JP2017059585A - 分割方法 - Google Patents
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- 238000003754 machining Methods 0.000 description 2
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
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- 239000010980 sapphire Substances 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
- B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
【解決手段】環状フレームFに接着テープTを貼着して、開口部Foに複数の短冊状の板状物Bの短辺側を互いに所定間隔離間し整列させて接着テープTの表面Taに貼着する板状物貼着ステップS1と、板状物貼着ステップS1の後に、複数の短冊状の板状物Bが貼着された環状フレームFをチャックテーブル10に保持し、板状物B毎に分割予定ラインSの位置及び角度を検出手段30により検出する検出ステップS2と、検出ステップS2の後に、レーザー光線照射手段20によって板状物Bに対して吸収性を有する波長のレーザー光線を、検出ステップS2で検出した位置及び角度情報に基づきチャックテーブル10とレーザー光線照射手段20とを各短冊状の板状物B毎に微調整しつつ相対的に加工送りし、分割予定ラインSに沿って複数の板状物Bを複数のデバイスDに分割する分割ステップS3と、を含む。
【選択図】図1
Description
図1は、実施形態1に係る分割方法のフロー図である。図2は、実施形態1に係る分割方法を実施するレーザー加工装置の構成例を示す斜視図である。図3は、実施形態1に係る分割方法で分割される板状物を示す平面図である。図4は、図3中の板状物を拡大して示す部分拡大平面図である。
実施形態2について説明する。実施形態2では、検出ステップS2及び分割ステップS3の他の態様について説明する。実施形態2では、レーザー加工ラインL毎に、検出ステップS2と分割ステップS3とを実行する。
10 チャックテーブル
20 レーザー光線照射手段
30 検出手段
100 制御手段
B 板状物
D デバイス
F 環状フレーム
Fo 開口部
L レーザー加工ライン
S 分割予定ライン
T 接着テープ
Ta 表面
Claims (1)
- 分割予定ラインによって複数のデバイスが少なくとも1列に所定数区画され形成された短冊状の板状物を個々のデバイスに分割する分割方法であって、
板状物を複数収容する開口部を有する環状フレームに接着テープを貼着して、該開口部に複数の短冊状の板状物の短辺側を互いに所定間隔離間し整列させて該接着テープの表面に貼着する板状物貼着ステップと、
該板状物貼着ステップを実施した後に、複数の短冊状の板状物が貼着された該環状フレームをレーザー加工装置のチャックテーブルに保持し、板状物毎に分割予定ラインの位置及び角度を検出手段により検出する検出ステップと、
該検出ステップを実施した後に、レーザー光線照射手段にて該板状物に対して吸収性を有する波長のレーザー光線を、該検出ステップで検出した該位置及び角度情報に基づき該チャックテーブルと該レーザー光線照射手段とを各短冊状の板状物毎に微調整しつつ相対的に加工送りし、該分割予定ラインに沿って複数の板状物を複数のデバイスに分割する分割ステップと、
を含むことを特徴とする分割方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2015180931A JP6584886B2 (ja) | 2015-09-14 | 2015-09-14 | 分割方法 |
TW105124994A TWI693981B (zh) | 2015-09-14 | 2016-08-05 | 板狀物的分割方法 |
US15/264,031 US9685378B2 (en) | 2015-09-14 | 2016-09-13 | Method of dividing plate-shaped workpieces |
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JP2015180931A JP6584886B2 (ja) | 2015-09-14 | 2015-09-14 | 分割方法 |
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JP2017059585A true JP2017059585A (ja) | 2017-03-23 |
JP6584886B2 JP6584886B2 (ja) | 2019-10-02 |
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JP (1) | JP6584886B2 (ja) |
TW (1) | TWI693981B (ja) |
Cited By (1)
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JP7399576B2 (ja) | 2020-04-03 | 2023-12-18 | 株式会社ディスコ | アライメントマークの設定方法及び加工装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110860813B (zh) * | 2019-12-24 | 2021-11-19 | 安徽镭科智能科技有限公司 | 一种激光切割机切割用物料固定装置 |
CN114535816B (zh) * | 2022-04-18 | 2023-12-12 | 国电投新能源科技(龙港)有限公司 | 一种太阳能电池片处理装置 |
Citations (6)
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JPH0857846A (ja) * | 1994-08-19 | 1996-03-05 | Hitachi Ltd | ダイヤモンド・ポイントスクライブ装置 |
US6267282B1 (en) * | 1999-04-01 | 2001-07-31 | Agere Systems Optoelectronics Guardian Corp. | Method and apparatus for handling laser bars |
JP2007129143A (ja) * | 2005-11-07 | 2007-05-24 | Nichia Chem Ind Ltd | 半導体素子の製造方法 |
JP2009146949A (ja) * | 2007-12-11 | 2009-07-02 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2011151258A (ja) * | 2010-01-22 | 2011-08-04 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JP2013026595A (ja) * | 2011-07-26 | 2013-02-04 | Disco Abrasive Syst Ltd | 溝アライメント方法 |
Family Cites Families (8)
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JP2003086542A (ja) | 2001-09-11 | 2003-03-20 | Sharp Corp | 半導体レーザー素子の素子分割方法およびその方法を利用する素子分割装置 |
JP4658589B2 (ja) * | 2004-12-28 | 2011-03-23 | Okiセミコンダクタ株式会社 | 半導体装置の製造方法 |
US20070236591A1 (en) * | 2006-04-11 | 2007-10-11 | Tam Samuel W | Method for mounting protective covers over image capture devices and devices manufactured thereby |
JP4927484B2 (ja) * | 2006-09-13 | 2012-05-09 | 株式会社ディスコ | 積層用デバイスの製造方法 |
JP5118580B2 (ja) * | 2008-08-22 | 2013-01-16 | 株式会社ディスコ | 高さ位置検出装置および高さ位置検出方法 |
US20100207227A1 (en) * | 2009-02-16 | 2010-08-19 | Georg Meyer-Berg | Electronic Device and Method of Manufacturing Same |
US10052718B2 (en) * | 2011-02-10 | 2018-08-21 | Honda Motor Co., Ltd. | Cylindrical workpiece cutting apparatus |
JP2014124646A (ja) * | 2012-12-25 | 2014-07-07 | Disco Abrasive Syst Ltd | レーザ加工方法および微粒子層形成剤 |
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- 2015-09-14 JP JP2015180931A patent/JP6584886B2/ja active Active
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2016
- 2016-08-05 TW TW105124994A patent/TWI693981B/zh active
- 2016-09-13 US US15/264,031 patent/US9685378B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0857846A (ja) * | 1994-08-19 | 1996-03-05 | Hitachi Ltd | ダイヤモンド・ポイントスクライブ装置 |
US6267282B1 (en) * | 1999-04-01 | 2001-07-31 | Agere Systems Optoelectronics Guardian Corp. | Method and apparatus for handling laser bars |
JP2007129143A (ja) * | 2005-11-07 | 2007-05-24 | Nichia Chem Ind Ltd | 半導体素子の製造方法 |
JP2009146949A (ja) * | 2007-12-11 | 2009-07-02 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2011151258A (ja) * | 2010-01-22 | 2011-08-04 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JP2013026595A (ja) * | 2011-07-26 | 2013-02-04 | Disco Abrasive Syst Ltd | 溝アライメント方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7399576B2 (ja) | 2020-04-03 | 2023-12-18 | 株式会社ディスコ | アライメントマークの設定方法及び加工装置 |
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Publication number | Publication date |
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TWI693981B (zh) | 2020-05-21 |
TW201711797A (zh) | 2017-04-01 |
JP6584886B2 (ja) | 2019-10-02 |
US20170076985A1 (en) | 2017-03-16 |
US9685378B2 (en) | 2017-06-20 |
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