JP6600353B2 - プリント回路基板およびプリント回路基板配置 - Google Patents

プリント回路基板およびプリント回路基板配置 Download PDF

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Publication number
JP6600353B2
JP6600353B2 JP2017516153A JP2017516153A JP6600353B2 JP 6600353 B2 JP6600353 B2 JP 6600353B2 JP 2017516153 A JP2017516153 A JP 2017516153A JP 2017516153 A JP2017516153 A JP 2017516153A JP 6600353 B2 JP6600353 B2 JP 6600353B2
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Japan
Prior art keywords
circuit board
printed circuit
electrically conductive
electrically
carrier
Prior art date
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Application number
JP2017516153A
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English (en)
Japanese (ja)
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JP2017530556A5 (enExample
JP2017530556A (ja
Inventor
ゴードン コンラドス，ラルフ
ハイスマン，ヘンドリク
デッペ，カルステン
グウ，シイ
ホイスラー，ゲロ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
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Koninklijke Philips NV
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Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of JP2017530556A publication Critical patent/JP2017530556A/ja
Publication of JP2017530556A5 publication Critical patent/JP2017530556A5/ja
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
JP2017516153A 2014-09-24 2015-09-24 プリント回路基板およびプリント回路基板配置 Active JP6600353B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14186224.3 2014-09-24
EP14186224 2014-09-24
PCT/EP2015/072033 WO2016046339A1 (en) 2014-09-24 2015-09-24 Printed circuit board and printed circuit board arrangement

Publications (3)

Publication Number Publication Date
JP2017530556A JP2017530556A (ja) 2017-10-12
JP2017530556A5 JP2017530556A5 (enExample) 2018-10-11
JP6600353B2 true JP6600353B2 (ja) 2019-10-30

Family

ID=51585046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017516153A Active JP6600353B2 (ja) 2014-09-24 2015-09-24 プリント回路基板およびプリント回路基板配置

Country Status (5)

Country Link
US (1) US10129986B2 (enExample)
EP (1) EP3199003B1 (enExample)
JP (1) JP6600353B2 (enExample)
CN (1) CN106717135B (enExample)
WO (1) WO2016046339A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107889355B (zh) * 2017-11-10 2020-12-01 Oppo广东移动通信有限公司 一种电路板组件以及电子设备
EP3512313A1 (de) * 2018-01-16 2019-07-17 ZKW Group GmbH Leiterplattenanordnung
CN108235597B (zh) * 2018-02-08 2024-02-23 惠州奔达电子有限公司 一种pcb的制作方法及pcb
US11122692B1 (en) * 2020-06-11 2021-09-14 Raytheon Company Preparation of solder bump for compatibility with printed electronics and enhanced via reliability
US20250149416A1 (en) * 2023-11-02 2025-05-08 Micron Technology, Inc. Semiconductor assemblies with wire-bonded traces, and methods for making the same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281627A (en) 1964-04-08 1966-10-25 Gen Electric Circuit board connecting and mounting arrangement
DE4136355A1 (de) * 1991-11-05 1993-05-06 Smt & Hybrid Gmbh, O-8010 Dresden, De Verfahren und anordnung zur dreidimensionalen montage von elektronischen bauteilen und sensoren
US5313096A (en) 1992-03-16 1994-05-17 Dense-Pac Microsystems, Inc. IC chip package having chip attached to and wire bonded within an overlying substrate
JPH081977B2 (ja) * 1993-08-16 1996-01-10 日本電気株式会社 基板の接続構造
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US5675180A (en) * 1994-06-23 1997-10-07 Cubic Memory, Inc. Vertical interconnect process for silicon segments
US6594152B2 (en) * 1999-09-30 2003-07-15 Intel Corporation Board-to-board electrical coupling with conductive band
JP2001196529A (ja) * 2000-01-17 2001-07-19 Mitsubishi Electric Corp 半導体装置及びその配線方法
NO20001360D0 (no) * 2000-03-15 2000-03-15 Thin Film Electronics Asa Vertikale elektriske forbindelser i stabel
JP2004063569A (ja) * 2002-07-25 2004-02-26 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP2004221372A (ja) * 2003-01-16 2004-08-05 Seiko Epson Corp 半導体装置、半導体モジュール、電子機器、半導体装置の製造方法および半導体モジュールの製造方法
WO2005038916A2 (en) * 2003-10-16 2005-04-28 Koninklijke Philips Electronics N.V. Inductor coil for an ic chip
DE102004063135A1 (de) 2004-12-22 2006-07-13 Endress + Hauser Gmbh + Co. Kg Leiterplatte zur Bestückung mit elektrischen und/oder elektronischen Bauteilen
JP2007027287A (ja) * 2005-07-14 2007-02-01 Renesas Technology Corp 半導体装置およびその製造方法
US8723332B2 (en) * 2007-06-11 2014-05-13 Invensas Corporation Electrically interconnected stacked die assemblies
US7906853B2 (en) * 2007-09-06 2011-03-15 Micron Technology, Inc. Package structure for multiple die stack
JP2009094432A (ja) * 2007-10-12 2009-04-30 Toshiba Corp 積層型半導体パッケージの製造方法
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
US7771206B2 (en) * 2008-09-11 2010-08-10 Qimonda Ag Horizontal dual in-line memory modules
JP5126002B2 (ja) * 2008-11-11 2013-01-23 セイコーエプソン株式会社 半導体装置及び半導体装置の製造方法
KR101053140B1 (ko) * 2009-04-10 2011-08-02 주식회사 하이닉스반도체 적층 반도체 패키지
US20100294546A1 (en) * 2009-05-22 2010-11-25 Sean Nickel Circuit board and method for a low profile wire connection
US20120075822A1 (en) 2010-09-29 2012-03-29 Pacesetter, Inc. Organic printed circuit board having reinforced edge for use with wire bonding technology
JP2014022486A (ja) * 2012-07-17 2014-02-03 Tokai Rika Co Ltd ワイヤボンディング構造、及びその製造方法

Also Published As

Publication number Publication date
CN106717135B (zh) 2019-09-27
US20180220536A1 (en) 2018-08-02
WO2016046339A1 (en) 2016-03-31
EP3199003A1 (en) 2017-08-02
JP2017530556A (ja) 2017-10-12
US10129986B2 (en) 2018-11-13
CN106717135A (zh) 2017-05-24
EP3199003B1 (en) 2021-01-06

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