
CN115815587B (zh) * | 2022-12-05 | 2023-11-28 | 深圳众诚达应用材料股份有限公司 | 一种叠层片式电感内电极银浆用改性银粉及其制备方法 |
CN117102479B (zh) * | 2023-10-18 | 2024-01-02 | 佛山通宝精密合金股份有限公司 | 一种改性银氧化锡的制备工艺及其制得的改性银氧化锡 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1461176A (en) * | 1974-04-11 | 1977-01-13 | Plessey Inc | Method of producing powdered materials |
JPS62158838A (ja) * | 1985-12-30 | 1987-07-14 | Tokuriki Honten Co Ltd | 銀一酸化物系の接点材料 |
EP0645049B1 (de) * | 1992-06-10 | 1996-04-03 | DODUCO GMBH + Co Dr. Eugen DÀ¼rrwächter | Werkstoff für elektrische kontakte auf der basis von silber-zinnoxid oder silber-zinkoxid |
DE10017282C2 (de) | 2000-04-06 | 2002-02-14 | Omg Ag & Co Kg | Verfahren zur Herstellung von Verbundpulver auf Basis Siler-Zinnoxid und deren Verwendung zur Herstellung von Kontaktwerkstoffen |
WO2005037465A1 (ja) * | 2003-10-20 | 2005-04-28 | Harima Chemicals, Inc. | 乾燥粉末状の金属微粒子ならびに金属酸化物微粒子とその用途 |
CN101000828B (zh) * | 2006-01-12 | 2010-05-12 | 沈阳金纳新材料有限公司 | 一种银基电触头材料的制备方法 |
US7566437B2 (en) * | 2006-03-31 | 2009-07-28 | Umicore Ag & Co. Kg | Process for manufacture of silver-based composite powders for electrical contact materials and composite powders so produced |
JP5139659B2 (ja) * | 2006-09-27 | 2013-02-06 | Dowaエレクトロニクス株式会社 | 銀粒子複合粉末およびその製造法 |
US20080085410A1 (en) * | 2006-10-06 | 2008-04-10 | General Electric Company | Composition and associated method |
CN100552844C (zh) * | 2007-06-05 | 2009-10-21 | 桂林电器科学研究所 | 银-纳米氧化锡电触头材料的制备工艺 |
CN102142325B (zh) | 2010-12-30 | 2013-04-03 | 温州宏丰电工合金股份有限公司 | 颗粒定向排列增强银基氧化物电触头材料及其制备方法 |
CN102389981A (zh) | 2011-06-21 | 2012-03-28 | 佛山通宝精密合金股份有限公司 | 一种连续均匀化制备银氧化锡材料的方法 |
CN204842969U (zh) * | 2014-12-12 | 2015-12-09 | 施耐德电气工业公司 | 银-金属氧化物电触头材料的制备装置以及应用 |
-
2014
- 2014-12-12 CN CN201410768634.1A patent/CN105728714B/zh active Active
-
2015
- 2015-12-11 WO PCT/CN2015/097184 patent/WO2016091216A1/zh active Application Filing
- 2015-12-11 JP JP2017531394A patent/JP6689859B2/ja active Active
- 2015-12-11 US US15/534,194 patent/US10639722B2/en active Active
- 2015-12-11 EP EP15867622.1A patent/EP3225333B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10639722B2 (en) | 2020-05-05 |
EP3225333B1 (en) | 2021-02-24 |
EP3225333A4 (en) | 2018-08-29 |
CN105728714A (zh) | 2016-07-06 |
CN105728714B (zh) | 2018-12-04 |
EP3225333A1 (en) | 2017-10-04 |
JP2018505302A (ja) | 2018-02-22 |
WO2016091216A1 (zh) | 2016-06-16 |
US20170333996A1 (en) | 2017-11-23 |
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