JP6596860B2 - 電子デバイス、および、電子デバイスの製造方法 - Google Patents
電子デバイス、および、電子デバイスの製造方法 Download PDFInfo
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- JP6596860B2 JP6596860B2 JP2015057122A JP2015057122A JP6596860B2 JP 6596860 B2 JP6596860 B2 JP 6596860B2 JP 2015057122 A JP2015057122 A JP 2015057122A JP 2015057122 A JP2015057122 A JP 2015057122A JP 6596860 B2 JP6596860 B2 JP 6596860B2
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Description
本発明の電子デバイスは、上記目的を達成するために提案されたものであり、駆動素子および当該駆動素子の駆動に係る配線が設けられた駆動基板と、
前記駆動素子、前記配線、および接合樹脂を介在させて前記駆動基板と間隔を空けて設けられた積層体と、
を備える電子デバイスであって、
前記配線は、金(Au)を含む配線金属が前記駆動基板に下地層を介して形成されてなり、
前記配線金属の一部を除去することで露出した前記下地層の一部において、前記露出した下地層は、前記接合樹脂で覆われた部分と前記接合樹脂で覆われない部分とを有することを特徴とする。
また、手段1の構成において、前記接合樹脂で覆われた部分と前記接合樹脂で覆われない部分とからなる前記下地層の一部である配線金属除去領域は、平面視において、前記配線金属に囲まれている構成を採用することが望ましい。
また、手段1または手段2の構成において、前記配線金属除去領域の配線方向の寸法は、前記接合樹脂が当該下地層と接合した部分の前記配線方向の幅よりも大きい構成を採用することが望ましい。
また、上記手段1から手段3の何れか一の構成に関し、前記配線金属除去領域が、前記接合樹脂と化学結合する官能基を有する有機分子により表面処理されている構成を採用することが望ましい。
また、上記手段1から手段4の何れか一の構成に関し、前記接合樹脂がエポキシ基を有し、前記有機分子がアミノ基を有する構成を採用することができる。
また、上記手段1から手段5の何れか一の構成に関し、前記下地層が、Auとは異なる金属である構成を採用することが望ましい。
そして、本発明の電子デバイスの製造方法は、駆動素子および当該駆動素子の駆動に係る配線が形成された駆動基板と、前記駆動素子、前記配線、および接合樹脂を介在させて前記駆動基板と間隔を空けて接合された積層体と、を備える電子デバイスの製造方法であって、
前記駆動基板に下地層を形成する工程と、
前記下地層に重ねて、金(Au)を含む配線金属を形成し配線を形成する工程と、
前記配線金属の一部を除去し前記下地層を露出する工程と、
前記駆動基板と前記積層体との間に前記接合樹脂を挟み、前記下地層が露出した部分に該接合樹脂が接着される状態で、前記駆動基板と前記積層体とを接合する工程と、
を含むことを特徴とする。
また、上記目的を達成するために提案される本発明の電子デバイスは、以下の構成を備えたものであってもよい。
すなわち、駆動素子および当該駆動素子の駆動に係る第1の配線が設けられた駆動基板と、
前記駆動素子、前記第1の配線、および接合樹脂を介在させて前記駆動基板と間隔を空けて設けられ、前記駆動素子の駆動に係る第2の配線が設けられた積層体と、
を備える電子デバイスであって、
前記第1の配線は、金(Au)を含む第1の配線金属が前記駆動基板に第1の下地層を介して形成されてなり、
前記第2の配線は、金(Au)を含む第2の配線金属が前記積層体に第2の下地層を介して形成されてなり、
前記第1の配線金属は、前記第1の下地層が露出した第1の除去部を有し、
前記露出した第1の下地層は、前記接合樹脂で覆われた部分と、前記接合樹脂で覆われていない部分とを有し、
前記第2の配線金属の一部は、前記第2の下地層が露出した第2の除去部を有し、
前記露出した第2の下地層は、前記接合樹脂で覆われた部分と、前記接合樹脂で覆われていない部分とを有し、
前記第1の除去部及び前記第2の除去部は、それぞれ前記接合樹脂がパターニングされた位置に形成されたことを特徴とする。
上記構成によれば、接合樹脂との接着性が劣るAuを含む配線金属が除去されて露出した下地層に接合樹脂が接合されることで、駆動基板と積層体との接合強度をより強固にすることができ、接着信頼性を高めることが可能となる。特に、Auを主とする配線金属からなる配線がより高い密度で形成された構成に本発明は好適である。
上記構成において、平面視において、前記第1の除去部は前記第1の配線金属で囲まれ、前記第2の除去部は前記第2の配線金属で囲まれている構成を採用することが望ましい。
この構成によれば、平面視において、第1の除去部は第1の配線金属で囲まれ、第2の除去部は第2の配線金属で囲まれていることで、この部分における電気抵抗が上昇することが抑制され、導通を確保することができる。
また、上記何れかの構成において、前記第1の除去部の配線方向の寸法は、前記接合樹脂が前記第1の下地層と接合した部分の前記配線方向の幅よりも大きく、前記第2の除去部の配線方向の寸法は、前記接合樹脂が前記第2の下地層と接合した部分の前記配線方向の幅よりも大きい構成を採用することが望ましい。
この構成によれば、第1の除去部の配線方向の寸法は、接合樹脂が第1の下地層と接合した部分の配線方向の幅よりも大きく、第2の除去部の配線方向の寸法は、接合樹脂が第2の下地層と接合した部分の配線方向の幅よりも大きく設定されることで、接合樹脂と各下地層との接合をより確実にすることができる。
さらに、何れか一の構成に関し、前記第1の除去部及び前記第2の除去部が、前記接合樹脂と化学結合する官能基を有する有機分子により表面処理されている構成を採用することが望ましい。
この構成によれば、第1の除去部及び第2の除去部を表面処理することにより、当該部分における単位面積当たりの結合サイトが増加し、接合樹脂に対する接着強度をより増加させることができる。
また、何れか一の構成に関し、前記接合樹脂がエポキシ基を有し、前記有機分子がアミノ基を有する構成を採用することができる。
また、上記何れか一の構成に関し、前記第1の下地層及び前記第2の下地層が、Auとは異なる金属である構成を採用することが望ましい。
この構成によれば、第1の下地層及び第2の下地層がAuと異なる金属であれば、接合樹脂との接合強度を確保することができることに加え、配線材料としても機能するため、導電性を確保して電気抵抗を低く抑えることができる。
そして、本発明の電子デバイスの製造方法は、駆動素子および当該駆動素子の駆動に係る第1の配線が形成された駆動基板と、前記駆動素子、前記第1の配線、および接合樹脂を介在させて前記駆動基板と間隔を空けて接合され、前記駆動素子の駆動に係る第2の配線が設けられた積層体と、を備える電子デバイスの製造方法であって、
前記駆動基板に第1の下地層を形成する工程と、
前記第1の下地層に重ねて金(Au)を含む配線金属を形成し第1の配線を形成する工程と、
前記配線金属の一部を除去し前記第1の下地層を露出する工程と、
前記積層体に第2の下地層を形成する工程と、
前記第2の下地層に重ねて金(Au)を含む配線金属を形成し第2の配線を形成する工程と、
前記配線金属の一部を除去し前記第2の下地層を露出する工程と、
前記駆動基板と前記積層体との間にパターニングされた前記接合樹脂を挟み、前記第1の下地層及び前記第2の下地層が露出した部分に該接合樹脂が接着される状態で、前記駆動基板と前記積層体とを接合する工程と、
を含むことを特徴とする。
Claims (7)
- 駆動素子および当該駆動素子の駆動に係る第1の配線が設けられた駆動基板と、
前記駆動素子、前記第1の配線、および接合樹脂を介在させて前記駆動基板と間隔を空けて設けられ、前記駆動素子の駆動に係る第2の配線が設けられた積層体と、
を備える電子デバイスであって、
前記第1の配線は、金(Au)を含む第1の配線金属が前記駆動基板に第1の下地層を介して形成されてなり、
前記第2の配線は、金(Au)を含む第2の配線金属が前記積層体に第2の下地層を介して形成されてなり、
前記第1の配線金属は、前記第1の下地層が露出した第1の除去部を有し、
前記露出した第1の下地層は、前記接合樹脂で覆われた部分と、前記接合樹脂で覆われていない部分とを有し、
前記第2の配線金属の一部は、前記第2の下地層が露出した第2の除去部を有し、
前記露出した第2の下地層は、前記接合樹脂で覆われた部分と、前記接合樹脂で覆われていない部分とを有し、
前記第1の除去部及び前記第2の除去部は、それぞれ前記接合樹脂がパターニングされた位置に形成されたことを特徴とする電子デバイス。 - 平面視において、前記第1の除去部は前記第1の配線金属で囲まれ、前記第2の除去部は前記第2の配線金属で囲まれていることを特徴とする請求項1に記載の電子デバイス。
- 前記第1の除去部の配線方向の寸法は、前記接合樹脂が前記第1の下地層と接合した部分の前記配線方向の幅よりも大きく、前記第2の除去部の配線方向の寸法は、前記接合樹脂が前記第2の下地層と接合した部分の前記配線方向の幅よりも大きいことを特徴とする請求項1または請求項2に記載の電子デバイス。
- 前記第1の除去部及び前記第2の除去部が、前記接合樹脂と化学結合する官能基を有する有機分子により表面処理されていることを特徴とする請求項1から請求項3の何れか一項に記載の電子デバイス。
- 前記接合樹脂がエポキシ基を有し、前記有機分子がアミノ基を有することを特徴とする請求項4に記載の電子デバイス。
- 前記第1の下地層及び前記第2の下地層が、Auとは異なる金属であることを特徴とする請求項1から請求項5の何れか一項に記載の電子デバイス。
- 駆動素子および当該駆動素子の駆動に係る第1の配線が形成された駆動基板と、前記駆動素子、前記第1の配線、および接合樹脂を介在させて前記駆動基板と間隔を空けて接合され、前記駆動素子の駆動に係る第2の配線が設けられた積層体と、を備える電子デバイスの製造方法であって、
前記駆動基板に第1の下地層を形成する工程と、
前記第1の下地層に重ねて金(Au)を含む配線金属を形成し第1の配線を形成する工程と、
前記配線金属の一部を除去し前記第1の下地層を露出する工程と、
前記積層体に第2の下地層を形成する工程と、
前記第2の下地層に重ねて金(Au)を含む配線金属を形成し第2の配線を形成する工程と、
前記配線金属の一部を除去し前記第2の下地層を露出する工程と、
前記駆動基板と前記積層体との間にパターニングされた前記接合樹脂を挟み、前記第1の下地層及び前記第2の下地層が露出した部分に該接合樹脂が接着される状態で、前記駆動基板と前記積層体とを接合する工程と、
を含むことを特徴とする電子デバイスの製造方法。
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