JP2016162999A - 電子デバイス、及び、電子デバイスの製造方法 - Google Patents
電子デバイス、及び、電子デバイスの製造方法 Download PDFInfo
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- JP2016162999A JP2016162999A JP2015043353A JP2015043353A JP2016162999A JP 2016162999 A JP2016162999 A JP 2016162999A JP 2015043353 A JP2015043353 A JP 2015043353A JP 2015043353 A JP2015043353 A JP 2015043353A JP 2016162999 A JP2016162999 A JP 2016162999A
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Abstract
Description
前記第1の基板に前記第1の感光性接着剤を形成する第1の工程と、
前記第1の感光性接着剤に重ねて当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を設ける第2の工程と、
前記第1の基板と前記第2の基板との間に前記第1の感光性接着剤及び前記第2の感光性接着剤を挟んだ状態で、加熱により前記第2の感光性接着剤を硬化させて、前記第1の基板と前記第2の基板とを接合する接合工程と、を含むことを特徴とする。
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程を含み、
前記接合工程は、前記第2の感光性接着剤と前記第3の感光性接着剤とを密着させた状態で、加熱により前記第2の感光性接着剤を硬化させることが望ましい。
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程と、
前記第3の感光性接着剤に重ねて第2の感光性接着剤を設ける第4の工程と、を含み、
前記接合工程は、前記第1の基板に設けられた第2の感光性接着剤と前記第2の基板に設けられた第2の感光性接着剤とを密着させた状態で、加熱により両方の第2の感光性接着剤を硬化させることが望ましい。
当該第1の基板に形成された第1の感光性接着剤と、
当該第1の感光性接着剤に重ねて設けられた第2の感光性接着剤と、
前記第1の感光性接着剤及び前記第2の感光性接着剤を介在させた状態で前記第1の基板に接合された第2の基板と、を備え、
前記第2の感光性接着剤は、前記第1の基板と前記第2の基板との間において、少なくとも一部が前記第1の感光性接着剤よりも外側に膨らんで形成されたことを特徴とする。
Claims (5)
- 第1の基板と、第1の感光性接着剤及び第2の感光性接着剤を介在させた状態で前記第1の基板に接合された第2の基板と、を備えた電子デバイスの製造方法であって、
前記第1の基板に前記第1の感光性接着剤を形成する第1の工程と、
前記第1の感光性接着剤に重ねて当該第1の感光性接着剤よりも硬化度が低い第2の感光性接着剤を設ける第2の工程と、
前記第1の基板と前記第2の基板との間に前記第1の感光性接着剤及び前記第2の感光性接着剤を挟んだ状態で、加熱により前記第2の感光性接着剤を硬化させて、前記第1の基板と前記第2の基板とを接合する接合工程と、を含むことを特徴とする電子デバイスの製造方法。 - 前記第2の感光性接着剤と前記第2の基板との間に第3の感光性接着剤を介在させた電子デバイスの製造方法であって、
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程を含み、
前記接合工程は、前記第2の感光性接着剤と前記第3の感光性接着剤とを密着させた状態で、加熱により前記第2の感光性接着剤を硬化させることを特徴とする請求項1に記載の電子デバイスの製造方法。 - 前記第2の感光性接着剤と前記第2の基板との間に第3の感光性接着剤を介在させた電子デバイスの製造方法であって、
前記第2の基板に前記第2の感光性接着剤よりも硬化度が高い前記第3の感光性接着剤を形成する第3の工程と、
前記第3の感光性接着剤に重ねて第2の感光性接着剤を設ける第4の工程と、を含み、
前記接合工程は、前記第1の基板に設けられた第2の感光性接着剤と前記第2の基板に設けられた第2の感光性接着剤とを密着させた状態で、加熱により両方の第2の感光性接着剤を硬化させることを特徴とする請求項1に記載の電子デバイスの製造方法。 - 第1の基板と、
当該第1の基板に形成された第1の感光性接着剤と、
当該第1の感光性接着剤に重ねて設けられた第2の感光性接着剤と、
前記第1の感光性接着剤及び前記第2の感光性接着剤を介在させた状態で前記第1の基板に接合された第2の基板と、を備え、
前記第2の感光性接着剤は、前記第1の基板と前記第2の基板との間において、少なくとも一部が前記第1の感光性接着剤よりも外側に膨らんで形成されたことを特徴とする電子デバイス。 - 前記第2の感光性接着剤と前記第2の基板との間に第3の感光性接着剤を備えたことを特徴とする請求項4に記載の電子デバイス。
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