JP6584886B2 - 分割方法 - Google Patents
分割方法 Download PDFInfo
- Publication number
- JP6584886B2 JP6584886B2 JP2015180931A JP2015180931A JP6584886B2 JP 6584886 B2 JP6584886 B2 JP 6584886B2 JP 2015180931 A JP2015180931 A JP 2015180931A JP 2015180931 A JP2015180931 A JP 2015180931A JP 6584886 B2 JP6584886 B2 JP 6584886B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- line
- objects
- dividing
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
- B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Description
図1は、実施形態1に係る分割方法のフロー図である。図2は、実施形態1に係る分割方法を実施するレーザー加工装置の構成例を示す斜視図である。図3は、実施形態1に係る分割方法で分割される板状物を示す平面図である。図4は、図3中の板状物を拡大して示す部分拡大平面図である。
実施形態2について説明する。実施形態2では、検出ステップS2及び分割ステップS3の他の態様について説明する。実施形態2では、レーザー加工ラインL毎に、検出ステップS2と分割ステップS3とを実行する。
10 チャックテーブル
20 レーザー光線照射手段
30 検出手段
100 制御手段
B 板状物
D デバイス
F 環状フレーム
Fo 開口部
L レーザー加工ライン
S 分割予定ライン
T 接着テープ
Ta 表面
Claims (1)
- 分割予定ラインによって複数のデバイスが少なくとも1列に所定数区画され形成された短冊状の板状物を個々のデバイスに分割する分割方法であって、
板状物を複数収容する開口部を有する環状フレームに接着テープを貼着して、該開口部に複数の短冊状の板状物の短辺側を互いに所定間隔離間し整列させて該接着テープの表面に貼着する板状物貼着ステップと、
該板状物貼着ステップを実施した後に、複数の短冊状の板状物が貼着された該環状フレームをレーザー加工装置のチャックテーブルに保持し、板状物毎に分割予定ラインの位置及び角度を検出手段により検出する検出ステップと、
該検出ステップを実施した後に、レーザー光線照射手段にて該板状物に対して吸収性を有する波長のレーザー光線を、該検出ステップで検出した該位置及び角度情報に基づき該チャックテーブルと該レーザー光線照射手段とを各短冊状の板状物毎に微調整しつつ相対的に加工送りし、該分割予定ラインに沿って複数の板状物を複数のデバイスに分割する分割ステップと、
を含み、
該検出ステップでは、複数の板状物の加工送り方向に並ぶ分割予定ラインの各点の位置と、複数の板状物の加工送り方向に並ぶ各板状物の分割予定ラインの加工送り方向に対する傾きとを算出し、複数の板状物の加工送り方向に並ぶ分割予定ラインの各点を通りかつ複数の板状物の加工送り方向に並ぶ分割予定ラインを結ぶレーザー加工ラインを作成し、
該分割ステップでは、該レーザー加工ラインに基づき、該チャックテーブルと該レーザー光線照射手段との相対位置を各板状物毎に微調整しつつ相対的に加工送りし、該レーザー光線を該レーザー加工ラインに沿って照射して、該レーザー加工ラインに沿って複数の板状物を複数のデバイスに分割する
ことを特徴とする分割方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015180931A JP6584886B2 (ja) | 2015-09-14 | 2015-09-14 | 分割方法 |
TW105124994A TWI693981B (zh) | 2015-09-14 | 2016-08-05 | 板狀物的分割方法 |
US15/264,031 US9685378B2 (en) | 2015-09-14 | 2016-09-13 | Method of dividing plate-shaped workpieces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015180931A JP6584886B2 (ja) | 2015-09-14 | 2015-09-14 | 分割方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017059585A JP2017059585A (ja) | 2017-03-23 |
JP6584886B2 true JP6584886B2 (ja) | 2019-10-02 |
Family
ID=58259970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015180931A Active JP6584886B2 (ja) | 2015-09-14 | 2015-09-14 | 分割方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9685378B2 (ja) |
JP (1) | JP6584886B2 (ja) |
TW (1) | TWI693981B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110860813B (zh) * | 2019-12-24 | 2021-11-19 | 安徽镭科智能科技有限公司 | 一种激光切割机切割用物料固定装置 |
JP7399576B2 (ja) | 2020-04-03 | 2023-12-18 | 株式会社ディスコ | アライメントマークの設定方法及び加工装置 |
CN114535816B (zh) * | 2022-04-18 | 2023-12-12 | 国电投新能源科技(龙港)有限公司 | 一种太阳能电池片处理装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0857846A (ja) * | 1994-08-19 | 1996-03-05 | Hitachi Ltd | ダイヤモンド・ポイントスクライブ装置 |
US6267282B1 (en) * | 1999-04-01 | 2001-07-31 | Agere Systems Optoelectronics Guardian Corp. | Method and apparatus for handling laser bars |
JP2003086542A (ja) | 2001-09-11 | 2003-03-20 | Sharp Corp | 半導体レーザー素子の素子分割方法およびその方法を利用する素子分割装置 |
JP4658589B2 (ja) * | 2004-12-28 | 2011-03-23 | Okiセミコンダクタ株式会社 | 半導体装置の製造方法 |
JP4774928B2 (ja) * | 2005-11-07 | 2011-09-21 | 日亜化学工業株式会社 | 半導体素子の製造方法 |
US20070236591A1 (en) * | 2006-04-11 | 2007-10-11 | Tam Samuel W | Method for mounting protective covers over image capture devices and devices manufactured thereby |
JP4927484B2 (ja) * | 2006-09-13 | 2012-05-09 | 株式会社ディスコ | 積層用デバイスの製造方法 |
JP2009146949A (ja) * | 2007-12-11 | 2009-07-02 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP5118580B2 (ja) * | 2008-08-22 | 2013-01-16 | 株式会社ディスコ | 高さ位置検出装置および高さ位置検出方法 |
US20100207227A1 (en) * | 2009-02-16 | 2010-08-19 | Georg Meyer-Berg | Electronic Device and Method of Manufacturing Same |
JP5573192B2 (ja) * | 2010-01-22 | 2014-08-20 | 三菱電機株式会社 | 半導体装置の製造方法 |
US10052718B2 (en) * | 2011-02-10 | 2018-08-21 | Honda Motor Co., Ltd. | Cylindrical workpiece cutting apparatus |
JP5879063B2 (ja) * | 2011-07-26 | 2016-03-08 | 株式会社ディスコ | 溝アライメント方法 |
JP2014124646A (ja) * | 2012-12-25 | 2014-07-07 | Disco Abrasive Syst Ltd | レーザ加工方法および微粒子層形成剤 |
-
2015
- 2015-09-14 JP JP2015180931A patent/JP6584886B2/ja active Active
-
2016
- 2016-08-05 TW TW105124994A patent/TWI693981B/zh active
- 2016-09-13 US US15/264,031 patent/US9685378B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017059585A (ja) | 2017-03-23 |
TW201711797A (zh) | 2017-04-01 |
TWI693981B (zh) | 2020-05-21 |
US20170076985A1 (en) | 2017-03-16 |
US9685378B2 (en) | 2017-06-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5122378B2 (ja) | 板状物の分割方法 | |
JP6465722B2 (ja) | 加工装置 | |
JP6757185B2 (ja) | レーザー光線の検査方法 | |
JP2009184002A (ja) | レーザ加工方法 | |
KR102448222B1 (ko) | 레이저 가공 방법 | |
TWI821500B (zh) | 被加工物的切割方法 | |
JP6584886B2 (ja) | 分割方法 | |
TW202109651A (zh) | 加工裝置及被加工物的加工方法 | |
JP2014203917A (ja) | 板状物 | |
JP2020088068A (ja) | 被加工物の加工方法 | |
JP6422355B2 (ja) | アライメント方法 | |
JP2012151225A (ja) | 切削溝の計測方法 | |
JP5846764B2 (ja) | ウエーハの加工方法 | |
JP4436641B2 (ja) | 切削装置におけるアライメント方法 | |
JP5372429B2 (ja) | 板状物の分割方法 | |
JP6890890B2 (ja) | ウェーハの加工方法 | |
JP2012125781A (ja) | 加工方法 | |
JP6486230B2 (ja) | アライメント方法 | |
JP7269090B2 (ja) | 被加工物の分割方法 | |
TWI834663B (zh) | 被加工物之加工方法 | |
JP2013062429A (ja) | 被加工物の切削方法 | |
TW202129805A (zh) | 加工裝置 | |
JP6968693B2 (ja) | 加工装置 | |
JP2022035060A (ja) | 被加工物の加工方法 | |
JP2017050377A (ja) | ウエーハの加工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151014 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20151014 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180724 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190313 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190319 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190514 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190820 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190904 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6584886 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |