JP6632618B2 - 実装用導電性ペースト - Google Patents

実装用導電性ペースト Download PDF

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Publication number
JP6632618B2
JP6632618B2 JP2017520223A JP2017520223A JP6632618B2 JP 6632618 B2 JP6632618 B2 JP 6632618B2 JP 2017520223 A JP2017520223 A JP 2017520223A JP 2017520223 A JP2017520223 A JP 2017520223A JP 6632618 B2 JP6632618 B2 JP 6632618B2
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Japan
Prior art keywords
epoxy resin
mass
parts
mounting
conductive paste
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JP2017520223A
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English (en)
Japanese (ja)
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JPWO2016189829A1 (ja
Inventor
梅田　裕明
裕明 梅田
和大 松田
和大 松田
健 湯川
健 湯川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
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Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of JPWO2016189829A1 publication Critical patent/JPWO2016189829A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2017520223A 2015-05-28 2016-05-17 実装用導電性ペースト Active JP6632618B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015108872 2015-05-28
JP2015108872 2015-05-28
PCT/JP2016/002411 WO2016189829A1 (ja) 2015-05-28 2016-05-17 実装用導電性ペースト

Publications (2)

Publication Number Publication Date
JPWO2016189829A1 JPWO2016189829A1 (ja) 2018-03-15
JP6632618B2 true JP6632618B2 (ja) 2020-01-22

Family

ID=57392699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017520223A Active JP6632618B2 (ja) 2015-05-28 2016-05-17 実装用導電性ペースト

Country Status (3)

Country Link
JP (1) JP6632618B2 (zh)
TW (1) TWI666657B (zh)
WO (1) WO2016189829A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6705568B1 (ja) * 2019-02-13 2020-06-03 横浜ゴム株式会社 導電性組成物
WO2020166137A1 (ja) * 2019-02-13 2020-08-20 横浜ゴム株式会社 導電性組成物
CN117106398B (zh) * 2023-08-22 2024-04-16 湖北三选科技有限公司 一种印刷用液态模封胶、芯片及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2514973B2 (ja) * 1987-05-28 1996-07-10 日東電工株式会社 半導体装置
JP2000143776A (ja) * 1998-11-12 2000-05-26 Toshiba Chem Corp 導電性ペースト
JP2001291431A (ja) * 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
JP3765731B2 (ja) * 2000-04-10 2006-04-12 住友ベークライト株式会社 ダイアタッチペースト及び半導体装置
JP2002128866A (ja) * 2000-10-20 2002-05-09 Toshiba Chem Corp 導電性ペースト
JP2002368043A (ja) * 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd 導電性ペーストとそれを用いた導電性バンプおよびその形成方法、導電性バンプの接続方法、並びに回路基板とその製造方法
JP2004186525A (ja) * 2002-12-05 2004-07-02 Sumitomo Bakelite Co Ltd エリア実装型半導体装置
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
KR20080106308A (ko) * 2006-02-27 2008-12-04 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 이것을 이용한 회로 부재의 접속 구조 및 그의 제조 방법
KR101150116B1 (ko) * 2006-04-12 2012-06-08 히다치 가세고교 가부시끼가이샤 회로 접속용 접착 필름, 회로 부재의 접속 구조 및 회로 부재의 접속 방법
JP5200340B2 (ja) * 2006-06-27 2013-06-05 住友ベークライト株式会社 液状樹脂組成物及び液状樹脂組成物を使用して作製した半導体装置
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
JP2010070605A (ja) * 2008-09-17 2010-04-02 Dic Corp 液状エポキシ樹脂組成物、硬化物、その製造方法、及びプリント配線基板用樹脂組成物
JP5650611B2 (ja) * 2011-08-23 2015-01-07 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体
KR101906644B1 (ko) * 2011-09-05 2018-10-10 나믹스 가부시끼가이샤 도전성 수지 조성물 및 그것을 사용한 경화체

Also Published As

Publication number Publication date
WO2016189829A1 (ja) 2016-12-01
TWI666657B (zh) 2019-07-21
JPWO2016189829A1 (ja) 2018-03-15
TW201711057A (zh) 2017-03-16

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