WO2016189829A1 - 実装用導電性ペースト - Google Patents

実装用導電性ペースト Download PDF

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Publication number
WO2016189829A1
WO2016189829A1 PCT/JP2016/002411 JP2016002411W WO2016189829A1 WO 2016189829 A1 WO2016189829 A1 WO 2016189829A1 JP 2016002411 W JP2016002411 W JP 2016002411W WO 2016189829 A1 WO2016189829 A1 WO 2016189829A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
mass
parts
mounting
conductive paste
Prior art date
Application number
PCT/JP2016/002411
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
梅田　裕明
和大 松田
健 湯川
Original Assignee
タツタ電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to JP2017520223A priority Critical patent/JP6632618B2/ja
Publication of WO2016189829A1 publication Critical patent/WO2016189829A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Definitions

  • the present invention relates to a conductive paste for mounting, and more particularly to a conductive paste for mounting suitable for a flip chip mounting method.
  • the chip As the electronic devices become lighter, thinner and smaller, the chip is also required to be smaller and thinner. However, if the chip is thinned, there is a problem that the chip is deformed by heat during mounting. Therefore, there is a demand for a technology that enables mounting at a low temperature.
  • Patent Document 1 discloses a flip chip mounting method using a microcapsule in which a conductive filler is coated with an insulating material.
  • the flip chip mounting method is a mounting technique in which a small amount of conductive paste applied on a transfer table is attached to bumps (electrode portions) of a semiconductor element by transfer, and fixed to a printed circuit board.
  • the flip-chip mounting method disclosed in Patent Document 1 is a method in which a resin is attached to a bump by dipping and then a microcapsule is further attached by dipping, which has a problem that the operation is complicated and the efficiency is low. Therefore, a technique for efficiently attaching a conductive paste to the bump is required.
  • the bump size and the pitch between the bumps are further miniaturized. Therefore, when transferring the conductive paste by dipping, it is difficult to transfer an appropriate amount of the conductive paste for mounting on the small bumps of the miniaturized chip, and the reliability of the joint Is required.
  • the present invention has been made in view of the above, and is a conductive paste for mounting that can be mounted at a low temperature and can ensure the reliability of the joint between the miniaturized chip and the substrate,
  • an object is to provide a conductive paste for mounting suitable for a flip chip mounting method.
  • the conductive paste for mounting according to the present invention is 10 to 50 parts by mass of a solid epoxy resin, 10 to 40 parts by mass of an acrylate monomer, and 100 parts by mass of a resin component with the balance being a liquid epoxy resin.
  • the curing agent is contained in a proportion of 0.5 to 30 parts by mass and the conductive filler is contained in a proportion of 400 to 1200 parts by mass.
  • the solid epoxy resin one or more selected from the group consisting of bisphenol A type epoxy resin, trisphenol methane type epoxy resin, and phenol novolac type epoxy resin can be used.
  • the liquid epoxy resin 1 type (s) or 2 or more types selected from the group which consists of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a glycidyl amine type epoxy resin, and a glycidyl ether type epoxy resin can be used.
  • one or more selected from the group consisting of imidazole, imidazole derivatives, and modified amines can be used.
  • the conductive filler one or more selected from the group consisting of gold, silver, and copper can be used.
  • the mounting conductive paste of the present invention mounting at a low temperature is possible, and it is possible to further improve the adhesion, conductivity and reliability of the joint portion between the chip and the substrate that have been refined in recent years. it can. Therefore, it is possible to cope with further downsizing and thinning of the chip.
  • the curing agent is 0 5 to 30 parts by mass and a conductive filler in a proportion of 400 to 1200 parts by mass.
  • solid epoxy resin refers to an epoxy resin that is solid at room temperature (25 ° C.).
  • the solid epoxy resin contains an epoxy group in the molecule and is not particularly limited as long as it is solid at room temperature. Specific examples include bisphenol A type epoxy resin, trisphenol methane type epoxy resin, phenol novolac type. An epoxy resin etc. are mentioned.
  • a solid epoxy resin can also be used individually by 1 type, and can also be used by blending 2 or more types.
  • the blending amount of the solid epoxy resin is 10 to 50 parts by mass, preferably 15 to 40 parts by mass, and more preferably 20 to 40 parts by mass. Adhesiveness and electroconductivity with a chip
  • substrate are acquired as it is 10 mass parts or more. Moreover, when it is 50 parts by mass or less, the viscosity of the conductive paste does not become too high, and the chip can be mounted without being in close contact with the transfer table during transfer.
  • acrylate monomer one having one or more reactive groups represented by the following structural formula (I) in the molecule can be used.
  • R represents H or an alkyl group, and the number of carbon atoms of the alkyl group is not particularly limited, but is usually 1 to 3.
  • acrylate monomer examples include, but are not limited to, isoamyl acrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, ditrimethylolpropane tetraacrylate, bisphenol A diglycidyl ether acrylic acid adduct, ethylene glycol dimethacrylate, 2 -Hydroxy-3-acryloyloxypropyl methacrylate, diethylene glycol dimethacrylate and the like.
  • Two or more acrylate monomers can be used in combination.
  • the total amount of the acrylate monomer is 10 to 40 parts by mass, preferably 15 to 35 parts by mass, and more preferably 20 to 30 parts by mass.
  • liquid epoxy resin refers to an epoxy resin that is liquid at room temperature (25 ° C.).
  • the liquid epoxy resin contains an epoxy group in the molecule and is not particularly limited as long as it is liquid at room temperature.
  • Specific examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, and glycidylamine epoxy. Examples thereof include resins and glycidyl ether epoxy resins.
  • a liquid epoxy resin can also be used individually by 1 type, and can also be used by blending 2 or more types.
  • the blending amount of the liquid epoxy resin is blended so that the resin component is 100 parts by mass in consideration of the blending amount of the solid epoxy resin and the acrylate monomer.
  • the curing agent used in the present invention is not particularly limited, but imidazole-based curing agents such as imidazole and imidazole derivatives, or modified amines are preferably used.
  • imidazole curing agents include imidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecyl.
  • Examples include imidazole and 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine.
  • the modified amine include epoxy adducts of various polyamines, Mannich reactants, Michael reactants, thiourea reactants, and the like.
  • the blending amount of the curing agent is 0.5 to 30 parts by mass, preferably 1 to 20 parts by mass, more preferably 3 to 15 parts by mass with respect to 100 parts by mass of the resin component.
  • the blending amount of the curing agent is 0.5 to 30 parts by mass, preferably 1 to 20 parts by mass, more preferably 3 to 15 parts by mass with respect to 100 parts by mass of the resin component.
  • the conductive filler used in the present invention is preferably one type selected from gold, silver, or copper, or two or more types, and the shape and manufacturing method are not limited.
  • metal powders made of a single metal metal powders made of two or more alloys, and those coated with these kinds of metal powders can also be used.
  • Preferred examples include silver-coated copper powder. Is mentioned.
  • the particle size of the conductive filler is not particularly limited, but the average particle size is preferably 0.5 ⁇ m to 20 ⁇ m.
  • the blending amount of the conductive filler is 400 to 1200 parts by mass, preferably 500 to 1000 parts by mass, and more preferably 600 to 800 parts by mass with respect to 100 parts by mass of the resin component. Sufficient electroconductivity is acquired as it is 400 mass parts or more. When the amount is 1200 parts by mass or less, the viscosity does not become too high, and an appropriate amount of the conductive paste for mounting can be transferred at the time of transfer, and the chip can be mounted without being in close contact with the transfer table at the time of transfer. Is possible.
  • the mounting conductive paste of the present invention can be obtained by mixing a predetermined amount of each of the above components and mixing them sufficiently.
  • additives that have been conventionally added to the same type of conductive paste can be added within a range not departing from the object of the present invention.
  • the conductive paste for mounting obtained as described above can be suitably used for flip chip mounting methods, and since it has a solid epoxy resin, it has high viscosity at low temperature, enabling mounting at low temperature, miniaturization of the chip, And it becomes possible to cope with thinning. That is, in the flip chip mounting method, when the mounting conductive paste is transferred to the bumps of the chip by dipping, it is suitable for mounting on the fine bumps of the miniaturized chip without being in close contact with the transfer stand. A sufficient amount of the conductive paste for mounting can be transferred. Therefore, it is possible to improve the adhesiveness and conductivity of a fine junction between the chip and the substrate and the reliability thereof.
  • a solid epoxy resin, a liquid epoxy resin, an acrylate monomer, a curing agent, and silver-coated copper powder were mixed to prepare a conductive paste for mounting.
  • the obtained conductive paste for mounting is thinly applied on a transfer table (not shown), and the bumps 2 of the chip 1 are dipped thereon, so that the conductive paste 3 for mounting is applied to the chip 1 as shown in FIG. Transcribed to.
  • the chip 1 was mounted on a substrate, heated at 80 ° C. for 60 minutes, further heated at 160 ° C. for 60 minutes and cured to obtain a mounting substrate.
  • Solid epoxy resin “JER157S70” manufactured by Mitsubishi Chemical Corporation ⁇ Liquid epoxy resin: Blend of “EP-4901” (80 wt%) manufactured by ADEKA Corporation and “ED502” (20 wt%) manufactured by ADEKA Corporation ⁇ Acrylate monomer: 2-hydroxy-3-acryloyloxypropyl methacrylate Curing agent A (imidazole-based curing agent): 2-ethylimidazole / curing agent B (modified amine): “Fujicure FXR-1030” manufactured by T & K TOKA CORPORATION ⁇ Silver-coated copper powder: average particle size 3 ⁇ m, spherical
  • the obtained mounting board was measured for conductivity evaluation, push strength (slip stress), and viscosity change after 24 hours by the following methods.
  • Comparative Example 1 in which the solid epoxy resin is less than 10 parts by mass, sufficient adhesion and conductivity between the substrate and the chip cannot be obtained, and in Comparative Example 2 in which the solid epoxy resin is more than 50 parts by mass, mounting is performed.
  • the conductive paste for use had a high viscosity, and the chip was in close contact with the transfer table during transfer, and could not be mounted.
  • Comparative Example 3 in which the curing agent is less than 0.5 parts by mass with respect to 100 parts by mass of the resin component, sufficient adhesion and conductivity cannot be obtained due to insufficient curing, and the Comparative Example in which more than 30 parts by mass is obtained In 4 and 5, the pot life was shortened and workability was impaired.
  • Comparative Example 6 in which the conductive filler is less than 400 parts by mass with respect to 100 parts by mass of the resin component, sufficient conductivity cannot be obtained, and in Comparative Example 7 in which the conductive filler is more than 1200 parts by mass, the mounting conductive paste Since the viscosity was high, an appropriate amount of the conductive paste for mounting could not be transferred at the time of transfer, and the chip was in close contact with the transfer table at the time of transfer and could not be mounted.

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2016/002411 2015-05-28 2016-05-17 実装用導電性ペースト WO2016189829A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017520223A JP6632618B2 (ja) 2015-05-28 2016-05-17 実装用導電性ペースト

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015108872 2015-05-28
JP2015-108872 2015-05-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6705568B1 (ja) * 2019-02-13 2020-06-03 横浜ゴム株式会社 導電性組成物
WO2020166137A1 (ja) * 2019-02-13 2020-08-20 横浜ゴム株式会社 導電性組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117106398B (zh) * 2023-08-22 2024-04-16 湖北三选科技有限公司 一种印刷用液态模封胶、芯片及其制备方法

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JP2000143776A (ja) * 1998-11-12 2000-05-26 Toshiba Chem Corp 導電性ペースト
JP2001291431A (ja) * 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
JP2002128866A (ja) * 2000-10-20 2002-05-09 Toshiba Chem Corp 導電性ペースト
JP2002184793A (ja) * 2000-04-10 2002-06-28 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2002368043A (ja) * 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd 導電性ペーストとそれを用いた導電性バンプおよびその形成方法、導電性バンプの接続方法、並びに回路基板とその製造方法
JP2004186525A (ja) * 2002-12-05 2004-07-02 Sumitomo Bakelite Co Ltd エリア実装型半導体装置
JP2008007558A (ja) * 2006-06-27 2008-01-17 Sumitomo Bakelite Co Ltd 液状樹脂組成物及び液状樹脂組成物を使用して作製した半導体装置
JP2010070605A (ja) * 2008-09-17 2010-04-02 Dic Corp 液状エポキシ樹脂組成物、硬化物、その製造方法、及びプリント配線基板用樹脂組成物
WO2013035685A1 (ja) * 2011-09-05 2013-03-14 ナミックス株式会社 導電性樹脂組成物及びそれを使用した硬化体

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JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
CN101901971B (zh) * 2006-04-12 2012-07-04 日立化成工业株式会社 电路连接用粘接膜、电路部件的连接结构以及电路部件的连接方法
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JP5650611B2 (ja) * 2011-08-23 2015-01-07 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000143776A (ja) * 1998-11-12 2000-05-26 Toshiba Chem Corp 導電性ペースト
JP2001291431A (ja) * 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
JP2002184793A (ja) * 2000-04-10 2002-06-28 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2002128866A (ja) * 2000-10-20 2002-05-09 Toshiba Chem Corp 導電性ペースト
JP2002368043A (ja) * 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd 導電性ペーストとそれを用いた導電性バンプおよびその形成方法、導電性バンプの接続方法、並びに回路基板とその製造方法
JP2004186525A (ja) * 2002-12-05 2004-07-02 Sumitomo Bakelite Co Ltd エリア実装型半導体装置
JP2008007558A (ja) * 2006-06-27 2008-01-17 Sumitomo Bakelite Co Ltd 液状樹脂組成物及び液状樹脂組成物を使用して作製した半導体装置
JP2010070605A (ja) * 2008-09-17 2010-04-02 Dic Corp 液状エポキシ樹脂組成物、硬化物、その製造方法、及びプリント配線基板用樹脂組成物
WO2013035685A1 (ja) * 2011-09-05 2013-03-14 ナミックス株式会社 導電性樹脂組成物及びそれを使用した硬化体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6705568B1 (ja) * 2019-02-13 2020-06-03 横浜ゴム株式会社 導電性組成物
WO2020166137A1 (ja) * 2019-02-13 2020-08-20 横浜ゴム株式会社 導電性組成物

Also Published As

Publication number Publication date
JPWO2016189829A1 (ja) 2018-03-15
JP6632618B2 (ja) 2020-01-22
TW201711057A (zh) 2017-03-16
TWI666657B (zh) 2019-07-21

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